Abstract: Embodiments provide an electrostatic protection structure and a method for fabricating the electrostatic protection structure. The electrostatic protection structure includes: a first diode structure, where a first terminal of the first diode structure is connected to a ground terminal, and a second terminal of the first diode structure is connected to a signal terminal; and a second diode structure adjacent to the first diode structure, where a first terminal of the second diode structure is connected to a power supply terminal, and a second terminal of the second diode structure is connected to the signal terminal. A breakdown voltage of the first diode structure and/or a breakdown voltage of the second diode structure is less than a preset threshold. The technical solutions improves electrostatic discharge protection capability of an input/output terminal of an integrated circuit by doping the first diode structure or the second diode structure.

Abstract: A heat management apparatus comprises a first heat exchange portion, a second heat exchange portion and a throttle unit, wherein the first heat exchange portion is used for exchanging heat between a refrigerant throttled by the throttle unit, and a cooling liquid; and a first wall of the first heat exchange portion and a second wall of the second heat exchange portion are arranged opposite each other, such that the structure of the heat management apparatus is relatively compact.

Abstract: The disclosure provides optical fiber cable manufacturing equipment including a collective core portion including a plurality of optical fibers, a metal tape disposed outside the collective core portion, and a sheath portion disposed outside the metal tape, the optical fiber cable manufacturing equipment including: a pre-bonding portion configured to pre-bond the metal tape to the outside of the collective core portion; a first coating portion disposed behind the pre-bonding portion to coat a first adhesive over at least part of both ends of the metal tape; a bonding portion disposed behind the pre-bonding portion to bond the metal tape to the outside of the collective core portion with the both ends of the metal tape overlapping each other; a second coating portion disposed behind the bonding portion to coat a second adhesive over the outside of the metal tape; and a sheath fabrication portion disposed behind the second coating portion to cover the collective core portion to which the metal tape is bonded, w

Abstract: A heat exchange assembly, which comprises a first heat exchange part, a bridge, and a second heat exchange part, wherein the bridge is at least partially located between the first heat exchange part and the second heat exchange part; the bridge comprises two holes or grooves that face the first heat exchange part and may communicate with the first heat exchange part; the bridge comprises two holes or grooves that face the second heat exchange part and may communicate with the second heat exchange part; the bridge further comprises a third interface part provided with a third interface; and the bridge has a hole and/or groove that is in communication with the third interface.

Abstract: The present application provides a three-mode storage method for program blocks based on check, comprising: first dividing the program to be injected into N blocks and checking each block to obtain the first checksum; then injecting the program to be injected and the first checksum twice in the program storage area, and the two injected programs are noted as the main program and the backup program, respectively; dividing the main program into N blocks, and checking each program block to obtain the second checksum during program run; dividing the backup program into N blocks and checking each block to obtain the third checksum; and comparing the checksum, second checksum and third checksum: if the three are consistent, performing no operation; updating the program or checksum and checking again, if the three are inconsistent.

Abstract: The application provides a device, method and system for registration. The registration device includes a fixing member; a frame connected to the fixing member, at least one trackable element mounted on the frame; and a collection device connected to the fixing member, wherein the collection device is configured to simultaneously collect multiple point data from an object to be registered. The registration method includes obtaining simultaneously, by a registration device, a point cloud data from a surface of a cartilage of an object to be registered; and performing surface fitting based on the point cloud data to obtain a fitted surface of the cartilage of the object to be registered. The registration system includes the registration device; a first point cloud data acquisition module, configured to receive the point cloud data from the collection device; and a surface fitting module, configured for surface fitting with the point cloud data.

Abstract: Disclosed are a vehicle suspension spring device and a vehicle suspension system having the same. The vehicle suspension spring device includes a leaf spring unit comprising at least one leaf spring disposed in a lateral direction of a vehicle, a pair of first coupling parts provided at opposite ends of the leaf spring unit in a longitudinal direction and rotatably coupled to a pair of axles on which opposite wheels of the vehicle are mounted, and a pair of second coupling parts provided at two points between the opposite ends of the leaf spring unit in the longitudinal direction to be rotatably coupled to a subframe of the vehicle.

Abstract: A heat exchange apparatus and a manufacturing method therefor are disclosed. The heat exchange apparatus comprises a valve core part and a core body part. The valve core part is provided with a valve base part. The valve seat part is at least partly arranged in a first conduit. The valve base part is provided with a base section with a bottom opening and a middle section with a peripheral opening. The valve base part is provided with a throttling hole. The throttling hole is in communication with the peripheral opening and the bottom opening. The middle section is arranged on a sheet part and the peripheral opening is in communication with inter-sheets channels. The heat exchanging apparatus comprising a connecting element. The connecting element is at least partly inserted into the first conduit. The bottom opening is in communication with a connecting cavity.

Abstract: A heat exchange device including a valve element component, a core body component and a connecting member having a first end and a second end, and the second end is provided with a welding section and an adjacent section; the core body component is provided with a welding matching portion; the welding section is welded to the welding matching portion, and the adjacent section is adjacent to the welding section; the outer diameter of the welding section is smaller than or equal to the inner diameter of the welding matching portion, and the outer diameter of the adjacent section is smaller than or equal to the inner diameter of the welding matching portion; and the distance between the end of the welding matching portion away from the valve element component and the end of the welding section away from the valve element component is larger than or equal to zero.

Abstract: A semiconductor device includes a substrate, a first insulating layer on the substrate, source and drain patterns at spaced-apart locations on the first insulating layer, and a channel layer having a transition metal therein, such as a transition metal dichalcogenide. The channel layer extends on the first insulating layer and between the source and drain patterns. A second insulating layer is also provided, which extends on the channel layer and has a thickness less than a thickness of the first insulating layer. A gate structure is provided, which extends on the second insulating layer, and opposite the channel layer. The channel layer may include at least one of MoS2, WS2, MoSe2, WSe2, MoSe2, WTe2, and ZrSe2.

Abstract: Semiconductor devices having improved electrical characteristics are described, as are methods of fabricating the same. The semiconductor device may include a first gate electrode on a substrate and extending in a first direction, a second gate electrode on the substrate and running across the first gate electrode while extending in a second direction, and a channel structure between the second gate electrode and lateral surfaces in the second direction of the first gate electrode and between the second gate electrode and a top surface of the first gate electrode. The channel structure may include a first dielectric layer that covers in contact with the lateral surfaces and the top surface of the first gate electrode; a second dielectric layer on the first dielectric layer and in contact with the second gate electrode; and a channel layer between the first dielectric layer and the second dielectric layer.

Abstract: A light-emitting diode (LED) chip (2) comprises a substrate (20), an epitaxial structure (21), a transparent conductive layer (22), a passivation protective layer (23), and at least one electrode (25). The epitaxial structure (21) is disposed on the substrate (20). The transparent conductive layer (22) is disposed on the epitaxial structure (21). The transparent conductive layer (22) defines one or more first through holes (220) that extend through the transparent conductive layer (22). The passivation protective layer (23) is disposed on the transparent conductive layer (22). The passivation protective layer (23) defines one or more second through holes (230) that extend through the passivation protective layer (23). The electrode (25) is disposed on the passivation protective layer (23). The electrode (25) electrically connects the transparent conductive layer (11) through the one or more second through holes (230).

Abstract: Structures and methods for manufacturing photovoltaic devices by forming perovskite layers and perovskite precursor layers using vapor transport deposition (VTD) are described.

Abstract: Aspects of the present inventive concept provide a semiconductor device capable of enhancing performance and reliability through source/drain engineering in a transistor including an oxide semiconductor layer. The semiconductor device includes a substrate, a metal oxide layer disposed on the substrate, a source/drain pattern being in contact with the metal oxide layer and including a portion protruding from a top surface of the metal oxide layer, a plurality of gate structures disposed on the metal oxide layer with the source/drain pattern interposed therebetween and each including gate spacers and an insulating material layer, the insulating material layer being in contact with the metal oxide layer, and not extending along a top surface of the source/drain pattern, and a contact disposed on the source/drain pattern, the contact being connected to the source/drain pattern.

Abstract: The present disclosure provides a diode-triggered bidirectional silicon controlled rectifier and circuit. The silicon controlled rectifier includes: a P-type substrate; a first P well formed in the P-type substrate, a first P-type doped region and a first N-type doped region being formed in the first P well; a second P well formed in the P-type substrate, a third N-type doped region and a fourth P-type doped region being formed in the second P well; and an N well formed in the P-type substrate, a second P-type doped region, a second N-type doped region and a third P-type doped region being formed in the N well. The second N-type doped region is electrically connected with a positive electrode of a diode string, and the first P-type doped region and the fourth P-type doped region are electrically connected with a negative electrode of the diode string.

Abstract: A suspension for a vehicle may include: a main frame; a lower leaf spring installed on either side of the main frame; an upper leaf spring disposed above the lower leaf spring so as to be spaced apart from the lower leaf spring; a connection bracket supported by the upper leaf spring, and rotatably mounted on the main frame; an eye clip mounted on an end portion of the lower leaf spring, and connected to a wheel; and a rubber bush mounted on either side of the upper leaf spring, and connected to a vehicle body.

Abstract: A suspension for a vehicle may include: a center leaf spring; side leaf springs respectively installed on opposing sides of the center leaf spring; and mounting brackets configured to connect the center leaf spring and the side leaf springs, respectively, and to support the center leaf spring to be movable in a longitudinal direction.

Abstract: A ranging method and an apparatus thereof, a storage medium, and a terminal device. By adding a processing unit into a hardware abstraction layer of the terminal device, a software method is thus used to replace a physical proximity sensor (Psensor); in addition, costs are effectively reduced.

Abstract: Aspects of the present inventive concept provide a semiconductor device capable of enhancing performance and reliability through source/drain engineering in a transistor including an oxide semiconductor layer. The semiconductor device includes a substrate, a metal oxide layer disposed on the substrate, a source/drain pattern being in contact with the metal oxide layer and including a portion protruding from a top surface of the metal oxide layer, a plurality of gate structures disposed on the metal oxide layer with the source/drain pattern interposed therebetween and each including gate spacers and an insulating material layer, the insulating material layer being in contact with the metal oxide layer, and not extending along a top surface of the source/drain pattern, and a contact disposed on the source/drain pattern, the contact being connected to the source/drain pattern.

Abstract: An operation method of a controller for controlling a memory device includes: queuing an identifier of a logical address region associated with a read request from a host in a most recently used (MRU) entry of an internal logical address region queue; increasing a weighted value for a read count of the logical address region by a first value according to whether the identifier of the logical address region has been queued in the logical address region queue before being queued in the MRU entry; adding the weighted value to the read count of the logical address region; providing the host with a map segment corresponding to the logical address region according to a threshold of the read count; and controlling a read operation of the memory device based on a physical address according to whether the read request includes the physical address.