Patents by Inventor BENJAMIN STASSEN COOK

BENJAMIN STASSEN COOK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10985729
    Abstract: A pressure sensor apparatus is disclosed. The pressure sensor apparatus includes a bulk acoustic wave (BAW) die having a die interface side and a pressure contact side, a sensor BAW resonator and a reference BAW resonator disposed on the die interface side of the BAW die, a control circuit die coupled to the die interface side of the BAW die via an attachment layer, and an extended opening on the pressure contact side that extends into a depth of the BAW die and is generally aligned with the sensor BAW resonator, the extended opening being configured to translate an external pressure on the pressure contact side onto the sensor BAW resonator.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: April 20, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Bichoy Bahr, Baher S. Haroun, Benjamin Stassen Cook
  • Patent number: 10969746
    Abstract: In described examples, a physics cell includes: a laser source configured to emit light towards an atomic chamber containing an atomic gas; a photodetector configured to receive emissions from the atomic chamber; and a field coil for generating a magnetic field in the atomic chamber. An electronics circuit includes: a controller circuit coupled to the photodetector output and having control outputs to a digital to analog converter circuit; the digital to analog converter circuit having a coil current output to adjust the magnetic field, a modulation control output to control a modulation of the light, and having an output to control a voltage controlled oscillator; and a radio-frequency output circuit having a voltage controlled oscillator coupled to the output of the digital to analog converter circuit outputting a radio frequency signal to the laser source in the physics cell.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: April 6, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Bradley Allen Kramer, Benjamin Stassen Cook, Juan Alejandro Herbsommer
  • Publication number: 20210098331
    Abstract: In described examples, a circuit (e.g., an integrated circuit) includes a semiconductor substrate that includes a frontside surface and a backside surface. A circuit element is included at the frontside surface. An optional electrical insulator layer can be included adjacent to the backside surface. A distributor layer is included adjacent to the backside surface. In some examples, the distributor layer includes a distributor material that includes a matrix of cohered nanoparticles and metallic particles embedded by the cohered nanoparticles.
    Type: Application
    Filed: September 27, 2019
    Publication date: April 1, 2021
    Inventors: Benjamin Stassen Cook, Nazila Dadvand, Daniel Lee Revier, Archana Venugopal
  • Publication number: 20210099237
    Abstract: In described examples of a CMOS IC, an ultrasonic transducer having terminals is formed on a substrate of the IC. CMOS circuitry having ultrasonic signal terminals is formed on the substrate. At least one metal interconnect layer overlies the ultrasonic transducer and the CMOS circuitry. The at least one metal interconnect layer connects the CMOS circuitry ultrasonic signal terminals to the terminals of the ultrasonic transducer.
    Type: Application
    Filed: October 1, 2019
    Publication date: April 1, 2021
    Inventors: Bichoy Bahr, Benjamin Stassen Cook, Scott Robert Summerfelt
  • Publication number: 20210091012
    Abstract: A floating die package including a cavity formed through sublimation of a sacrificial die encapsulant and sublimation or separation of die attach materials after molding assembly. A pinhole vent in the molding structure is provided as a sublimation path to allow gases to escape, whereby the die or die stack is released from the substrate and suspended in the cavity by the bond wires only.
    Type: Application
    Filed: December 8, 2020
    Publication date: March 25, 2021
    Inventors: Benjamin Stassen Cook, Steven Kummerl, Kurt Peter Wachtler
  • Publication number: 20210090904
    Abstract: In described examples, a method for encapsulating a semiconductor device includes the steps of immersing a layer of the semiconductor device in a liquid encapsulation material, irradiating portions of the liquid encapsulation material to polymerize the liquid encapsulation material, and moving the semiconductor device further from a surface of the liquid encapsulation material proximate to the layer. Immersing the semiconductor device is performed to cover a layer of the device in the liquid encapsulation material. Targeted locations of the liquid encapsulation material covering the layer are irradiated to form solid encapsulation material. The semiconductor device is moved from a surface of the liquid encapsulation material so that a new layer of the semiconductor device and/or of the solid encapsulation material can be covered by the liquid encapsulation material.
    Type: Application
    Filed: December 7, 2020
    Publication date: March 25, 2021
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Patent number: 10957635
    Abstract: A packaged semiconductor device includes a metal substrate having a first and second through-hole aperture having an outer ring, and metal pads around the apertures on dielectric pads. A first and second semiconductor die have a back side metal (BSM) layer on its bottom side are mounted top side up on a top portion of the apertures. A metal die attach layer is directly between the BSM layer and walls of the metal substrate bounding the apertures to provide a die attachment for the first and the second semiconductor die that fills a bottom portion of the apertures. Leads contact the metal pads, wherein the leads include a distal portion that extends beyond the metal substrate. Bondwires are between the metal pads and bond pads on the first and second semiconductor die, and a mold compound provides encapsulation for the packaged semiconductor device.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: March 23, 2021
    Assignee: Texas Instruments Incorporated
    Inventors: Nazila Dadvand, Sreenivasan Koduri, Benjamin Stassen Cook
  • Publication number: 20210072327
    Abstract: A structure includes a substrate which includes a surface. The structure also includes a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate. The structure further includes a protective overcoat layer positioned above the surface of the substrate, and a sphere-shaped magnetic concentrator positioned above the protective overcoat layer. Instead of or in addition to the sphere-shaped magnetic concentrator, the structure may include an embedded magnetic concentrator positioned within the substrate and below the horizontal-type Hall sensor.
    Type: Application
    Filed: September 9, 2019
    Publication date: March 11, 2021
    Inventors: Jo BITO, Benjamin Stassen COOK, Dok Won LEE, Keith Ryan GREEN, Kenji OTAKE
  • Publication number: 20210063497
    Abstract: In a described example, a structure includes a substrate having a surface with multiple sides. A sensor is positioned within the substrate and a seed layer is over at least four sides of the surface of the substrate. A magnetic shield layer is over the seed layer for the at least four sides of the surface of the substrate.
    Type: Application
    Filed: August 26, 2020
    Publication date: March 4, 2021
    Inventors: YONG DENG, JO BITO, BENJAMIN STASSEN COOK
  • Patent number: 10923457
    Abstract: A multi-die module includes a first die with a first device and a second die with a second device. The multi-die module also includes a contactless coupler configured to convey signals between the first device and the second device. The multi-die module also includes a coupling loss reduction structure.
    Type: Grant
    Filed: December 23, 2018
    Date of Patent: February 16, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Bichoy Bahr, Baher Haroun
  • Patent number: 10913654
    Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: February 9, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Adam Joseph Fruehling, Juan Alejandro Herbsommer, Simon Joshua Jacobs, Benjamin Stassen Cook, James F. Hallas, Randy Long
  • Patent number: 10908414
    Abstract: An apparatus includes a mass detection circuit coupled to a surface covered with a plurality of electrodes. The mass detection circuit is configured to detect a mass of a first droplet present on the surface. The apparatus further includes a transducer circuit coupled to a transducer, which is coupled to the surface and form a lens unit. The transducer circuit configured to excite a first vibration of the surface at a resonant frequency to form a high displacement region on the surface. The apparatus also includes a voltage excitation circuit coupled to the plurality of electrodes. In response to the detection of the mass of the first droplet, the voltage excitation circuit is configured to apply a sequence of differential voltages on one or more consecutive electrodes which moves the first droplet to the high displacement region.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: February 2, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Daniel Lee Revier, Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan
  • Patent number: 10910465
    Abstract: In described examples, a method for fabricating a semiconductor device and a three dimensional structure, and packaging them together, includes: fabricating the integrated circuit on a substrate, immersing the substrate in a liquid encapsulation material, and illuminating the liquid encapsulation material to polymerize the liquid encapsulation material. Immersing the semiconductor device is performed to cover a layer of a platform in the liquid encapsulation material. The platform is a lead frame, a packaging substrate, or the substrate. The illuminating step targets locations of the liquid encapsulation material covering the layer. Illuminated encapsulation material forms solid encapsulation material that is fixedly coupled to contiguous portions of the semiconductor device and of the solid encapsulation material. The immersing and illuminating steps are repeated until a three dimensional structure is formed. The integrated circuit and the three dimensional structure are encapsulated in a single package.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: February 2, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Publication number: 20210025948
    Abstract: A structure includes a substrate which includes a surface. The structure also includes a horizontal-type Hall sensor positioned within the substrate and below the surface of the substrate. The structure further includes a patterned magnetic concentrator positioned above the surface of the substrate, and a protective overcoat layer positioned above the magnetic concentrator.
    Type: Application
    Filed: July 24, 2019
    Publication date: January 28, 2021
    Inventors: Jo BITO, Benjamin Stassen COOK, Dok Won LEE, Keith Ryan GREEN, Ricky Alan JACKSON, William David FRENCH
  • Publication number: 20210013133
    Abstract: A leadless packaged semiconductor device includes a metal substrate having at least a first through-hole aperture having a first outer ring and a plurality of cuts through the metal substrate to define spaced apart metal pads on at least two sides of the first through-hole aperture. A semiconductor die that has a back side metal (BSM) layer on its bottom side and a top side with circuitry coupled to bond pads is mounted top side up on the first outer ring. A metal die attach layer is directly between the BSM layer and walls of the metal substrate bounding the first through-hole aperture that provides a die attachment that fills a bottom portion of the first through-hole aperture. Bond wires are between metal pads and the bond pads. A mold compound is also provided including between adjacent ones of the metal pads.
    Type: Application
    Filed: September 30, 2020
    Publication date: January 14, 2021
    Inventors: Benjamin Stassen Cook, Nazila Dadvand, Sreenivasan Koduri
  • Patent number: 10892209
    Abstract: A semiconductor device includes a metal substrate including a through-hole aperture having a multi-size cavity including a larger area first cavity portion above a smaller area second cavity portion that defines a first ring around the second cavity portion, where the first cavity portion is sized with area dimensions to receive a semiconductor die having a top side with circuitry coupled to bond pads thereon and a back side with a metal (BSM) layer thereon. The semiconductor die is mounted top side up with the BSM layer on the first ring. A metal die attach layer directly contacts the BSM layer, sidewalls of the bottom cavity portion, and a bottom side of the metal substrate.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: January 12, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Nazila Dadvand, Sreenivasan Koduri
  • Publication number: 20210005537
    Abstract: An integrated circuit die may be fabricating to have a plurality of contacts. A metal post may be formed on each of the plurality of contacts. A plurality of bumps may be formed on a plurality of contact regions of a leadframe or on the posts, in which the plurality of bumps are formed with a material that includes metal nanoparticles. The IC die may be attached to the leadframe by aligning the metal posts to the leadframe and sintering the metal nanoparticles in the plurality of bumps to form a sintered metal bond between each metal post and corresponding contact region of the leadframe.
    Type: Application
    Filed: September 21, 2020
    Publication date: January 7, 2021
    Inventors: Kurt Peter Wachtler, Seunghyun Chae, Benjamin Stassen Cook
  • Patent number: 10886187
    Abstract: An encapsulated integrated circuit is provided that includes an integrated circuit (IC) die. An encapsulation material encapsulates the IC die. A phononic bandgap structure is included within the encapsulation material that is configured to have a phononic bandgap with a frequency range approximately equal to a range of frequencies of thermal phonons produced by the IC die when the IC die is operating.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: January 5, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Daniel Lee Revier
  • Publication number: 20200406316
    Abstract: For surface wetting control, an apparatus can expel fluid from a droplet on a surface using a transducer mechanically coupled to the surface. A first area of the surface can have a first wettability for the fluid, and a second area of the surface can have a second wettability for the fluid. The first wettability of the first area of the surface can be greater than the second wettability of the second area of the surface. The first area and the second area can have a patterned arrangement.
    Type: Application
    Filed: September 14, 2020
    Publication date: December 31, 2020
    Inventors: Daniel Lee Revier, Benjamin Stassen Cook, David Patrick Magee, Stephen John Fedigan
  • Patent number: 10879151
    Abstract: A semiconductor package includes a lead frame, a semiconductor device, a liquid metal conductor, and an encapsulation material. The semiconductor device is affixed to the lead frame. The liquid metal conductor couples the semiconductor device to the lead frame. The encapsulation material encases the semiconductor device, the liquid metal conductor, and at least a portion of the lead frame.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: December 29, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Dishit Paresh Parekh, Benjamin Stassen Cook, Daniel Lee Revier, Jo Bito