Abstract: A swing trainer configured to draw the elbows of the player together by the cocking of the player's wrists. The swing trainer includes arm mounts configured to mount to a player's arms at an intermediate position; and a link with at least a portion connected to the mounts and extending therebetween and arranged such that the portion of the link between the arms is configured to shorten during a swing of a stroke to inhibit splaying of the elbows of the player during the stroke, the link being slidably connected to the one of the mounts so it may slide past. A corresponding method of swing training using said swing trainer is also disclosed.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Abstract: A dual-direction piston-based actuator housing assembly has a housing disposed over a hollow cylindrical liner configured to accept within a movable piston. A compression block having a pin engagement hole is disposed adjacent to a proximal end of the liner. A tension strap is disposed over the compression block, the tension strap starting from a first end near the proximal end of the liner, extending around the engagement hole and back to a second end near the proximal end of the liner. An overwind extends over the first and second ends of the tension strap, over the compression block, and over the proximal end of the housing. A tension clip is disposed at the distal end of the liner and embedded within the housing. The housing, tension strap and overwind may be a continuous fiber reinforced plastic composite and the compression block may be a chopped fiber filled thermoplastic composite.

Abstract: A putting training device attachment including a shaft mount for mounting on a putter shaft; a pendulum assembly mounted on the mount; an indicating gauge connected to the pendulum assembly for indicating a preferred track for the pendulum. A putter is described for training.

Abstract: A swing trainer configured, to draw the elbows of the player together by the cocking of the player's wrists. The swing trainer includes arm mounts configured to mount to a player's arms at an intermediate position; and a link with at least a portion connected to the mounts and extending therebetween and arranged such that the portion of the link between the arms is configured to shorten during a swing of a stroke to inhibit splaying of the elbows of the player during the stroke, the link being slidably connected to the one of the mounts so it may slide past. A corresponding method of swing training using said swing trainer is also disclosed.

Abstract: A practice club for practicing a sport is described, the practice club including a club shaft; an extendible bump assembly including a stopper movable between a rest position in which it rests against a mounting stop, and an extended position in which the stopper extends a selected distance from the stop. There is also described a sports club or bat with a tension indicator disposed on a shaft of the practice club or bat to indicate tension of an inextensible stringer or resilient element in or on the practice club or bat.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Abstract: A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Abstract: A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.

Abstract: An air-to-air background-oriented Schlieren system and method for measuring and rendering visible density changes in air that cause a refractive index change by an airborne vehicle. A sensor aircraft equipped with a high-speed visible spectrum camera travels at low airspeed on a predetermined route and on a level altitude over a background having consistent contrast and sunlight reflectivity. The target aircraft, traveling on the same predetermined route but at an altitude between the sensor aircraft and the ground (background) passes beneath the sensor aircraft. The camera on the sensor aircraft captures a series of images including a reference image immediately before the target aircraft enters the image frame followed by several data images as the target aircraft passes through the image frame. The data images are processed to calculate density gradients around the target aircraft. These density gradients include shockwaves, vortices, engine exhaust, and wakes.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Abstract: A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Abstract: A method of forming a plurality of electronic component packages includes attaching electronic components to a carrier, wherein high aspect ratio spaces exist between the electronic components. A dielectric sheet is laminated around the electronic components thus filling the spaces and forming a package body. The spaces are completely and reliably filled by the dielectric sheet and thus the package body has an absence of voids. Further, an upper surface of the package body is planar, i.e., has an absence of ripples or other non-uniformities. Further, lamination of the dielectric sheet is performed with a low cost lamination system.

Abstract: A staggered die MEMS package includes a substrate having a converter cavity formed therein. A converter electronic component is mounted within the converter cavity. Further, a MEMS electronic component is mounted to both the substrate and the converter electronic component in a staggered die arrangement. By staggering the MEMS electronic component directly on the converter electronic component instead of locating the MEMS electronic component in a side by side arrangement with the converter electronic component, the total package width of the staggered die MEMS package is minimized. Further, by locating the converter electronic component within the converter cavity and staggering the MEMS electronic component directly on the converter electronic component, the total package height, sometimes called Z-height, of the staggered die MEMS package is minimized.

Abstract: A redistribution pattern is formed on active surfaces of electronic components while still in wafer form. The redistribution pattern routes bond pads of the electronic components to redistribution pattern terminals on the active surfaces of the electronic components. The bond pads are routed to the redistribution pattern terminals while still in wafer form, which is a low cost and high throughput process, i.e., very efficient process.

Abstract: A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.