Patents by Inventor Bert J. Offrein
Bert J. Offrein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9036952Abstract: An electro-optical device and method of assembly is disclosed. A first unit of the electro-optical device is positioned with respect to a second unit of the electro-optical device to pre-align an optical communication pathway between the first unit and the second unit. The first unit is positioned with respect to the second unit to pre-align an electrical communication pathway between the first unit and the second unit. The first unit is bonded to the second unit to assemble the electro-optical device to establish optical communication and electrical communication between the first unit and the second unit.Type: GrantFiled: July 25, 2012Date of Patent: May 19, 2015Assignee: International Business Machines CorporationInventors: Antonio La Porta, Bert J. Offrein, Ibrahim M. Soganci
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Patent number: 9002157Abstract: A method of manufacturing a three dimensional photonic device by two photon absorption polymerization. The method includes several stages, including direct laser writing involving polymerization by two-photon absorption to manufacture a three dimensional photonic device integrating at least two distinct micro-optical components having two optical functions and being aligned with each other so that optical signal can be transmitted from one of said distinct components to the other. The distinct components are built at a same stage of the process flow to improve their relative alignment by direct laser writing involving polymerization by two-photon absorption.Type: GrantFiled: May 21, 2013Date of Patent: April 7, 2015Assignee: International Business Machines CorporationInventors: Antonio La Porta, Bert J Offrein, Ibrahim Murat Soganci
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Patent number: 8979390Abstract: A ferrule for a multilayer waveguide connector includes a face having mechanical alignment slots arranged in a bidirectional lattice structure, the mechanical alignment slots including first slots disposed in a first direction, the first slots configured to respectively receive one end of waveguide layers, and second slots disposed in a second direction different from the first direction, the second slots configured to respectively receive protrusions transverse from a main surface of the waveguide layers.Type: GrantFiled: November 2, 2012Date of Patent: March 17, 2015Assignee: International Business Machines CorporationInventors: Daniel S. Jubin, Norbert M. Meier, Bert J. Offrein
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Patent number: 8873912Abstract: A method for fabricating an optical waveguide includes setting, on a lower cladding of an optical waveguide, a light-reflecting feature and at least one waveguide core distinct from the reflecting feature. An upper cladding is applied that embeds both the light-reflecting feature and the waveguide core.Type: GrantFiled: March 31, 2010Date of Patent: October 28, 2014Assignee: International Business Machines CorporationInventors: Roger F. Dangel, Folkert Horst, Tobias P. Lamprecht, Bert J. Offrein
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Publication number: 20140093213Abstract: An apparatus includes an optical adaptor having monolithically integrated optical elements and first micro-mechanical features, the latter defining at least a first horizontal reference surface and a first vertical reference surface; wherein the first horizontal reference surface is perpendicular to an optical plane, the latter being perpendicular the optical axis of the optical elements; and wherein the first vertical reference surface is perpendicular to the first horizontal reference surface and parallel to the optical axis.Type: ApplicationFiled: October 1, 2013Publication date: April 3, 2014Applicant: International Business Machines CorporationInventors: Jens Hofrichter, Folkert Horst, Antonio La Porta, Bert J. Offrein, Ibrahim Murat Soganci
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Publication number: 20140093207Abstract: An apparatus includes an optical adaptor having monolithically integrated optical elements and first micro-mechanical features, the latter defining at least a first horizontal reference surface and a first vertical reference surface; wherein the first horizontal reference surface is perpendicular to an optical plane, the latter being perpendicular the optical axis of the optical elements; and wherein the first vertical reference surface is perpendicular to the first horizontal reference surface and parallel to the optical axis.Type: ApplicationFiled: September 4, 2013Publication date: April 3, 2014Applicant: International Business Machines CorporationInventors: Jens Hofrichter, Folkert Horst, Antonio La Porta, Bert J. Offrein, Ibrahim Murat Soganci
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Publication number: 20140093206Abstract: A method for aligning optical components comprised in an optical component assembly and optical waveguides comprised in an optical waveguide assembly according to a common optical axis and by using an adapter includes providing the optical component assembly with a first alignment structure comprising a cavity designed according to the position of the optical components within the optical component assembly; providing an adapter presenting a base surface comprising a first step structure; providing the optical waveguide assembly with a second alignment structure comprising a distinct step structure designed according to the position of the waveguides within the waveguides assembly; and positioning the optical component assembly, the optical waveguide assembly and the adapter, so that a sidewall of the cavity and the distinct step structure are put in contact with a sidewall of the first step structure.Type: ApplicationFiled: September 4, 2013Publication date: April 3, 2014Applicant: International Business Machines CorporationInventors: Folkert Horst, Antonio La Porta, Bert J. Offrein, Ibrahim Murat Soganci
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Publication number: 20140093208Abstract: A method for aligning optical components comprised in an optical component assembly and optical waveguides comprised in an optical waveguide assembly according to a common optical axis and by using an adapter includes providing the optical component assembly with a first alignment structure comprising a cavity designed according to the position of the optical components within the optical component assembly; providing an adapter presenting a base surface comprising a first step structure; providing the optical waveguide assembly with a second alignment structure comprising a distinct step structure designed according to the position of the waveguides within the waveguides assembly; and positioning the optical component assembly, the optical waveguide assembly and the adapter, so that a sidewall of the cavity and the distinct step structure are put in contact with a sidewall of the first step structure.Type: ApplicationFiled: October 1, 2013Publication date: April 3, 2014Applicant: International Business Machines CorporationInventors: Folkert Horst, Antonio La Porta, Bert J. Offrein, Ibrahim Murat Soganci
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Publication number: 20140029888Abstract: An electro-optical device and method of assembly is disclosed. A first unit of the electro-optical device is positioned with respect to a second unit of the electro-optical device to pre-align an optical communication pathway between the first unit and the second unit. The first unit is positioned with respect to the second unit to pre-align an electrical communication pathway between the first unit and the second unit. The first unit is bonded to the second unit to assemble the electro-optical device to establish optical communication and electrical communication between the first unit and the second unit.Type: ApplicationFiled: July 25, 2012Publication date: January 30, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Antonio La Porta, Bert J. Offrein, Ibrahim M. Soganci
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Publication number: 20140026394Abstract: An electro-optical device and method of assembly is disclosed. A first unit of the electro-optical device is positioned with respect to a second unit of the electro-optical device to pre-align an optical communication pathway between the first unit and the second unit. The first unit is positioned with respect to the second unit to pre-align an electrical communication pathway between the first unit and the second unit. The first unit is bonded to the second unit to assemble the electro-optical device to establish optical communication and electrical communication between the first unit and the second unit.Type: ApplicationFiled: August 8, 2012Publication date: January 30, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Antonio La Porta, Bert J. Offrein, Ibrahim Murat Soganci
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Publication number: 20130315530Abstract: A method of manufacturing a three dimensional photonic device by two photon absorption polymerization. The method includes several stages, including direct laser writing involving polymerization by two-photon absorption to manufacture a three dimensional photonic device integrating at least two distinct micro-optical components having two optical functions and being aligned with each other so that optical signal can be transmitted from one of said distinct components to the other. The distinct components are built at a same stage of the process flow to improve their relative alignment by direct laser writing involving polymerization by two-photon absorption.Type: ApplicationFiled: May 21, 2013Publication date: November 28, 2013Inventors: Antonio La Porta, Bert J Offrein, Ibrahim Murat Soganci
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Publication number: 20120039576Abstract: A method for fabricating an optical waveguide includes setting, on a lower cladding of an optical waveguide, a light-reflecting feature and at least one waveguide core distinct from the reflecting feature. An upper cladding is applied that embeds both the light-reflecting feature and the waveguide core.Type: ApplicationFiled: March 31, 2010Publication date: February 16, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Roger F. Dangel, Folkert Horst, Tobias P. Lamprecht, Bert J. Offrein
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Patent number: 7724988Abstract: An opto-electronic board including a printed wiring board with an optical waveguide, a metallic area, and a hole, wherein an abutting face of the optical waveguide and an abutting face of the metallic area form a part of the side face of the hole. The opto-electronic board further comprises an opto-electronic circuit with a bonding pad, wherein the opto-electronic circuit is arranged in the hole and soldered with its bonding pad to the abutting face of the metallic area.Type: GrantFiled: October 29, 2007Date of Patent: May 25, 2010Assignee: International Business Machines CorporationInventors: Laurent A. Dellmann, Michel Despont, Bert J. Offrein, David J. Webb
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Patent number: 7650693Abstract: An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components, wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals.Type: GrantFiled: June 11, 2008Date of Patent: January 26, 2010Assignee: International Business Machines CorporationInventors: Bert J. Offrein, Stefano S. Oggioni, Mauro Spreafico
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Publication number: 20090245722Abstract: A three-dimensional stacked optical device includes a transparent substrate, and an optical device having a main body mounted to the transparent substrate. The optical device includes a plurality of vias that extend into the main body and do not extend into the transparent substrate. A conductive member is provided in each of the plurality of vias to form backside contacts. An electronic chip including a plurality of vias is mounted to the backside contacts on the optical device. Another conductive member is deposited in each of the plurality of vias formed in the electronic chip. The another conductive member forms additional backside contacts on the electronic chip.Type: ApplicationFiled: January 16, 2009Publication date: October 1, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Laurent Dellmann, Michel Despont, Bert J. Offrein
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Publication number: 20090245721Abstract: A three-dimensional stacked optical device includes a transparent substrate having at least one interconnect member, and an optical device mounted to the at least one interconnect member on the transparent substrate. The optical device includes a first surface coupled to the at least one interconnect member that extends to a second surface through an intermediate portion. An insulating layer encapsulates the optical device. The insulating layer includes a first surface that extends to a second surface. The first surface abuts the transparent substrate. A communication path extends between the first surface of the optical device and the second surface of the insulating layer. An electronic chip is mounted to the second surface of the insulating layer. The electronic chip includes a first surface and a second surface. The first surface is coupled to the communication path so as to form the three-dimensional stacked optical device.Type: ApplicationFiled: January 12, 2009Publication date: October 1, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Laurent Dellmann, Michel Despont, Bert J. Offrein
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Publication number: 20090083353Abstract: Optically coherent, two-port, serially cascaded-form optical delay line circuits can realize arbitrary signal processing functions identical to those of FIR digital filters with complex filter coefficients whilst maintaining a maximum optical transmission characteristic of 100%. The invention provides an iterative process for transitioning in a step-wise manner a filter function of an optical delay line circuit filter from a start filter function to a target filter function. The invention also describes a dynamic gain equalizer incorporating an optical delay line circuit filter.Type: ApplicationFiled: October 7, 2008Publication date: March 26, 2009Inventors: Tonnis M. Koster, Bert J. Offrein, Gian R. Salis
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Patent number: 7505284Abstract: An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals.Type: GrantFiled: May 3, 2006Date of Patent: March 17, 2009Assignee: International Business Machines CorporationInventors: Bert J. Offrein, Stefano S. Oggioni, Mauro Spreafico
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Patent number: 7486847Abstract: Considerable manufacturing efficiency and flexibility is provided by configuring the lower surface of a chip carrier to include multiple holes specifically designed to receive coupling fibers. By appropriately positioning these holes, the coupling fibers can be aligned with necessary optical elements of optoelectronic chips carried by the chip carrier. Similarly, the opposite end of the fibers can be appropriately configured and positioned for coupling to waveguide structures or fiber optic structures which may be embedded in printed circuit boards. By utilizing an appropriately configured chip carrier, and related fibers, a signal transmission structure is achieved which effectively bridges the gap between a chip carrier and a related printed circuit board.Type: GrantFiled: March 31, 2008Date of Patent: February 3, 2009Assignee: International Business Machines CorporationInventors: Laurent A. Dellmann, Folkert Horst, Bert J. Offrein
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Patent number: 7480426Abstract: A method of forming a three-dimensional stacked optical device includes mounting at least one optical device to a transparent substrate, fabricating a plurality of vias though the at least one optical device, and filling the plurality of vias with a conductive material member that forms a plurality of backside contacts on the at least one optical device. The method further requires mounting an electronic chip to the plurality of backside contacts on the at least one optical device, fabricating a plurality of vias in the electronic chip, filling each of the plurality of vias in the electronic chip with a another conductive material member, and depositing a backside contact at each of the plurality of vias formed in the electronic chip. Each backside contact is electrically connected to corresponding ones of the another conductive material member positioned in respective ones of the plurality of vias formed in the electronic chip.Type: GrantFiled: March 25, 2008Date of Patent: January 20, 2009Assignee: International Business Machines CorporationInventors: Laurent Dellmann, Michel Despont, Bert J. Offrein