Patents by Inventor Benjamin Cook

Benjamin Cook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10074639
    Abstract: Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: September 11, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Barry Jon Male, Benjamin Cook, Robert Alan Neidorff, Steve Kummerl
  • Publication number: 20180197830
    Abstract: In described examples of forming an integrated circuit wave device, a method includes: (a) affixing an integrated circuit die relative to a substrate; (b) creating a form relative to the integrated circuit die and the substrate; and (c) forming a wave shaping member having a shape conforming at least in part to a shape of the form.
    Type: Application
    Filed: March 6, 2018
    Publication date: July 12, 2018
    Inventors: Barry Jon Male, IV, Benjamin Cook, Robert Alan Neidorff, Steve Kummerl
  • Publication number: 20180190628
    Abstract: Disclosed examples include integrated circuits with a leadframe structure, a first circuit structure including a light source configured to generate a light signal along an optical path, a second circuit structure including a light sensor facing the optical path to receive the light signal, and a molded package structure enclosing portions of the leadframe structure, the molded package structure having a cavity defined by an interior surface of the molded package structure, the optical path extending in the cavity between the first and second circuit structures.
    Type: Application
    Filed: December 30, 2016
    Publication date: July 5, 2018
    Applicant: Texas Instruments Incorporated
    Inventors: Barry Jon Male, Benjamin Cook, Robert Alan Neidorff, Steve Kummerl
  • Publication number: 20180162722
    Abstract: Disclosed examples include sensor apparatus and integrated circuits having a package structure with an internal cavity and an opening that connects of the cavity with an ambient condition of an exterior of the package structure, and an electronic sensor structure mechanically supported by wires in the cavity and including a sensing surface exposed to the cavity to sense the ambient condition of an exterior of the package structure.
    Type: Application
    Filed: December 8, 2016
    Publication date: June 14, 2018
    Applicant: Texas Instruments Incorporated
    Inventors: Barry Jon Male, Benjamin Cook, Robert Alan Neidorff, Steve Kummerl
  • Publication number: 20180156875
    Abstract: A package for a chip scale atomic clock or magnetometer is disclosed. The package includes a vapor cell using an alkali metal vapor, first and second photodetectors, and a laser operable at a frequency that excites an electron transition in the alkali metal vapor. The laser is positioned to provide an optical signal directed through the vapor cell and towards the first photodetector. The package further contains a polarizing beam splitter, the polarizing beam splitter positioned between the vapor cell and the first photodetector to receive the optical signal and to split the optical signal into a first signal directed toward the first photodetector and a second signal directed toward the second photodetector, the first signal being orthogonal to the second signal.
    Type: Application
    Filed: December 2, 2016
    Publication date: June 7, 2018
    Inventors: Juan Herbsommer, Benjamin Cook
  • Publication number: 20180159547
    Abstract: A chip scale vapor cell and millimeter wave atomic clock apparatus are disclosed. The chip scale vapor cell includes a first substrate and a second substrate bonded to the first substrate with a bonding material. A primary hermetic cavity includes a first bottom wall and first sidewalls formed in the first substrate and a first top wall formed by the lower surface of the second substrate. A secondary hermetic cavity includes a second bottom wall and second sidewalls formed in the first substrate and a second top wall formed by the lower surface of the second substrate. The secondary hermetic cavity is separate from the primary hermetic cavity and surrounds the perimeter of the primary hermetic cavity. A gas, which can be a dipolar molecular gas, is sealed in the primary hermetic cavity and the secondary hermetic cavity at a given initial pressure.
    Type: Application
    Filed: December 1, 2016
    Publication date: June 7, 2018
    Inventors: Juan Herbsommer, Benjamin Cook, S. Josh Jacobs
  • Publication number: 20180127266
    Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.
    Type: Application
    Filed: January 10, 2018
    Publication date: May 10, 2018
    Inventors: Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Kirmse, Benjamin Cook, Genki Yano, Stuart Jacobsen
  • Patent number: 9929110
    Abstract: A method of forming, and a resulting, an integrated circuit wave device. The method (i) affixes an integrated circuit die relative to a substrate; (ii) creates a form relative to the integrated circuit die and the substrate; and (iii) forms a wave shaping member having a shape conforming at least in part to a shape of the form.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: March 27, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Barry Jon Male, Benjamin Cook, Robert Alan Neidorff, Steve Kummerl
  • Patent number: 9896330
    Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: February 20, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Kirmse, Benjamin Cook, Genki Yano, Stuart Jacobsen
  • Patent number: 9761543
    Abstract: Integrated circuits with a molded package including a cavity and a semiconductor die spaced from an interior surface of the molded package within the cavity. The semiconductor die includes one or more electrical components, a thermal control component to control the temperature of the electrical component, and a driver to provide a current or voltage signal to the thermal control component at least partially according to a setpoint signal.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: September 12, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Barry Jon Male, Benjamin Cook, Robert Alan Neidorff, Steve Kummerl
  • Patent number: 9729906
    Abstract: Methods and systems for the efficient and non-redundant transmission of a single video program in multiple frame rates, optionally employing a combination of video coding standards, in a way that is backwards-compatible with legacy receivers only supportive of some subsection of frame rates or of some subsection of video coding standards.
    Type: Grant
    Filed: February 15, 2016
    Date of Patent: August 8, 2017
    Assignee: Cisco Technology, Inc.
    Inventors: Arturo A. Rodriguez, Benjamin Cook, Jeffrey C. Hopper
  • Publication number: 20170197823
    Abstract: A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.
    Type: Application
    Filed: April 21, 2016
    Publication date: July 13, 2017
    Inventors: Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Kirmse, Benjamin Cook, Genki Yano, Stuart Jacobsen
  • Patent number: 9679298
    Abstract: A portable web widget for distribution of multimedia content over a computer communications network, the web widget adapted for viral distribution and execution in a web browser on a client device wherein the widget includes a content retrieval component communicatively coupled to an application server over the computer communications network, the content retrieval component configured to retrieve one or more multimedia display files and metadata into an embedded electronic commerce store in the web widget after it enters an active operational mode, the widget also including a content preview component configured to enable a streamed execution of a portion of the multimedia content files associated with each of the multimedia display files from a multimedia content distribution system executing on the application server, and a transaction processing component operative to execute and complete a commercial transaction in the embedded electronic commerce store pertaining to the multimedia content files.
    Type: Grant
    Filed: August 9, 2012
    Date of Patent: June 13, 2017
    Inventors: David Robb, Grant Neerings, Cameron Patterson, Joseph Rodriguez, Quinton Richard Harris, Benjamin Cook
  • Patent number: 9659844
    Abstract: An integrated circuit device includes a semiconductor substrate with a top surface, a bottom surface opposite the top surface and an intermediate portion positioned between the top and bottom surfaces. The device also includes interior substrate surfaces defined by at least one void extending from the bottom surface to the intermediate portion.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: May 23, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rajarshi Mukhopadhyay, Daniel N. Carothers, Benjamin Cook
  • Patent number: 9593531
    Abstract: A ladder is provided having a securing apparatus for securing the ladder to a horizontally extending support structure (e.g., a utility cable), a vertically extending support structure (e.g., a utility pole) or both. In accordance with one embodiment, the securing apparatus includes a pair of spaced apart engagement mechanisms, wherein each engagement mechanism is pivotally coupled with an associated rail of the ladder. Each engagement mechanism includes a frame member, an engagement member pivotally coupled with the frame member and a pole grasping structure coupled with the frame member. In one embodiment, each engagement member is configured to rotate from a first position, wherein an open gate is formed between the engagement member and its associated frame member, to a closed position.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: March 14, 2017
    Assignee: Wing Enterprises, Inc.
    Inventors: Jay Ballard, Sean R. Peterson, Gary M. Jonas, N. Ryan Moss, Ryan Crawford, Benjamin Cook, Brian B. Russell
  • Publication number: 20170062316
    Abstract: One embodiment of an integrated circuit device includes a semiconductor substrate with a top surface, a bottom surface opposite said top surface and an intermediate portion positioned between the top and bottom surfaces. The device also includes interior substrate surfaces defined by at least one void extending from the bottom surface to the intermediate portion.
    Type: Application
    Filed: August 31, 2015
    Publication date: March 2, 2017
    Inventors: Rajarshi Mukhopadhyay, Daniel N. Carothers, Benjamin Cook
  • Patent number: 9506848
    Abstract: A strain and crack sensor senses an amount of strain induced in an object. A receiving planar antenna has a first resonant frequency and is configured to receive a querying signal at the first resonant frequency. A transmitting planar antenna has a second resonant frequency that is twice the first resonant frequency. At least one of the receiving planar antenna and the transmitting planar antenna is bonded to the object so that at least one of strain induced in the object or a crack formed in the object causes a shift in at least one of the first resonant frequency or the second resonant frequency. A matching element is in electrical communication with the first planar antenna and the second planar antenna. The matching element is configured to cause the transmitting planar antenna to radiate a response signal in response to the querying signal.
    Type: Grant
    Filed: August 13, 2014
    Date of Patent: November 29, 2016
    Assignee: Georgia Tech Research Corporation
    Inventors: Xiaohua Yi, Chunhee Cho, Benjamin Cook, Yang Wang, Manos Tentzeris, Roberto T. Leon
  • Patent number: 9419075
    Abstract: A semiconductor device is formed on a semiconductor substrate, including a primary portion of the substrate. An active component of the semiconductor device is disposed in the primary portion of the substrate. An interconnect region is formed on a top surface of the substrate. Semiconductor material is removed from the substrate in an isolation region, which is separate from the primary portion of the substrate; the isolation region extends from the top surface of the substrate to a bottom surface of the substrate. A dielectric replacement material is formed in the isolation region. The semiconductor device further includes an isolated component which is not disposed in the primary portion of the substrate. The dielectric replacement material in the isolation region separates the isolated component from the primary portion of the substrate.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: August 16, 2016
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Dan Carothers, Rajarshi Mukhopadhyay, Paul Brohlin, Benjamin Cook
  • Publication number: 20160218175
    Abstract: A semiconductor device is formed on a semiconductor substrate, including a primary portion of the substrate. An active component of the semiconductor device is disposed in the primary portion of the substrate. An interconnect region is formed on a top surface of the substrate. Semiconductor material is removed from the substrate in an isolation region, which is separate from the primary portion of the substrate; the isolation region extends from the top surface of the substrate to a bottom surface of the substrate. A dielectric replacement material is formed in the isolation region. The semiconductor device further includes an isolated component which is not disposed in the primary portion of the substrate. The dielectric replacement material in the isolation region separates the isolated component from the primary portion of the substrate.
    Type: Application
    Filed: April 30, 2015
    Publication date: July 28, 2016
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Dan Carothers, Rajarshi Mukhopadhyay, Paul Brohlin, Benjamin Cook
  • Publication number: 20160165270
    Abstract: Methods and systems for the efficient and non-redundant transmission of a single video program in multiple frame rates, optionally employing a combination of video coding standards, in a way that is backwards-compatible with legacy receivers only supportive of some subsection of frame rates or of some subsection of video coding standards.
    Type: Application
    Filed: February 15, 2016
    Publication date: June 9, 2016
    Inventors: Arturo A. Rodriguez, Benjamin Cook, Jeffrey C. Hopper