Patents by Inventor Biao Liu

Biao Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070263363
    Abstract: A fixing apparatus adapted for attaching a heat sink to a circuit board on which an electronic component is mounted includes a fastener and a back plate. The fastener comprises an elongated pressing part holding the heat sink in contact with the electronic component and two latching legs extending downward from two opposite ends of the pressing part. The latching legs each have at least one hook extending inward from a distal end thereof. The back plate comprises a main body and a plurality of connecting members at two opposite ends of the main body for extending upwardly through the circuit board to engage with the hooks of the fastener.
    Type: Application
    Filed: November 17, 2006
    Publication date: November 15, 2007
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: JIN-BIAO LIU, SHIH-HSUN WUNG, GUANG YU, CHUN-CHI CHEN
  • Patent number: 7289322
    Abstract: A heat sink includes a fin assembly (20) including a plurality of fin plates (22) and a fan (30) mounted on the fin assembly. Each fin plate includes a plurality of cutouts (226) defined on one edge thereof, and the cutouts of the fin plates cooperatively form a scraggy surface when the fin plates are assembled together. Airflow produced by the fan directly impinges on the scraggy surface thereby enhancing heat transferring between the fin plates and the airflow.
    Type: Grant
    Filed: October 24, 2005
    Date of Patent: October 30, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Publication number: 20070247819
    Abstract: A memory module assembly includes a memory card having a circuit board and a plurality of electronic components mounted on the circuit board. A pair of shells covers two faces of the memory card for dissipating heat generated by the electronic components of the memory card. A pair of clips each clamps the pair of shells and memory card. Each of the pair of clips has a pair of abutting pieces being pivotably connected together and resilient pressing the pair of shells toward the electronic components of the memory card. The abutting pieces of the pair of clips are detachably engaged with the pair of shells, and form protrusions thereon engaging in indentations defined in the shells.
    Type: Application
    Filed: April 24, 2006
    Publication date: October 25, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUN-CHI CHEN, SHIH-HSUN WUNG, GUANG YU, DA-YUAN ZHOU, JIN-BIAO LIU
  • Patent number: 7277287
    Abstract: A heat dissipation device comprises a seat for absorbing heat from a heat generating device. At least a heat pipe has a first section thereof thermally combined to the seat, and two second sections thereof extending from the first section and remotely from the seat. Pluralities of heat sinks are located on the seat. Each of the pluralities of heat sinks has a base and a plurality of fins integrally extending from the base and is made of aluminum extrusion. The bases of the heat sinks thermally sandwich the two second sections of the at least a heat pipe therebetween. At least one of the bases of the heat sinks is angled or perpendicular to the seat.
    Type: Grant
    Filed: March 20, 2006
    Date of Patent: October 2, 2007
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Publication number: 20070215335
    Abstract: A heat sink includes a base and a plurality of column-shaped fins. The base defines an array of blind holes therein. The fins threadedly engage in the base at the blind holes by self-tapping so that the fins are interferentially and intimately engaged with the base. The fins each include a head for facilitating to turn the fins, a terminated cone received in the blind holes and a spiral thread between the head and the terminated cone.
    Type: Application
    Filed: March 14, 2006
    Publication date: September 20, 2007
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Publication number: 20070165374
    Abstract: A heat dissipation device in a computer enclosure includes a heat spreader (20) mounted on a CPU (12), a first heat sink (30), a cooling fan (40) coupled to the first heat sink, a second heat sink (50), a heat pipe (80) mounted on the heat spreader and thermally connected the first heat sink and the second heat sink, a system fan (60) attached to the second heat sink, and a fan duct (70) interconnected between the cooling fan and the second heat sink. The system fan is positioned adjacent to louvers of the computer enclosure. An airflow generated by the cooling fan and the system fan flows through the first heat sink, then the fan duct, the second heat sink, and finally the louvers to leave the computer enclosure.
    Type: Application
    Filed: January 19, 2006
    Publication date: July 19, 2007
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Publication number: 20070144705
    Abstract: A heat sink for dissipating heat from an electronic element comprises a base with a plurality of first fins extending upwardly therefrom, a conducting member thermally contacting the base with a plurality of second fins extending from two opposite lateral face of the conducting member toward different directions and perpendicular to the first fins, a heat pipe connecting the base and the conducting member to transfer heat from the base to the conducting member.
    Type: Application
    Filed: December 28, 2005
    Publication date: June 28, 2007
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Publication number: 20070114006
    Abstract: A heat-dissipating fin assembly (1) includes a plurality of individual fin plates (10) arranged side by side. Each of the fin plates includes a main body (14) and a pair of flanges extending perpendicularly from opposite top and bottom sides of the main body. Each flange comprises a first plane extending from the main body and a second plane extending from the first plane. The second plane comprises a pair of engaging projections extending from two ends thereof. The second plane of a rear fin plate covers the first plane of an adjacent front fin plate. The rear and front fin plates are interlocked by the engaging projections of the rear fin plate bent to respectively engage two ends of the first plane of the front fin plate.
    Type: Application
    Filed: November 21, 2005
    Publication date: May 24, 2007
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Publication number: 20070091568
    Abstract: A heat sink includes a fin assembly (20) including a plurality of fin plates (22) and a fan (30) mounted on the fin assembly. Each fin plate includes a plurality of cutouts (226) defined on one edge thereof, and the cutouts of the fin plates cooperatively form a scraggy surface when the fin plates are assembled together. Airflow produced by the fan directly impinges on the scraggy surface thereby enhancing heat transferring between the fin plates and the airflow.
    Type: Application
    Filed: October 24, 2005
    Publication date: April 26, 2007
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Publication number: 20060273137
    Abstract: A heat dissipation device comprises a seat for absorbing heat from a heat generating device. At least a heat pipe has a first section thereof thermally combined to the seat, and two second sections thereof extending from the first section and remotely from the seat. Pluralities of heat sinks are located on the seat. Each of the pluralities of heat sinks has a base and a plurality of fins integrally extending from the base and is made of aluminum extrusion. The bases of the heat sinks thermally sandwich the two second sections of the at least a heat pipe therebetween. At least one of the bases of the heat sinks is angled or perpendicular to the seat.
    Type: Application
    Filed: March 20, 2006
    Publication date: December 7, 2006
    Applicant: FOXCONN TECHNOLOGY CO.,LTD.
    Inventors: Chun-Chi Chen, Shih-Hsun Wung, Guang Yu, Da-Yuan Zhou, Jin-Biao Liu
  • Patent number: 7076407
    Abstract: Models in compositional state systems are reduced by defining a set of events of interest and defining a transitive effect machine for components in the model relative to the events of interest. A transitive effect machine for a given component is defined by determining the transitive effects of events in the given component on other components in the model. Transitive effect machines are defined relative to reduced versions of other components in the model. The transitive effect machines are defined by successive assumptions of the reduced versions of the other components in the model and successively defined approximations to the transitive effect machine.
    Type: Grant
    Filed: August 24, 2001
    Date of Patent: July 11, 2006
    Inventor: Wayne Biao Liu
  • Patent number: 6772556
    Abstract: The invention is directed to a trap for insects, without killing them. It employs a housing, with an opening on one end, and at least one layer of parallel strings or line stretched across that opening. The distance between each string corresponds to the width of the body of the target insect. Some type of attractant is used to attract the target insect. Farmers, entomologists, and hobbyists will find this trap useful since it captures insects without killing them, thus permitting identification and further study.
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: August 10, 2004
    Assignee: The United States of America as represented by the Secretary of Agriculture
    Inventor: Yong Biao Liu
  • Patent number: 6766612
    Abstract: The invention is directed to an apparatus and method of treating agricultural commodities for pests. It is a portable, dismantleable box that can be erected around a stack or array of loaded shipping containers. An impermeably envelope is wrapped around the box and is used to create a controlled atmosphere for treatment of the contents of the shipping containers. This is achieved by creating hypobaric conditions inside the impermeable envelope, by introducing pesticide to the impermeable envelope, or by some combination of both vacuum and pesticide. Finally, the apparatus may be used for postharvest storage of materials that are susceptible to spoilage or pest damage.
    Type: Grant
    Filed: May 1, 2003
    Date of Patent: July 27, 2004
    Assignee: The United States of America as represented by the Secretary of Agriculture
    Inventor: Yong-Biao Liu
  • Publication number: 20030158720
    Abstract: Models in compositional state systems are reduced by defining a set of events of interest and defining a transitive effect machine for components in the model relative to the events of interest. A transitive effect machine for a given component is defined by determining the transitive effects of events in the given component on other components in the model. Transitive effect machines are defined relative to reduced versions of other components in the model. The transitive effect machines are defined by successive assumptions of the reduced versions of the other components in the model and successively defined approximations to the transitive effect machine.
    Type: Application
    Filed: August 24, 2001
    Publication date: August 21, 2003
    Applicant: Wayne Biao Liu
    Inventor: Wayne Biao Liu