Patents by Inventor Boris Fishkin
Boris Fishkin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7980255Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluidnozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.Type: GrantFiled: August 28, 2007Date of Patent: July 19, 2011Assignee: Applied Materials, Inc.Inventors: Younes Achkire, Alexander Lerner, Boris T. Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavleiv, Haoquan Fang, Shijian Li, Guy Shirazi, Jianshe Tang
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Patent number: 7718011Abstract: A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. The invention includes spraying a line of fluid to a substrate, thereby creating an air/fluid interface line on the substrate; supplying a line of drying vapors to the air/fluid interface line, thereby creating a Marangoni drying effect along the air/fluid interface line; and moving the substrate relative to the air/fluid line. Numerous other aspects are provided.Type: GrantFiled: August 6, 2007Date of Patent: May 18, 2010Assignee: Applied Materials, Inc.Inventors: Boris Fishkin, Michael Sherrard
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Publication number: 20100006124Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.Type: ApplicationFiled: December 29, 2008Publication date: January 14, 2010Inventors: Younes Achkire, Alexander Lerner, Boris T. Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavleiv, Hoaquan Fang, Shijian Li, Guy Shirazi, Jianshe Tang
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Publication number: 20090241996Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.Type: ApplicationFiled: December 29, 2008Publication date: October 1, 2009Inventors: Younes Achkire, Alexander N. Lerner, Boris I. Govzman, Boris Fishkin, Michael N. Sugarman, Rashid A. Mavliev, Haoquan Fang, Shijian Li, Guy E. Shirazi, Jianshe Tang
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Patent number: 7513062Abstract: In a first aspect, a first method of drying a substrate is provided. The first method includes the steps of (1) lifting a substrate through an air/fluid interface at a first rate; (2) directing a drying vapor at the air/fluid interface during lifting of the substrate; and (3) while a portion of the substrate remains in the air/fluid interface, reducing a rate at which a remainder of the substrate is lifted through the air/fluid interface to a second rate. The drying vapor may form an angle of about 23° with the air/fluid interface and/or the second rate may be about 2.5 mm/sec.Type: GrantFiled: February 9, 2005Date of Patent: April 7, 2009Assignee: Applied Materials, Inc.Inventors: Younes Achkire, Alexander N Lerner, Boris Govzman, Boris Fishkin, Michael N Sugarman, Rashid A Mavliev, Haoquan Fang, Shijian Li, Guy E Shirazi, Jianshe Tang
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Publication number: 20070295371Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.Type: ApplicationFiled: August 28, 2007Publication date: December 27, 2007Inventors: Younes Achkire, Alexander Lerner, Boris Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavleiv, Haoquan Fang, Shijian Li, Guy Shirazi, Jianshe Tang
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Publication number: 20070272278Abstract: A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. A line of fluid is sprayed along a substrate surface forming an air/fluid interface line, and a line of drying vapor is supplied to the interface line to achieve Marangoni drying. Thus, a large portion of the substrate is simultaneously dried. A preferred apparatus employs a tank of cleaning and/or rinsing fluid. Above the tank fluid a source of rinsing fluid directs rinsing fluid to the surface of a substrate forming a meniscus on the substrate surface as the substrate is lifted from the cleaning fluid, and a drying vapor source directs drying vapor to the meniscus. The drying vapor lowers the surface tension of the meniscus, inducing a Marangoni flow of rinsing fluid from the substrate's surface, and thereby drying the substrate. The cleaning fluid tank has a substrate receiving and cleaning portion and a substrate rinsing portion.Type: ApplicationFiled: August 6, 2007Publication date: November 29, 2007Inventors: Boris Fishkin, Michael Sherrard
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Patent number: 7252098Abstract: A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. A line of fluid is sprayed along a substrate surface forming an air/fluid interface line, and a line of drying vapor is supplied to the interface line to achieve Marangoni drying. Thus, a large portion of the substrate is simultaneously dried. A preferred apparatus employs a tank of cleaning and/or rinsing fluid. Above the tank fluid a source of rinsing fluid directs rinsing fluid to the surface of a substrate forming a meniscus on the substrate surface as the substrate is lifted from the cleaning fluid, and a drying vapor source directs drying vapor to the meniscus. The drying vapor lowers the surface tension of the meniscus, inducing a Marangoni flow of rinsing fluid from the substrate's surface, and thereby drying the substrate. The cleaning fluid tank has a substrate receiving and cleaning portion and a substrate rinsing portion.Type: GrantFiled: September 22, 2003Date of Patent: August 7, 2007Assignee: Applied Materials, Inc.Inventors: Boris Fishkin, Michael Sherrard
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Publication number: 20060260653Abstract: A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. A line of fluid is sprayed along a substrate surface forming an air/fluid interface line, and a line of drying vapor is supplied to the interface line to achieve Marangoni drying. Thus, a large portion of the substrate is simultaneously dried. A preferred apparatus employs a tank of cleaning and/or rinsing fluid. Above the tank fluid a source of rinsing fluid directs rinsing fluid to the surface of a substrate forming a meniscus on the substrate surface as the substrate is lifted from the cleaning fluid, and a drying vapor source directs drying vapor to the meniscus. The drying vapor lowers the surface tension of the meniscus, inducing a Marangoni flow of rinsing fluid from the substrate's surface, and thereby drying the substrate. The cleaning fluid tank has a substrate receiving and cleaning portion and a substrate rinsing portion.Type: ApplicationFiled: July 31, 2006Publication date: November 23, 2006Inventors: Boris Fishkin, Michael Sherrard
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Publication number: 20060174921Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.Type: ApplicationFiled: April 4, 2006Publication date: August 10, 2006Inventors: Younes Achkire, Alexander Lerner, Boris Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavleiv, Haoquan Fang, Shijian Li, Guy Shirazi, Jianshe Tang
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Publication number: 20050241684Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.Type: ApplicationFiled: July 12, 2005Publication date: November 3, 2005Inventors: Younes Achkire, Alexander Lerner, Boris Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavleiv, Haoquan Fang, Shijian Li, Guy Shirazi, Jianshe Tang
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Publication number: 20050229426Abstract: In a first aspect, a first method of drying a substrate is provided. The first method includes the steps of (1) lifting a substrate through an air/fluid interface at a first rate; (2) directing a drying vapor at the air/fluid interface during lifting of the substrate; and (3) while a portion of the substrate remains in the air/fluid interface, reducing a rate at which a remainder of the substrate is lifted through the air/fluid interface to a second rate. The drying vapor may form an angle of about 23° with the air/fluid interface and/or the second rate may be about 2.5 mm/sec.Type: ApplicationFiled: February 9, 2005Publication date: October 20, 2005Inventors: Younes Achkire, Alexander Lerner, Boris Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavliev, Haoquan Fang, Shijian Li, Guy Shirazi, Jianshe Tang
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Patent number: 6955516Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.Type: GrantFiled: November 1, 2002Date of Patent: October 18, 2005Assignee: Applied Materials, Inc.Inventors: Younes Achkire, Alexander Lerner, Boris T. Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavliev, Haoquan Fang, Shijian Li, Guy Shirazi, Jianshe Tang
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Patent number: 6746544Abstract: A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. A line of fluid is sprayed along a substrate surface forming an air/fluid interface line, and a line of drying vapor is supplied to the interface line to achieve Marangoni drying. Thus, a large portion of the substrate is simultaneously dried. A preferred apparatus employs a tank of cleaning and/or rinsing fluid. Above the tank fluid a source of rinsing fluid directs rinsing fluid to the surface of a substrate forming a meniscus on the substrate surface as the substrate is lifted from the cleaning fluid, and a drying vapor source directs drying vapor to the meniscus. The drying vapor lowers the surface tension of the meniscus, inducing a Marangoni flow of rinsing fluid from the substrate's surface, and thereby drying the substrate. The cleaning fluid tank has a substrate receiving and cleaning portion and a substrate rinsing portion.Type: GrantFiled: October 25, 2001Date of Patent: June 8, 2004Assignee: Applied Materials Inc.Inventors: Boris Fishkin, Michael Sherrard
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Publication number: 20040055625Abstract: A method and apparatus for cleaning, rinsing and Marangoni drying substrates is provided. A line of fluid is sprayed along a substrate surface forming an air/fluid interface line, and a line of drying vapor is supplied to the interface line to achieve Marangoni drying. Thus, a large portion of the substrate is simultaneously dried. A preferred apparatus employs a tank of cleaning and/or rinsing fluid. Above the tank fluid a source of rinsing fluid directs rinsing fluid to the surface of a substrate forming a meniscus on the substrate surface as the substrate is lifted from the cleaning fluid, and a drying vapor source directs drying vapor to the meniscus. The drying vapor lowers the surface tension of the meniscus, inducing a Marangoni flow of rinsing fluid from the substrate's surface, and thereby drying the substrate. The cleaning fluid tank has a substrate receiving and cleaning portion and a substrate rinsing portion.Type: ApplicationFiled: September 22, 2003Publication date: March 25, 2004Applicant: Applied Materials, Inc.Inventors: Boris Fishkin, Michael Sherrard
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Publication number: 20030121170Abstract: In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.Type: ApplicationFiled: November 1, 2002Publication date: July 3, 2003Applicant: APPLIED MATERIALS, INC.Inventors: Younes Achkire, Alexander Lerner, Boris T. Govzman, Boris Fishkin, Michael Sugarman, Rashid Mavliev, Haoquan Fang, Shijian Li, Guy Shirazi
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Publication number: 20030010364Abstract: An improved method and apparatus for adjusting chemistry concentrations and temperatures within a substrate processing tank is provided. A first aspect may include checking the fluid level within the tank, and, if the level is higher than a predetermined upper level, bleeding an amount of fluid from the tank; if the level is lower than a predetermined lower level, flowing an amount of fluid to the tank, and if the level is between the predetermined upper and lower levels, bleeding an amount of fluid from the tank and flowing an amount of fluid to the tank. A second aspect may include flowing water into the tank at a flow rate at least equivalent to the flow rate of water required to achieve a chemistry spike of a predetermined concentration and volume prior to beginning the flow of chemicals. A third aspect may include a method and apparatus for heating or cooling chemistry to a predetermined temperature as the chemistry is recirculated.Type: ApplicationFiled: August 30, 2002Publication date: January 16, 2003Inventors: Alexander Lerner, Brian J. Brown, Boris Fishkin, Jonathan S. Frankel
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Publication number: 20020189643Abstract: A method and an apparatus that uses a surfactant to clean a hydrophobic wafer is provided. In a first aspect, the method may clean and dry a wafer without applying pure DI water to the wafer. In a second aspect, the method may clean a wafer by applying pure DI water to the wafer only for a short duration of time such that the DI water application ceases prior to or as soon as a surfactant solution is rinsed from the wafer thereafter the wafer is dried. In a further aspect a hydrophobic wafer is maintained wetted with surfactant as it is transferred between cleaning apparatuses and is rinsed via diluted surfactant or via a brief DI water spray and is thereafter dried.Type: ApplicationFiled: August 21, 2002Publication date: December 19, 2002Inventors: Yufei Chen, Brian J. Brown, Boris Fishkin, Fred C. Redeker
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Patent number: 6468362Abstract: A method and an apparatus that uses a surfactant to clean a hydrophobic wafer is provided. In a first aspect, the method may clean and dry a wafer without applying pure DI water to the wafer. In a second aspect, the method may clean a wafer by applying pure DI water to the wafer only for a short duration of time such that the DI water application ceases prior to or as soon as a surfactant solution is rinsed from the wafer thereafter the wafer is dried. In a further aspect a hydrophobic wafer is maintained wetted with surfactant as it is transferred between cleaning apparatuses and is rinsed via diluted surfactant or via a brief DI water spray and is thereafter dried.Type: GrantFiled: August 23, 2000Date of Patent: October 22, 2002Assignee: Applied Materials, Inc.Inventors: Youfel Chen, Brian J Brown, Boris Fishkin, Fred C Redeker
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Patent number: 6464799Abstract: An improved method and apparatus for adjusting chemistry concentrations and temperatures within a substrate processing tank is provided. A first aspect may include checking the fluid level within the tank, and, if the level is higher than a predetermined upper level, bleeding an amount of fluid from the tank; if the level is lower than a predetermined lower level, flowing an amount of fluid to the tank, and if the level is between the predetermined upper and lower levels, bleeding an amount of fluid from the tank and flowing an amount of fluid to the tank. A second aspect may include flowing water into the tank at a flow rate at least equivalent to the flow rate of water required to achieve a chemistry spike of a predetermined concentration and volume prior to beginning the flow of chemicals. A third aspect may include a method and apparatus for heating or cooling chemistry to a predetermined temperature as the chemistry is recirculated.Type: GrantFiled: May 30, 2000Date of Patent: October 15, 2002Assignee: Applied Materials, Inc.Inventors: Alexander Lerner, Brian J. Brown, Boris Fishkin, Jonathan S. Frankel