Abstract: An apparatus and method for installing an electrical support structure, such as a printed circuit board or card in a computerized device, are disclosed. In at least some embodiments, the apparatus includes a connector assembly that includes a first structure having a first guiding surface, a second structure having a second guiding surface, a third structure having at least one additional guiding surface that interfaces the other guiding surfaces, and an electrically conductive component supported by at least one of the structures. Movement of the first structure in relation to the second structure in a first direction causes additional movement of the third structure in a second direction due to interaction among the guiding surfaces. Further, at least a portion of the component moves, in response to the additional movement, to or away from a first position at which the component is capable of establishing an electrical connection.

Abstract: A heat sink configured for cooling an integrated circuit comprises a plurality of fins arranged in substantially parallel planes and separated by a plurality of gaps. The parallel planes are adapted for usage in an arrangement parallel to an airflow direction and having a leading edge with respect to the airflow direction. The fin plurality is arranged with leading edge portions that extend at least two different lengths and nearest neighboring fins of the planar fin plurality extend different lengths.

Abstract: An apparatus and method for installing an electrical support structure, such as a printed circuit board or card within a computerized device, are disclosed. In at least some embodiments, the apparatus includes a first structure, a second structure supported by the first structure and capable of movement with respect to the first structure along a first direction, and a third structure slidingly supported by the second structure. Sliding motion of the third structure with respect to the second structure results in movement of the third structure relative to the first structure that is along a second direction different from the first direction.

Abstract: An apparatus and method for installing an electrical support structure, such as a printed circuit board or card in a computerized device, are disclosed. In at least some embodiments, the apparatus includes a connector assembly that includes a first structure having a first guiding surface, a second structure having a second guiding surface, a third structure having at least one additional guiding surface that interfaces the other guiding surfaces, and an electrically conductive component supported by at least one of the structures. Movement of the first structure in relation to the second structure in a first direction causes additional movement of the third structure in a second direction due to interaction among the guiding surfaces. Further, at least a portion of the component moves, in response to the additional movement, to or away from a first position at which the component is capable of establishing an electrical connection.

Abstract: Systems, methodologies, media, and other embodiments associated with connecting a cable to a computer component are described. One exemplary system embodiment includes a component connector comprising at least one signal pin and a plurality of ground pins positioned along a parameter of the at least one signal pin to surround the at least one signal pin. The example system may also include a receptacle connected to and in electrical contact with the plurality of ground pins. The receptacle can be configured with an opening to allow a cable connector to connect to the at least one signal pin.

Abstract: A heat sink surface mounts to a printed circuit board in direct separation, thermal and physical, from components on the board. The heat sink cools the components by conducting heat from the components through the printed circuit board to the heat sink.

Abstract: A fastener assembly comprising a first wedge portion having an angled end, a second wedge portion having an angled end, and a fastener extending through the first wedge portion and the second wedge portion, wherein a portion of the fastener protrudes from one of the first and second wedge portions for interfacing with a component to be mounted, wherein the angled end of the first wedge portion and the angled end of the second wedge portion are interfaced when the fastener is extended through the first wedge portion and the second wedge portion.

Abstract: A processor module includes a processor and a voltage regulator both mounted on a carrier. The voltage regulator is mounted with its contacts under compression to ensure good electrical contact with pads on the carrier. Heat sinks mounted respectively on the processor and the voltage regulator are rigidly coupled to each other to provide rigidity to the module and thus maintain the desired compression of the voltage regulator contacts.

Abstract: Systems, methodologies, methods of manufacture, and other embodiments associated with semiconductor/processor module assemblies are described. One exemplary system embodiment includes a bolster plate assembly for a semiconductor module assembly that includes a bolster plate and a leaf spring pre-loaded onto the bolster plate. The example system may also include the leaf spring being releasably attached to the bolster plate and positioned to provide a force in a direction generally away from the bolster plate. The leaf spring can be configured to release from the bolster plate upon attaching the semiconductor module assembly to the bolster plate that causes the leaf spring to exert the force in the direction generally away from the bolster plate and against a semiconductor module assembly.

Abstract: A heat sink surface mounts to a printed circuit board in direct separation, thermal and physical, from components on the board. The heat sink cools the components by conducting heat from the components through the printed circuit board to the heat sink.

Abstract: Disclosed is a fan module. In one embodiment, the fan module includes a fan having an inlet end and an exit end, and a fan housing in which the fan is positioned, the fan housing including at least one angled interior wall adjacent the exit end of the fan that diffuses air downstream of the fan.

Abstract: Systems, methodologies, media, and other embodiments associated with a configurable heat sink are described. One exemplary system embodiment includes a base portion of a heat sink to which different accessories may be removably attached. The example system may include a first accessory like a cover that forms an assembly with the base portion of the heat sink and causes the assembly to operate in a first manner.

Abstract: Systems, methodologies, and other embodiments associated with a heat sink with a fin configured with a stator blade are described. One exemplary system embodiment includes a heat sink apparatus configured to experience a fan-assisted air flow. The example heat sink apparatus may be configured to include a fan that is configured to produce an air flow in the heat sink apparatus and a heat sink that houses the fan. The example heat sink may include a base and fins that are configured with stator blades.

Abstract: Example systems and methods associated with positioning and securing an electronic module to a circuit board are described. In one embodiment, an electronic module comprises at least one connectible portion configured to connect to a circuit board and at least one extended portion having an opening therethrough. In one example, the opening can be configured to maintain a threaded device and to allow the threaded device to move within the opening.

Abstract: Systems, methodologies, media, and other embodiments associated with connecting a cable to a computer component are described. One exemplary system embodiment includes a component connector comprising at least one signal pin and a plurality of ground pins positioned along a parameter of the at least one signal pin to surround the at least one signal pin. The example system may also include a receptacle connected to and in electrical contact with the plurality of ground pins. The receptacle can be configured with an opening to allow a cable connector to connect to the at least one signal pin.

Abstract: A variable-gap thermal-interface device for transferring heat from a heat source to a heat sink is provided. The device comprises a multi-axis rotary spherical joint comprising a spherically concave surface having a first radius of curvature in slideable contact with a spherically convex surface having the same first radius of curvature. The device further comprises a block having a proximal end rotatably coupled with the heat sink through the rotary spherical joint and having a distal end opposite the proximal end. The device further comprises a wedge having a variable thickness separating a first surface and a second surface opposite and inclined relative to the first surface, such that the first surface is thermally coupled with the distal end of the block, and the second surface is thermally coupled with the heat source.

Abstract: A cable management device includes a housing having a forward end, a rearward end, a base, opposing sidewalls, and a pair of vertically-spaced cross-members extending laterally within the housing between the sidewalls. A cable interconnecting electronic devices is routed forward and upwardly around the lower cross-member, rearwardly between the cross-members, rearward and upwardly around the upper cross-member and forwardly out of the housing forward end. The segment of cable extended out of the housing forward end may be pushed longitudinally along the segment back into the cable management device for stowage and subsequently extended back out of the device when needed.

Abstract: A method comprising facilitating a signal path from a board through an interconnect to a cable; and substantially electrically shielding the signal path with the interconnect.

Abstract: Disclosed is an electronic board comprising a plurality of individual devices, each device having a plurality of connectors, the connectors mated to receptacles on the board, and a heat dissipating cover connected to the board and forming a cavity incarcerating the plurality of devices, the cover thermally contacting a plurality of the individual devices, the cover having a dimensional pattern such that its outer surface area is greater than its planar area.

Abstract: In one embodiment, an apparatus for facilitating installation of a shroud on a pin grid comprises a first alignment structure including a first plurality of longitudinal elements adapted to be inserted within each gap of the pin grid along a first direction and a first handle extending in a perpendicular manner to the plurality of longitudinal elements, and a second alignment structure including a second plurality of longitudinal elements adapted to be inserted within each gap of the pin grid along a second direction and a second handle extending in a perpendicular manner to the second plurality of longitudinal elements, wherein when the first alignment structure and the second alignment structures are inserted within the pin grid, the first and second handles form at least a partial frame structure to receive the shroud in a position to receive pins of the pin grid.