Abstract: A three-dimensional (3D) nonvolatile memory includes a stacked structure that includes a plurality of conductive layers that alternate with and are spaced apart from each other by a plurality of interlayer insulating layers. The stacked structure includes a first cell region, a second cell region spaced apart from the first cell region, and a connection region between the first cell region and the second cell region. The connection region includes a first step portion that contacts the first cell region and has a stepped shape that descends in a direction approaching the second cell region, a second step portion that contacts the second cell region and has a stepped shape that descends in a direction approaching the first cell region, and a connection portion that connects the first cell region and the second cell region.

Abstract: A nonvolatile memory device including a memory cell array having a plurality of planes; a plurality of page buffers arranged corresponding to each of the plurality of planes; and a control logic circuit configured to transmit a bit line setup signal to each of the plurality of page buffers. Each of the plurality of page buffers includes a precharge circuit configured to precharge a sensing node and a bit line in response to the bit line setup signal, and a shutoff circuit configured to perform a bit line shutoff operation in response to a bit line shutoff signal. The control logic circuit is configured to control a transition time when a level of the bit line setup signal is changed according to a gradient of the bit line shutoff signal which is changed from a first level to a second level.

Abstract: A nonvolatile memory device including a memory cell array having a plurality of planes; a plurality of page buffers arranged corresponding to each of the plurality of planes; and a control logic circuit configured to transmit a bit line setup signal to each of the plurality of page buffers. Each of the plurality of page buffers includes a precharge circuit configured to precharge a sensing node and a bit line in response to the bit line setup signal, and a shutoff circuit configured to perform a bit line shutoff operation in response to a bit line shutoff signal. The control logic circuit is configured to control a transition time when a level of the bit line setup signal is changed according to a gradient of the bit line shutoff signal which is changed from a first level to a second level.

Abstract: A memory device has a memory cell array with memory cells. A page buffer group generates page buffer signals according to a verify read result of the memory cells. A page buffer decoding unit generates a decoder output signal corresponding to the number of fail bits from the page buffer signals based on a first reference current. A slow bit counter outputs a count result corresponding to the number of fail bits from the decoder output signal based on a second reference current corresponding to M times the first reference current, where M is a positive integer. A pass/fail checking unit determines a program outcome with respect to the memory cells based on the count result and outputs a pass signal or a fail signal based on the determined program outcome.

Abstract: A nonvolatile memory device includes a memory cell array and a bad block remapping circuit. The memory cell array includes a first mat and a second mat that are paired with each other. The first mat includes a plurality of first memory blocks. The second mat includes a plurality of second memory blocks. A first selection memory block among the plurality of first memory blocks and a second selection memory block among the plurality of second memory blocks are accessed based on a first address. The bad block remapping circuit generates a first remapping address based on the first address when it is determined that the first selection memory block is defective. A first remapping memory block among the plurality of first memory blocks and the second selection memory block are accessed based on the first remapping address.

Abstract: A nonvolatile memory device including a memory cell array having a plurality of planes; a plurality of page buffers arranged corresponding to each of the plurality of planes; and a control logic circuit configured to transmit a bit line setup signal to each of the plurality of page buffers. Each of the plurality of page buffers includes a precharge circuit configured to precharge a sensing node and a bit line in response to the bit line setup signal, and a shutoff circuit configured to perform a bit line shutoff operation in response to a bit line shutoff signal. The control logic circuit is configured to control a transition time when a level of the bit line setup signal is changed according to a gradient of the bit line shutoff signal which is changed from a first level to a second level.

Abstract: A memory device has a vertical structure in which a row decoder, a page buffer, and a peripheral circuit are disposed under a memory cell array. The row decoder and the page buffer may be asymmetrically disposed. The peripheral circuit is disposed in an area where the row decoder and the page buffer are not disposed. The row decoder and the page buffer may be symmetrically disposed with respect to an interface of planes. The peripheral circuit may be disposed in an area including a part of the interface of the planes.

Abstract: A memory device has a memory cell array with memory cells. A page buffer group generates page buffer signals according to a verify read result of the memory cells. A page buffer decoding unit generates a decoder output signal corresponding to the number of fail bits from the page buffer signals based on a first reference current. A slow bit counter outputs a count result corresponding to the number of fail bits from the decoder output signal based on a second reference current corresponding to M times the first reference current, where M is a positive integer. A pass/fail checking unit determines a program outcome with respect to the memory cells based on the count result and outputs a pass signal or a fail signal based on the determined program outcome.

Abstract: A memory device has a memory cell array with memory cells. A page buffer group generates page buffer signals according to a verify read result of the memory cells. A page buffer decoding unit generates a decoder output signal corresponding to the number of fail bits from the page buffer signals based on a first reference current. A slow bit counter outputs a count result corresponding to the number of fail bits from the decoder output signal based on a second reference current corresponding to M times the first reference current, where M is a positive integer. A pass/fail checking unit determines a program outcome with respect to the memory cells based on the count result and outputs a pass signal or a fail signal based on the determined program outcome.

Abstract: A memory device includes a first semiconductor layer, a second semiconductor layer on the first semiconductor layer, and upper bit lines. The first semiconductor layer includes lower bit lines that extend in a first direction and are parallel to each other in a second direction perpendicular to the first direction, and a substrate. The second semiconductor layer includes vertical pillars extending in a third direction that is perpendicular to the first and second directions. The upper bit lines are connected to the vertical pillars and extend in the first direction on the second semiconductor layer. The upper bit lines are arranged to have a first pitch in the second direction. The lower bit lines are arranged to have a second pitch in the second direction. The first pitch and the second pitch have different lengths.

Abstract: A memory device has a vertical structure in which a row decoder, a page buffer, and a peripheral circuit are disposed under a memory cell array. The row decoder and the page buffer may be asymmetrically disposed. The peripheral circuit is disposed in an area where the row decoder and the page buffer are not disposed. The row decoder and the page buffer may be symmetrically disposed with respect to an interface of planes. The peripheral circuit may be disposed in an area including a part of the interface of the planes.

Abstract: A non-volatile memory includes a page buffer array in which page buffers are arranged in a matrix form. A method of operating the non-volatile memory includes selecting columns from among multiple columns of the page buffer array, and counting fail bits stored in page buffers included in the selected columns.

Abstract: A non-volatile memory device includes a substrate, a memory cell array on the substrate, a plurality of bonding pads, and a pad circuit. The memory cell array includes a plurality of gate conductive layers stacked on the substrate in a vertical direction and a plurality of channels penetrating into the plurality of gate conductive layers on an upper portion of the substrate. The plurality of bonding pads are on at least part of an upper portion of the memory cell array. The plurality of bonding pads are configured to electrically connect the non-volatile memory device to an external device. The pad circuit is between the substrate and the memory cell array. The pad circuit is electrically connected to at least one of the plurality of bonding pads.

Abstract: A memory device has a memory cell array with memory cells. A page buffer group generates page buffer signals according to a verify read result of the memory cells. A page buffer decoding unit generates a decoder output signal corresponding to the number of fail bits from the page buffer signals based on a first reference current. A slow bit counter outputs a count result corresponding to the number of fail bits from the decoder output signal based on a second reference current corresponding to M times the first reference current, where M is a positive integer. A pass/fail checking unit determines a program outcome with respect to the memory cells based on the count result and outputs a pass signal or a fail signal based on the determined program outcome.

Abstract: According to example embodiments of inventive concepts, a nonvolatile memory device includes a memory cell array, an address decoder, an input/output circuit, a voltage generation circuit, and control logic. The memory cell array includes a plurality of memory blocks on a substrate. Each of the memory blocks includes a plurality of strings connected between bit lines and a common source line. The address decoder is configured to measure impedance information of word lines of a selected memory block. The voltage generation circuit is configured to generate word line voltages to be applied to word lines, and at least one of the word line voltages includes an offset voltage and a target voltage. The control logic is configured to adjust a level of the offset voltage and the offset time depending on the measured impedance information of the word lines.

Abstract: A power management method includes receiving a first command with first address indicating a first high power operation that is immediately executed in a first memory die, after receipt of the first command, receiving a second command with a second address indicating a second high power operation, such that an immediate execution of the second high power operation would overlap the first high power operation, and delaying execution of second high power operation through a first waiting period that ends upon completion of the first high power operation, while applying a reference voltage to a second word line of the second memory die indicated by the second address.

Abstract: A power management method includes receiving a first command with first address indicating a first high power operation that is immediately executed in a first memory die, after receipt of the first command, receiving a second command with a second address indicating a second high power operation, such that an immediate execution of the second high power operation would overlap the first high power operation, and delaying execution of second high power operation through a first waiting period that ends upon completion of the first high power operation, while applying a reference voltage to a second word line of the second memory die indicated by the second address.

Abstract: Provided are a non-volatile memory device in which time required for programming may be saved, and a method of driving the same. The non-volatile memory device may include a memory cell array with a plurality of memory cells; an input/output buffer having a storage unit that stores data and indicator bits representing information regarding the data; a data scanning unit that receives the stored data from the input/output buffer in units of scanning, and that scans the received data, the received data being selectively programmed in the memory cells according to a result of scanning the data; and/or a control logic unit that controls the data stored in the input/output buffer in units of scanning to be selectively supplied to the data scanning unit based on the states of the indicator bits.

Abstract: Provided are a non-volatile memory device in which time required for programming may be saved, and a method of driving the same. The non-volatile memory device may include a memory cell array with a plurality of memory cells; an input/output buffer having a storage unit that stores data and indicator bits representing information regarding the data; a data scanning unit that receives the stored data from the input/output buffer in units of scanning, and that scans the received data, the received data being selectively programmed in the memory cells according to a result of scanning the data; and/or a control logic unit that controls the data stored in the input/output buffer in units of scanning to be selectively supplied to the data scanning unit based on the states of the indicator bits.

Abstract: A view port of chemical vapor deposition apparatus for manufacturing semiconductor devices prevents heat loss in a chamber during a plasma deposition process. The view port includes a bracket protruding at the circumference of an opening in an electrode serving as a wall of a chamber of the apparatus, a transparent window pressed by the bracket against the wall via an O-ring, a pivoting cap for capping an opening in the bracket aligned with the window, and heat-insulative material and/or a heating element integral with the cap so as to be positioned close to the window when the cap is closed. The heating element can be a resistive heating wire or a warm air duct formed by a hose or the like. During the deposition process, the temperature of the window is maintained, thereby minimizing the tendency of polymer to adhere to the window.