Abstract: An isolator device and a corresponding method of forming the isolator device to include first and second electrodes, a layer of first dielectric material between the first and second electrodes, and at least one region of second dielectric material between the layer of first dielectric material and at least one of the first and second electrodes. The second dielectric material has a higher relative permittivity than the first dielectric material.

Abstract: Radio frequency (RF) isolators are described, coupling circuit domains operating at different voltages. The RF isolator may include a transmitter which emits a directional signal toward a receiver. Layers of materials having different dielectric constants may be arranged to confine the emission along a path to the receiver. The emitter may be an antenna having an aperture facing the receiver.

Abstract: A circuit structure that includes a plurality of stacked conductor layers separated from each other by respective dielectric layers. The conductor layers may include a first set of conductor layers made of a first type conductor material and a second set of conductor layers made of a second type conductor material different from the first. A pair of conductor posts may traverse the stacked conductor layers. A first post may be electrically connected to the first set of conductor layers and electrically insulated from the second set of conductor layers. A second post electrically connected to the second set of conductor layers and electrically insulated from the first set of conductor layers.

Abstract: Embodiments of the present disclosure may provide a circuit comprising a tank circuit. The tank circuit may include an inductor having a pair of terminals, a first pair of transistors, and a first pair of capacitors. Each transistor may be coupled between a respective terminal of the inductor and a reference voltage along a source-to-drain path of the transistor. Each capacitor may be provided in a signal path between an inductor terminal coupled to a respective first transistor in the first pair and a gate of a second transistor in the first pair.

Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer. The p-type thermoelectric elements and the n-type thermoelectric elements may be connected in series while alternating between the p-type and the n-type thermoelectric elements.

Abstract: An oscillator for a signal isolator system includes a capacitor and an inductor connected in parallel, two pairs of cross-coupled switches and a control switch. The capacitor, the inductor and the cross-coupled switches form an oscillator. The control switch controls operation of the oscillator between an ON state and an OFF state in response to a data signal to be communicated across an isolation barrier. The inductor may be formed from a winding of an isolation transformer, which reduces component count as compared to a system that provides a separate inductor. Other embodiments may include a current-supplying kickstart circuit and a shorting transistor that can speed transition between the ON and OFF states.

Abstract: A chip-scale vibrational energy harvester circuit may include magnets and coils with magnetic cores provided in proximity thereto. Either the magnets or the coils may be mounted on a micro-electromechanical spring system (MEMS) that is coupled to a stationary frame. The counterpart component may be mounted on the stationary frame. When the stationary frame experiences vibrational activity, the magnets and the coils may move with respect to each other, causing variations in the flux passing through the coils. The variations in the flux may induce voltages across the coils. The induced voltages may be rectified and stored as energy for later use.

Abstract: An integrated circuit has a semiconductor die provided in a first IC layer and an inductor fabricated on a second IC layer. The inductor may have a winding and a magnetic core, which are oriented to conduct magnetic flux in a direction parallel to a surface of a semiconductor die. The semiconductor die may have active circuit components fabricated in a first layer of the die, provided under the inductor layer. The integrated circuit may include a flux conductor provided on a side of the die opposite the first layer. PCB connections to active elements on the semiconductor die may progress through the inductor layer as necessary.

Abstract: An isolator device and a corresponding method of forming the isolator device to include first and second electrodes, a layer of first dielectric material between the first and second electrodes, and at least one region of second dielectric material between the layer of first dielectric material and at least one of the first and second electrodes. The second dielectric material has a higher relative permittivity than the first dielectric material.

Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer. The p-type thermoelectric elements and the n-type thermoelectric elements may be connected in series while alternating between the p-type and the n-type thermoelectric elements.

Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer. The p-type thermoelectric elements and the n-type thermoelectric elements may be connected in series while alternating between the p-type and the n-type thermoelectric elements.

Abstract: Embodiments of the present invention may provide a wafer-capped rechargeable power source. The wafer-capped rechargeable power source may comprise a device wafer, a rechargeable power source disposed on a surface of the device wafer, and a capping wafer to encapsulate the rechargeable power source. The rechargeable power source may include an anode component, a cathode component, and an electrolyte component.

Abstract: An embodiment of a thermoelectric device may include a plurality of thermoelectric cells disposed between first and second planes. Each of the thermoelectric cells may include a thermoelectric element formed from a thermoelectric material of a single semiconductor type, the thermoelectric element including a first end, a second end, and a portion extending from the first end to the second end, the portion extending from the first end to the second end including at least two surfaces that face each other; and at least one conductive element electrically connected to and extending away from the second end of the thermoelectric element toward the first end of the thermoelectric element of another thermoelectric cell. Each thermoelectric cell also may further include an insulating element disposed between the at least two surfaces of the thermoelectric element and between portions of the at least one conductive element.

Abstract: A laterally coupled isolator includes a pair of isolator traces provided in a common dielectric layer and separated by a distance that defines the isolation strength of the system. Circuit designers can vary the lateral distance to tailor isolation rating to suit individual design needs. A second embodiment includes a semiconductor substrate, provided below the isolator traces that includes a communication circuit electrically coupled to one of the isolator devices.

Abstract: An integrated circuit may include a substrate and a dielectric layer formed over the substrate. A plurality of p-type thermoelectric elements and a plurality of n-type thermoelectric elements may be disposed within the dielectric layer that are connected in series while alternating between the p-type and the n-type thermoelectric elements. The integrated circuit may include first and second substrates each having formed thereon a plurality of thermoelectric legs of a respective type of thermoelectric material. The first and second thermoelectric substrates also may have respective conductors, each coupled to a base of an associated thermoelectric leg and forming a mounting pad for coupling to a thermoelectric leg of the counterpart substrate.

Abstract: An isolator system has an isolator that generates differential isolator signals and a receiver that generates digital data representative of signals received from the isolator. The system also may include an RC filter coupled between the isolator and the receiver. During operation, the filter may distribute transient signals across various circuit paths in the isolator, only some of which are coupled to the receiver inputs. Over time, the filter may attenuate transient contributions at the receiver inputs. In this manner, the filter may limit effects of these common mode transients.

Abstract: A circuit structure that includes a plurality of stacked conductor layers separated from each other by respective dielectric layers. The conductor layers may include a first set of conductor layers made of a first type conductor material and a second set of conductor layers made of a second type conductor material different from the first. A pair of conductor posts may traverse the stacked conductor layers. A first post may be electrically connected to the first set of conductor layers and electrically insulated from the second set of conductor layers. A second post electrically connected to the second set of conductor layers and electrically insulated from the first set of conductor layers.

Abstract: An embodiment of a communication system for transmitting and receiving data across an isolation barrier may include a communication circuit connected to an isolator at a first side of the isolation barrier, the communication circuit having a transmit circuit to drive a first data signal onto the isolator based on input data received by the communication circuit, a receive circuit to receive a second data signal from the isolator and produce output data based on the received second data signal, and a control circuit to control the transmit and receive circuits to provide time division multiplexing of the first and second data signals.

Abstract: An embodiment of a communication circuit for communicating data across an isolation barrier may include an input circuit to receive a plurality of input data channels, a framing circuit to frame an input data packet from the plurality of input data channels, an encoding circuit to select a characteristic of a data symbol to represent a plurality of bits of the framed input data packet, and a driver circuit to drive one or more data symbols representing the framed input data packet onto an isolator configured to communicate data across the isolation barrier. The encoding circuit may select an amplitude, frequency or phase of the data symbol from a plurality of predetermined amplitudes, frequencies or phases, to encode the plurality of bits as the selected amplitude, frequency or phase.

Abstract: A power converter may include an amplifier that generates an error signal, a modulator that generates a modulated error signal, an isolator that generates an isolated modulated error signal, and a demodulator that generates an isolated error signal, which may be substantially proportional to the difference between the output signal and the reference signal, and a controller that controls a power stage to generate the output signal of the power converter.