Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

Abstract: A portable web widget for distribution of multimedia content over a computer communications network, the web widget adapted for viral distribution and execution in a web browser on a client device wherein the widget includes a content retrieval component communicatively coupled to an application server over the computer communications network, the content retrieval component configured to retrieve one or more multimedia display files and metadata into an embedded electronic commerce store in the web widget after it enters an active operational mode, the widget also including a content preview component configured to enable a streamed execution of a portion of the multimedia content files associated with each of the multimedia display files from a multimedia content distribution system executing on the application server, and a transaction processing component operative to execute and complete a commercial transaction in the embedded electronic commerce store pertaining to the multimedia content files.

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

Abstract: Ladders and ladder components are provided including a rung assembly that provides an alert to a user of the ladder that they are standing on a particular rung or step. In one example, the lower most rung or step of a ladder includes a rung assembly having an alert mechanism. The alert mechanism may provide an audible and/or other sensory alert to a user when they step on the rung assembly so that the user recognizes their position relative to the ground or supporting surface. In one embodiment, the rung assembly is configured such that a front edge remains in a constant or fixed position relative to the rails to which it is coupled so that a user can rely on a fixed or constant position of the front edge of the assembly when climbing or descending the ladder.

Abstract: A magnetometer for measuring an external magnetic influence proximate the magnetometer. The magnetometer has: (i) a volumetric enclosure for storing an alkali metal; (2) a laser proximate the volumetric enclosure and having an axis in a first dimension and along which photons are directed toward a first surface of the volumetric enclosure; (3) a photodetector proximate a second surface of the volumetric enclosure and for receiving light emanating from the laser and passing through the volumetric enclosure, wherein the photodetector is for providing a photodetector signal in response to an intensity of light emanating from the laser and passing through the volumetric enclosure; and (4) at least one magnetic field reducer for providing a magnetic field in a second dimension orthogonal to the first dimension.

Abstract: The aircraft includes a rotor. The rotor includes a plurality of rotor blades. The aircraft further includes a non-rotating aircraft component. A proximity sensor is disposed with at least one of the non-rotating aircraft component and the rotor blades. A flight control computer is electrically coupled to the proximity sensor.

Abstract: A package for a chip scale atomic clock or magnetometer is disclosed. The package includes a vapor cell using an alkali metal vapor, first and second photodetectors, and a laser operable at a frequency that excites an electron transition in the alkali metal vapor. The laser is positioned to provide an optical signal directed through the vapor cell and towards the first photodetector. The package further contains a polarizing beam splitter, the polarizing beam splitter positioned between the vapor cell and the first photodetector to receive the optical signal and to split the optical signal into a first signal directed toward the first photodetector and a second signal directed toward the second photodetector, the first signal being orthogonal to the second signal.

Abstract: A ladder with bracing is provided. In one embodiment, the ladder may include a first rail assembly comprising a pair of inner rails and a pair of outer rails, the pair of inner rails being slidably disposed in a upper portion of pair of outer rails, wherein a rear surface of each of the pair of outer rails lies in a common plane. A first plurality of rungs may be coupled between the pair of inner rails, and a second plurality of rungs coupled between the pair of outer rails. A brace may extend between and be coupled to the pair of outer rails, wherein the brace includes a first ramped surface, the first ramped surface having a first portion spaced away from the common plane, a second portion immediately adjacent the common plane, and a transition portion extending between the first portion and the second portion.

Abstract: The aircraft includes a rotor. The rotor includes a plurality of rotor blades. The aircraft further includes a non-rotating aircraft component. A proximity sensor is disposed with at least one of the non-rotating aircraft component and the rotor blades. A flight control computer is electrically coupled to the proximity sensor.

Abstract: Ladders and ladder components are provided including a rung assembly that provides an alert to a user of the ladder that they are standing on a particular rung or step. In one example, the lower most rung or step of a ladder includes a rung assembly having an alert mechanism. The alert mechanism may provide an audible and/or other sensory alert to a user when they step on the rung assembly so that the user recognizes their position relative to the ground or supporting surface. In one embodiment, the rung assembly is configured such that a front edge remains in a constant or fixed position relative to the rails to which it is coupled so that a user can rely on a fixed or constant position of the front edge of the assembly when climbing or descending the ladder.

Abstract: A portable web widget for distribution of multimedia content over a computer communications network, the web widget adapted for viral distribution and execution in a web browser on a client device wherein the widget includes a content retrieval component communicatively coupled to an application server over the computer communications network, the content retrieval component configured to retrieve one or more multimedia display files and metadata into an embedded electronic commerce store in the web widget after it enters an active operational mode, the widget also including a content preview component configured to enable a streamed execution of a portion of the multimedia content files associated with each of the multimedia display files from a multimedia content distribution system executing on the application server, and a transaction processing component operative to execute and complete a commercial transaction in the embedded electronic commerce store pertaining to the multimedia content files.

Abstract: A wave communication system includes an integrated circuit and a multilayered substrate. The multilayered substrate is electrically coupled to the integrated circuit. The multilayered substrate includes an antenna structure configured to transmit a circularly polarized wave in response to signals from the integrated circuit.

Abstract: In described examples of forming an integrated circuit wave device, a method includes: (a) affixing an integrated circuit die relative to a substrate; (b) creating a form relative to the integrated circuit die and the substrate; and (c) forming a wave shaping member having a shape conforming at least in part to a shape of the form.

Abstract: A chip scale vapor cell and millimeter wave atomic clock apparatus are disclosed. The chip scale vapor cell includes a first substrate and a second substrate bonded to the first substrate with a bonding material. A primary hermetic cavity includes a first bottom wall and first sidewalls formed in the first substrate and a first top wall formed by the lower surface of the second substrate. A secondary hermetic cavity includes a second bottom wall and second sidewalls formed in the first substrate and a second top wall formed by the lower surface of the second substrate. The secondary hermetic cavity is separate from the primary hermetic cavity and surrounds the perimeter of the primary hermetic cavity. A gas, which can be a dipolar molecular gas, is sealed in the primary hermetic cavity and the secondary hermetic cavity at a given initial pressure.

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

Abstract: Described examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.

Abstract: Semiconductor devices and methods and apparatus to produce such semiconductor devices are disclosed. An integrated circuit package includes a lead frame including a die attach pad and a plurality of leads; a die including a MEMs region defined by a plurality of trenches, the die electrically connected to the plurality of leads; and a mold compound covering portions of the die, the mold compound defining a cavity between a surface of the die and a surface of the mold compound, wherein the mold compound defines a vent.

Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.

Abstract: A magnetometer for measuring an external magnetic influence proximate the magnetometer. The magnetometer has: (i) a volumetric enclosure for storing an alkali metal; (2) a laser proximate the volumetric enclosure and having an axis in a first dimension and along which photons are directed toward a first surface of the volumetric enclosure; (3) a photodetector proximate a second surface of the volumetric enclosure and for receiving light emanating from the laser and passing through the volumetric enclosure, wherein the photodetector is for providing a photodetector signal in response to an intensity of light emanating from the laser and passing through the volumetric enclosure; and (4) at least one magnetic field reducer for providing a magnetic field in a second dimension orthogonal to the first dimension.

Abstract: Disclosed examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.