Abstract: A package substrate having a chip on a substrate has a die pad on the substrate. The chip is attached on the die pad via ah adhesive. A plurality of gold contacts is distributed on the die pad for electrically connecting to the chip. A plurality of traces is distributed around the die pad to connect to the chip via wires. An adhesive dike is formed between the die pad and the traces to prevent the adhesive from flowing out of the die pad when the chip is attached on the die pad.

Abstract: An optical projection device with a colored lighting module has a mask, a lighting module and a lens. The mask has a receiving cavity formed therein, a first opening and a second opening relating to the first opening, the first opening and the second opening both communicating with the receiving cavity and respectively formed on two opposing sides of the mask, and the mask has a reflection layer disposed in an interior surface thereof. The lighting module and the lens are respectively disposed by the first and second openings of the mask.

Abstract: A light source structure for a light emitting diode (LED) has a high modulating flexibility and a low manufacturing cost. The LED light source is a white light source for an electrical device. The LED light source structure is used to meet the illumination requirement of the electrical device and the benefit from the light source structure of LED is more modulating ability with a small volume. The Led light source structure has an electrical circuit substrate, a red light LED chip, a green light LED chip, a blue light LED chip, a controlling integral circuit chip and a certain shape of packaging material.

Abstract: Stacked metal sections serve as two leads of an IC package. In one embodiment, an IC chip is mounted on one section serving as the terminal for the bottom electrode of the chip, and the top electrode of the chip is wire-bonded to the other section serving as another terminal for the chip. The thin sheet metal permits narrower etched separation between the two metal sections. Stacking of two pre-etched thin sheet metals strengthens the substrate. The package is covered with glue to hold the two sections together. The stacked pre-etched metal sheets can serve as a common substrate for a matrix of IC packages, which can later be cut in two orthogonal directions to yield individual packages.

Abstract: Stacked metal sections serve as two leads of an IC package. In one embodiment, an IC chip is mounted on one section serving as the terminal for the bottom electrode of the chip, and the top electrode of the chip is wire-bonded to the other section serving as another terminal for the chip. The thin sheet metal permits narrower etched separation between the two metal sections. Stacking of two pre-etched thin sheet metals strengthens the substrate. The package is covered with glue to hold the two sections together. The stacked pre-etched metal sheets can serve as a common substrate for a matrix of IC packages, which can later be cut in two orthogonal directions to yield individual packages.

Abstract: Multiple LED matrix array circuit boards are pieced together a form a display panel. L-shape brackets are mounted on the bottom sides of the circuit boards and aligned with the butting edges of the circuit boards. The vertical butting walls are pressed together by clamps. A set screw is inserted in one jaw of the clamp to tighten the pressure between butting edges of the circuit boards. Another set screw is inserted on top of the clamp to align the adjacent boards vertically.

Abstract: A white light source is obtained by converting short wavelength color light emitted from a light emitting diode (LED). The conversion is achieved by covering the LED chip with a fluorescent glue. The LED chip is mounted on a split substrate, and the outer ends of the substrate serve as terminals for the LED. A wall may be erected around the LED chip to contain the fluorescent glue, and another transparent glue may be used to cover the fluorescent glue for protection.

Abstract: A colorless light approaching that of white light in nature, is produced by using a blue color LEDs and a green color LED are covered with a red color phosphorescent glue and a yellow phosphorescent glue in separate layers or a mixed layer.

Abstract: A colorless light approaching that of white light in nature, is produced by using no more than two color LEDs covered with one or more layers of complementary color phosphorescent glue on an insulating substrate.

Abstract: An array of light emitting diodes (LED) are laid out as a dot matrix array as a display panel. Each LED is accessed by two dimensional addressing from a first set of parallel horizontal interconnections and a second set of orthogonal interconnections. The two sets of orthogonal interconnections are printed on two sides of a substrate. One of the two electrodes of an LED, which mounted on the top of the substrate, is fed through the substrate with a via hole and connected to the orthogonal interconnection at the bottom of the substrate. The size of the display panel is configurable by removing certain rows and/or columns. More than one partitioned blocks can be pieced together by aligning and coupling the corresponding orthogonal interconnections through a motherboard.

Abstract: A white light source is obtained by converting short wavelength color light emitted from a light emitting diode (LED). The conversion is achieved by covering the LED chip with a fluorescent glue. The LED chip is mounted on a split substrate, and the outer ends of the substrate serve as terminals for the LED. A wall may be erected around the LED chip to contain the fluorescent glue, and another transparent glue may be used to cover the fluorescent glue for protection.

Abstract: A light emitting diode chip or chips array mounted on a substrate is surrounded by one or more side walls. The wall has an uneven reflecting surface to diverge the light emitted from the LED chip or chip array. The wall may have a triangular cross-section so that the emitted light diverges in all directions. When three double-sided reflecting walls surround three LED panels, the reflected light becomes omnidirectional hemispherically and can be used in a light bulb.

Abstract: A colorless light approaching that of white light in nature, is produced by using no more than two color LEDs covered with one or more layers of complementary color phosphorescent glue on an insulating substrate.

Abstract: A colorless light approaching that of white light in nature, is produced by using no more than two color LEDs covered with one or more layers of complementary color phosphorescent glue.

Abstract: Surface mount diodes are mass produced by first cutting a metal plate to form a plurality of vertical slits within metal plate. Parallel lines are cut midway between the slits to form wings for the slits. The wings are folded to form the bottoms for surface mounting. Glue is applied over the metal plate to form focusing cups.

Abstract: The bottom metal contacts of a surface mount LED are extended wider than the glue covering the LED. The extensions provide more area for soldering to a motherboard.

Abstract: A blue LED or ultra-violet (UV) LED chip is packaged with a cover of fluorescent material. When the LED emits blue or UV light, the light is converted into colorless or white light radiating from the package. The package is furnished with bottom contacts for surface mounting.

Abstract: The focusing cup of a LED package is coated exteriorly with or made of opaque material to reduce the spurious external light interference due to the reflections of the surfaces of focusing cup.