Abstract: Multiple LED matrix array circuit boards are pieced together a form a display panel. L-shape brackets are mounted on the bottom sides of the circuit boards and aligned with the butting edges of the circuit boards. The vertical butting walls are pressed together by clamps. A set screw is inserted in one jaw of the clamp to tighten the pressure between butting edges of the circuit boards. Another set screw is inserted on top of the clamp to align the adjacent boards vertically.

Abstract: A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer. this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

Abstract: An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.

Abstract: A circuit for driving a light-emitting diode (LED) display has multiple driving modes. The circuit has a control unit for outputting a mode-switching signal, a scan driving chip connecting with the control unit for providing a scan signal, a data driving chip connecting with the control unit and the scan driving chip for providing a data signal, a row control interface connecting with the row line, the control unit, the scan driving chip and the data driving chip to receive the mode-switching signal for switching an input end of the row control interface, and a column control interface connecting with the column line, the control unit, the scan driving chip and the data driving chip to receive the mode-switching signal for switching an input end of the column control interface.

Abstract: A wafer-level electro-optical semiconductor manufacture fabrication method improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer. This is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

Abstract: A photoelectric chip array package structure is convenient for chip installation and prevents external light interference. The photoelectric chip array package structure of the present invention has a substrate, multiple photoelectric chips, a package structure, and multiple contacts. It can be applied for advertising signs and improve the defect-free ratio and packaging quality. When applied for packaging light-emitting diodes (LEDs) or optical sensors, it easily meets the packaging requirements of electronic chips. The present invention disposes contacts at one side or multiple predetermined sides of the substrate to improve airtightness and convenience for installation. In addition, the present invention also disposes an external frame or optical gratings to prevent external light interference. Thus, the package structure of the present invention is superior to conventional package structures, and is cheap.

Abstract: A multi-wavelength white light emitting diode uses a UV light emitting diode chip and a blue light emitting diode chip to excite a red phosphor and a green phosphor and generates a white light emitting diode having good color rendering. The multi-wavelength white light emitting diode uses a UV light emitting diode chip that emits light having a wavelength of between 350˜430 nm to excite a red phosphor to emit red light having a wavelength of between 600˜700 nm. The present invention then uses a blue light emitting diode chip that emits light having a wavelength between of 400˜500 nm to emit blue light and uses the blue light emitting diode chip to excite a green phosphor to emit green light having a wavelength of between 490˜560 nm. Mixing the red light, the blue light and the green light forms a white light.

Abstract: A manufacturing method for a photoelectric package structure having a two-layered substrate and a control chip is proposed. The photoelectric package structure provided in the present invention is easy for installing chips and concentrates light emitted therefrom and prevents external light interference. The package structure of the present invention is superior to the conventional ones and the installation of the control chip doesn t degrade the light-emitting intensity. The major innovation of the present invention is disposing a control chip and a photoelectric chip (or multiple photoelectric chips) on the front surfaces of two semi-finished substrates respectively and then combining with the rear surfaces of the semi-finished substrates to form a substrate. Thus, the present invention is more convenient for installing the chips. In addition, the present invention also disposes an external frame or optical gratings to prevent external light interference.

Abstract: A drive circuit of display and method for the same are described. Each drive circuit in an LCD panel is sequentially controlled by scanning signals so as to store temporarily a frame of image data in each storage capacitor. Then, a synchronization drive element in each drive circuit receives a synchronization control signal, so that a frame of each storage capacitor may be meanwhile sent to light-emitting units for achievement of the synchronization display on the LCD panel. Besides, a discharge transistor may be added and is controlled by a discharge signal before the synchronization drive element turns ON, which may effectively eliminate a pre-frame on the LCD panel.

Abstract: A manufacturing method for a photoelectric package structure having a control chip is proposed. The photoelectric package structure concentrates light emitted therefrom, prevents external light interference and can be applied for advertising signs and backlight modules. Using the present invention increases the defect-free ratio and production quality. Applying the present invention for packaging light-emitting diode (LED) or optical sensor chips allows the necessary light-emitting requirements of electronic chips to be easily met. The package structure of the present invention is superior to conventional ones and the installation of the control chip doesn't reduce the light-emitting intensity. The major innovation of the present invention is disposing a photoelectric chip (or multiple photoelectric chips) on a control chip and then installing the control chip upon a substrate. Thus, installation-of the components is more convenient.

Abstract: A multi-function communication and navigation system includes a GPS and MCU module, a memory module, a sensor module, a power module, a HUD module, an audio input/output module and a Bluetooth module. The system can be a recorder for recording relevant mobile information in the memory module. The HUD module can project relevant information such as velocity, direction, time, date etc. onto a display area. Moreover, the communication message can be transformed into audible sounds for broadcasting, so that the system can be a wireless intercom device for communicating with other systems. Moreover, when a sensor module of the system receives a vibrating message such as a collision message, the system can automatically dial an emergency number and provide relevant location information via the Bluetooth module.

Abstract: A light module includes a lighting unit, a heat-dissipation plate and an insulative plate. The lighting unit has a leading contact. The heat-dissipation plate contacts the lighting module closely and has a channel corresponding to the leading contact. The insulative plate is disposed under the heat-dissipation plate, and has a predetermined conductive pattern arranged thereon and a through hole corresponding to the channel. The leading contact of the lighting unit penetrates through the channel of the heat-dissipation plate and the through hole of the insulative plate to electrically connect with the predetermined conductive pattern of the insulative plate.

Abstract: A backlight module arranged under a flat display includes a printed circuit board being parallel to the flat display and including a plurality of LEDs, a reflection portion being a reflection wall bent from a fringe of the LEDs to extend over the LEDs, and a guide light plate being parallel to the printed circuit board. The reflection portion includes an orientation wall parallel to the reflection wall and an outlet with a direction parallel to the printed circuit board. The guide light plate has an end connecting inside the outlet of the reflection portion, a light delivering surface adjacent to the flat display, and a reflection surface arranged at a bottom thereof.

Abstract: An LED package structure and a method for making the same are described. The LED package structure has at least one LED die, at least one metallic frame relating to the LED die, and an insulative body packaging the LED die and the metallic frame. The metallic frame has a first contact corresponding to the LED die and a second contact being relative to the first contact. The first and the second contacts inside the insulative body are electrically isolated from each other. The first contact has at least one recess around the LED die, and the second contact has at least one groove formed thereon.

Abstract: A wafer-level electro-optical semiconductor fabrication mechanism and method for the same which improves upon traditional electro-optical semiconductor grain packaging methods. The present invention electrically connects semiconductor grains to the grains on a top surface of a wafer. this is done by either screen-printing or steel board-printing solder or silver paste onto the wafer. After that, the wafer is processed using the following steps: processing the devices, bonding with wire, packaging the wafer and finally cutting the wafer. Using this method raises the production yield while production times and costs are reduced. The wafer-level electro-optical semiconductor fabrication mechanism comprises: a wafer, an electro-optical semiconductor grain and conductive materials.

Abstract: A light emitting diode chip or chips array mounted on a substrate is surrounded by one or more side walls. The wall has an uneven reflecting surface to diverge the light emitted from the LED chip or chip array. The wall may have a triangular cross-section so that the emitted light diverges in all directions. When three double-sided reflecting walls surround three LED panels, the reflected light becomes omnidirectional hemispherically and can be used in a light bulb.

Abstract: An LED packaging structure has a substrate having two holes formed thereon. One of two conductive elements extends through the two holes to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the holes to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.

Abstract: A method of manufacturing a substrate structure includes the steps of: (1) providing a metal substrate having a metal portion; (2) chemically etching a plurality of trenches in the metal substrate; (3) applying a polymer composite material into the trenches to form a substrate having a polymer composite portion abutted to the metal portion; (4) polishing a surface of the substrate to make a height of the polymer composite portion equal to that of the metal portion; (5) forming a covering material on the surface of the substrate; and (6) cutting the substrate via the polymer composite portion for decreasing cutting bur produced on the metal portion. Furthermore, the method is provided for combining the metal substrate and the polymer composite material, thereby to increase cutting precision and strength of the substrate structure.

Abstract: A package structure for an optical-electrical semiconductor is described. The package structure has a thermal conductive structure for heat transfer and is integrally formed in one piece to improve the structural strength thereof, while the thermal conductive structure prevent over-heating of the LED device for greater longevity. The package structure reduces the failure rate in production and has improved quality. When the present invention is applied in light-emitting diode packages, the special requirement can be reached and has better properties than the prior art.

Abstract: An LED lamp uses a plurality of LEDs as a light source. The LED lamp has a casing, a conduction layer, a PCB, a plurality of LED and a drive electronics. The conduction layer is placed in an inner of the casing. The conduction layer is metal, copper or aluminum, or nonmetal, silica gel or mica, for conducting the heat of the PCB caused by the current heating effects. The PCB placed on an upper surface of the conduction layer is for mounting the LED. Each LED is electrically connected to the PCB by way of shunt winding or in series for providing a light source. The drive electronics is electrically connected to the PCB for driving color rendering.