Patents by Inventor Bily Wang

Bily Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Folded heat sink for semiconductor device package
    Patent number: 6262481
    Abstract: A heat conducting metal is placed under a semiconductor chip and wraps around a substrate of the semiconductor device package to serve as the heat sink for the chip. The metal can wrap around a through-hole in the middle of the substrate, or wrap around the edge of the substrate. A metal plate can be placed between the chip and the heat conducting metal to hold the semiconductor chip.
    Type: Grant
    Filed: February 28, 2000
    Date of Patent: July 17, 2001
    Assignee: Harvatek Corporation
    Inventor: Bily Wang
  • Resettable fuse integrated circuit package
    Patent number: 6078092
    Abstract: A resettable fuse is connected in series with a bonding pad of an IC chip, In the presence of a high voltage surge, the resettable fuse breaks the connection temporary. After the surge is over, the resettable reset itself and the IC resumes operation.
    Type: Grant
    Filed: October 18, 1999
    Date of Patent: June 20, 2000
    Assignee: Harvatek Corporation
    Inventor: Bily Wang
  • Cavity grid array integrated circuit package
    Patent number: 5962922
    Abstract: A flat package for integrated circuit chip has a substrate with plated through holes. The top flange of a plated through hole is interconnected to a terminal of the IC chip. The bottom flange of the through hole has a cavity recessed into the substrates. A solder is placed between a circuit contact on a mother board and the bottom flange. Upon heating, the solder rises to fill the cavity, to make connection between the terminal on the IC chip and the contact on the mother board.
    Type: Grant
    Filed: March 18, 1998
    Date of Patent: October 5, 1999
    Inventor: Bily Wang