THREE-DIMENSIONAL STACKED OPTICAL DEVICE
A three-dimensional stacked optical device includes a transparent substrate, and an optical device having a main body mounted to the transparent substrate. The optical device includes a plurality of vias that extend into the main body and do not extend into the transparent substrate. A conductive member is provided in each of the plurality of vias to form backside contacts. An electronic chip including a plurality of vias is mounted to the backside contacts on the optical device. Another conductive member is deposited in each of the plurality of vias formed in the electronic chip. The another conductive member forms additional backside contacts on the electronic chip.
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This application is a continuation application of U.S. Ser. No. 12/054,754, entitled “Method of Forming a Three-Dimensional Stacked Optical Device”, filed on Mar. 25, 2008, the disclosure of which is incorporated by reference herein in its entirety.
BACKGROUNDThis invention relates to the art of electronic devices and, more particularly, to a method of forming a three-dimensional stacked optical device.
Optical interconnect components are rapidly growing in popularity in the electronics industry. The need for higher communication bandwidth in newer electronic components is driving technology away from electrical communication busses. Electrical communication busses cannot meet increasing bandwidth requirements, predicted to exceed terabyte/second rates, foreseen for newer generation electrical devices. One technology currently being explored to meet the higher communication bandwidths is optical communication systems. However, even with the higher bandwidths afforded by optical communication systems, hundreds, up to more than a thousand, channels per processor module will be required to meet future communication needs. At present, existing optical packaging solutions present a challenge regarding assembly, cost and density to achieve a high number of channels. More specifically, current optical devices working at a standard wavelength of 850 nm emit and receive light on a side also provided with electrical contacts. Operational surfaces and contact on the same side limit packaging density and communication speeds.
SUMMARYIn accordance with an exemplary embodiment of the invention, a three-dimensional stacked optical device includes a transparent substrate, and at least one optical device having a main body mounted to the transparent substrate. The at least one optical device includes a plurality of vias that extend into the main body and do not extend into the transparent substrate. A conductive member is provided in each of the plurality of vias. The conductive member forms a backside contact at each of the plurality of vias. An electronic chip including a plurality of vias is mounted to the backside contacts on the optical device. Another conductive member is deposited in each of the plurality of vias formed in the electronic chip. The another conductive member forms additional backside contacts on the electronic chip.
Additional features and advantages are realized through the techniques of exemplary embodiments of the present invention. Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention. For a better understanding of the invention with advantages and features thereof, refer to the description and to the drawings.
The subject matter which is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other objects, features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
The detailed description explains the exemplary embodiments of the invention, together with advantages and features, by way of example with reference to the drawings.
DETAILED DESCRIPTIONWith initial reference to
Electronic device 2 also includes a plurality of optical devices 20-23, e.g., vertical cavity surface emitting laser (VCSEL) devices and photodiode (PD) devices, mounted to second surface 9 of substrate 4. However, it should be understood that the type of optical device employed can vary in accordance with exemplary embodiments of the present invention. In any event, as each optical device 20-23 includes similar packaging, a detailed description will be made referencing optical device 20 with an understanding that the remaining optical devices 21-23 include similar structure. As shown, optical device 20 includes a main body 29 having a first surface 30 that extends to a second surface 31 through an intermediate portion 32. Optical device 20 is mounted to second surface 9 of substrate 4 through a pair of mounting pads 33 and 34. Once mounted to substrate 4, each optical device 20-23 is thinned, i.e., processed or planarized to have a thickness of less than 20 μm so as to be suitable for further processing.
As best shown in
At this point, a plurality of vias 70-77 are formed in optical devices 20-23 as shown in
As best shown in
A corresponding plurality of conductive material members 170-180 are deposited in respective ones of vias 150-160. Conductive material members 170-180 provide a communication path between optical devices 20-23, driver chip 120 and external components (not shown). Towards that end, a plurality of backside contacts 200-210 are coupled to each of conductive material members 170-180 as shown in
While the preferred embodiment to the invention has been described, it will be understood that those skilled in the art, both now and in the future, may make various improvements and enhancements which fall within the scope of the claims which follow. These claims should be construed to maintain the proper protection for the invention first described.
Claims
1. A three-dimensional stacked optical device comprising:
- a transparent substrate;
- at least one optical device having a main body mounted to the transparent substrate, the at least one optical device including a plurality of vias that extend into the main body, the plurality of vias do not extend into the transparent substrate;
- a conductive member provided in each of the plurality of vias of the at least one optical device, the conductive member forming backside contacts on the at least one optical device;
- an electronic chip including a plurality of vias mounted to the backside contacts on the optical device; and
- another conductive member deposited in each of the plurality of vias formed in the electronic chip, the another conductive member forming additional backside contacts on the electronic chip.
2. The three-dimensional stacked optical device of claim 1, wherein the at least one optical device is embedded in an insulating layer.
3. The three-dimensional stacked optical device of claim 1, wherein the electronic chip is embedded in an isolating layer having an outer surface, the backside contacts deposited at each of the plurality of vias formed in the electronic chip rest upon the outer surface of the isolating layer.
Type: Application
Filed: Jan 16, 2009
Publication Date: Oct 1, 2009
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION (Armonk, NY)
Inventors: Laurent Dellmann (Adliswil), Michel Despont (Au), Bert J. Offrein (Schoenenberg)
Application Number: 12/355,081
International Classification: G02B 6/12 (20060101);