Abstract: A method, a system and a computer readable medium for dynamic mode AFM amplitude versus distance curve acquisition. In an embodiment, a constant force feedback mechanism is enabled prior to the first time an AFM probe tip contacts a sample. The feedback mechanism setpoint is iteratively reduced while at least phase and amplitude of the probe tip are recorded as a function of the relative z-height of a cantilever coupled to the probe tip. The feedback mechanism setpoint may be repeatedly swept between upper and lower bounds to average out drift between the cantilever and sample. Upon detecting a threshold, an absolute tip-to-sample distance is determined and correlated to the relative z-heights. The amplitude and phase data recorded prior to tip-sample contact is then determined as a function of absolute tip-to-sample distance.

Abstract: A thermal module includes a mounting plate, a centrifugal fan with a fin assembly arranged at an air outlet thereof, and a heat pipe connected the fin assembly with the heat mounting plate. The centrifugal fan includes a fan housing and an impeller rotatably received in the fan housing. The fan housing is disposed immediately neighboring to the mounting plate and mounted to a lateral side of the mounting plate via a securing structure formed between the fan housing and the mounting plate. The fan housing consists of a base and a cover. The base is made of a plastic material.

Abstract: A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending towards the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole.

Abstract: A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit.

Abstract: A heat dissipation device for dissipating heat generated by an electronic device on a printed circuit board includes a heat sink and a plurality of mounting devices. A plurality of retaining pillars are secured on the printed circuit board at positions around the electronic device. Each of the mounting devices includes a fixing portion connecting with the heat sink, a mounting portion extending from the fixing portion and a locating portion extending from the mounting portion to a position below the mounting portion. The retaining pillars on the printed circuit board extend through the locating portions and abut against bottoms of the mounting portions to accurately position the heat dissipation device on the electronic device on the circuit board before fasteners are brought to extend through the mounting portions to screw in the retaining pillars.

Abstract: In one exemplary embodiment the invention provides methods for post harvest disinfection of agricultural commodities. The methods are practiced on agricultural commodities without damaging or otherwise injuring the commodities by way of the treatment. In other exemplary embodiments, the invention provides containers appropriate for carrying out the disclosed methods of disinfective treatment.

Abstract: A heat sink for dissipating heat from an electronic element comprises a base with a plurality of first fins extending upwardly therefrom, a conducting member thermally contacting the base with a plurality of second fins extending from two opposite lateral face of the conducting member toward different directions and perpendicular to the first fins, a heat pipe connecting the base and the conducting member to transfer heat from the base to the conducting member.

Abstract: A heat dissipation device for dissipating heat generated by an electronic device on a printed circuit board includes a heat sink and a plurality of mounting devices. A plurality of retaining pillars are secured on the printed circuit board at positions around the electronic device. Each of the mounting devices includes a fixing portion connecting with the heat sink, a mounting portion extending from the fixing portion and a locating portion extending from the mounting portion to a position below the mounting portion. The retaining pillars on the printed circuit board extend through the locating portions and abut against bottoms of the mounting portions to accurately position the heat dissipation device on the electronic device on the circuit board before fasteners are brought to extend through the mounting portions to screw in the retaining pillars.

Abstract: A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending toward the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole.

Abstract: A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.

Abstract: A heat dissipation device is used for removing heat from at least two adjacent first and second electronic devices in a computer enclosure. The heat dissipation device includes a first heat sink mounted on the first electronic device and a second heat sink mounted on the second electronic device. The first heat sink includes a base, a first fin unit mounted on the base and two heat pipes extending from the base outwardly. Second and third fin units engage with the two heat pipes, respectively. The first, second and third fin units are located adjacent to first, second and third openings of the computer enclosure, respectively. The second heat sink is located among the first, second and third fin units of the first heat sink.

Abstract: A heat dissipation device includes a heat sink, a fan and a fan holder locking the fan on the heat sink. The heat sink defines two slots in two opposite lateral sides thereof. The fan holder includes two opposite first beams and another two opposite second beams. Each of the first beams has a latching leg extending downwardly therefrom and two locking tabs extending upwardly therefrom. The two latching legs are engaged into the two slots of the heat sink. The locking tabs are fastened to two lateral sides of the fan.

Abstract: A method of processing an external service request in a storage area network (SAN) is used for responding a service request in the SAN with multiple controllers, and the method includes the following steps. A first controller of the SAN receives a request packet of an external network. When the first controller determines that the request packet must be transmitted to a second controller actually providing service in an internal network, the request packet is transmitted to the second controller. The second controller receives the request packet, and parses a source address contained therein for recording. The second controller executes an operation instruction corresponding to the request packet, and then generates an acknowledge packet. The second controller takes the source address as a destination address of the acknowledge packet and directly transmits the acknowledge packet to an original request initiator.

Abstract: A heat sink includes a plurality of fins. Each of fins includes a body having two locking members at a top portion and a lower portion thereof respectively. Each of the locking members includes two parallel clasping plates. The two clasping plates of one of the fins clasp the main body of another fin adjacent said one fin, thereby interlocking the fins together.

Abstract: A heat dissipation device includes a heat sink, a fan and a fan holder locking the fan on the heat sink. The heat sink defines two slots in two opposite lateral sides thereof. The fan holder includes two opposite first beams and another two opposite second beams. Each of the first beams has a latching leg extending downwardly therefrom and two locking tabs extending upwardly therefrom. The two latching legs are engaged into the two slots of the heat sink. The locking tabs are fastened to two lateral sides of the fan.

Abstract: A method, a system and a computer readable medium for dynamic mode AFM amplitude versus distance curve acquisition. In an embodiment, a constant force feedback mechanism is enabled prior to the first time an AFM probe tip contacts a sample. The feedback mechanism setpoint is iteratively reduced while at least phase and amplitude of the probe tip are recorded as a function of the relative z-height of a cantilever coupled to the probe tip. The feedback mechanism setpoint may be repeatedly swept between upper and lower bounds to average out drift between the cantilever and sample. Upon detecting a threshold, an absolute tip-to-sample distance is determined and correlated to the relative z-heights. The amplitude and phase data recorded prior to tip-sample contact is then determined as a function of absolute tip-to-sample distance.

Abstract: A system and a method for rapidly diagnosing bugs of system software are apply for rapidly localizing a system program fault that causes a system error and then feeding back to a subscriber. First, according to the subscriber's requirement, a program of system fault analysis standard is preset and written into the system. Next, a plurality of fault insertion points is added into a program module of the system according to the subscriber's requirement for the precision of the fault analysis result. Then, fault management information is generated at the fault insertion points during the running process of the system program, and the management information is monitored for collecting relevant system fault data. After that, the collected system fault data is analyzed in real time through the program of system fault analysis standard, so as to obtain the minimum fault set for causing the system error.

Abstract: A heat dissipation device assembly is mounted on a printed circuit board (80). First and second electronic components (82, 84) are mounted on the printed circuit board. The heat dissipation device assembly includes a first heat sink (10) in thermal contact with the first electronic component, and a second heat sink (20) in thermal contact with the second electronic component. A spring tab (24) is sandwiched between the first and second heat sinks for providing spring force between the first and second heat sinks thus securely mounting the second heat sink on the second electronic component.

Abstract: A heat dissipation device in a computer enclosure includes a heat spreader (20) mounted on a CPU (12), a first heat sink (30), a cooling fan (40) coupled to the first heat sink, a second heat sink (50), a heat pipe (80) mounted on the heat spreader and thermally connected the first heat sink and the second heat sink, a system fan (60) attached to the second heat sink, and a fan duct (70) interconnected between the cooling fan and the second heat sink. The system fan is positioned adjacent to louvers of the computer enclosure. An airflow generated by the cooling fan and the system fan flows through the first heat sink, then the fan duct, the second heat sink, and finally the louvers to leave the computer enclosure.

Abstract: A heat dissipation device assembly is mounted on a printed circuit board (80). First and second electronic components (82, 84) are mounted on the printed circuit board. The heat dissipation device assembly includes a first heat sink (10) in thermal contact with the first electronic component, and a second heat sink (20) in thermal contact with the second electronic component. A spring tab (24) is sandwiched between the first and second heat sinks for providing spring force between the first and second heat sinks thus securely mounting the second heat sink on the second electronic component.