Abstract: Methods, systems, and computer readable media for a tunable filter employing feedforward cancellation are disclosed. According to one aspect, the subject matter described herein includes a tunable transmissive filter that includes a splitter for splitting an input signal into a first signal and a second signal, a first modifier circuit for modifying a characteristic of the first signal to produce a modified first signal, a second modifier circuit for using feedforward cancellation to modify a characteristic of the second signal to produce a modified second signal, the second modifier circuit including an N-path filter, N being an integer greater than 0; and a combiner for combining the modified first signal and the modified second signal to produce a filtered output signal having a bandpass response.

Abstract: A phased-array receiver that may be effectively implemented on a silicon substrate. A receiver includes multiple radio frequency (RF) front-ends, each configured to receive a signal with a given delay relative to the others such that the gain of the received signal is highest in a given direction. The receiver also includes a power combination network configured to accept an RF signal from each of the RF front-ends and to pass a combined RF signal to a down-conversion element, where the power distribution network includes a combination of active and passive components. Each RF front-end includes a phase shifter configured to delay the signal in accordance with the given direction and a variable amplifier configured to adjust the gain of the signal.

Abstract: An apparatus and method to control signal phase in a radio device includes an analog phase rotator that accepts differential in-phase (I) and quadrature (Q) inputs, connected in two differential pairs. The analog phase rotator is driven by a local oscillator and is configured to control a phase of the local oscillator's output. A phase error determination module is configured to determine phase error information based on received I and Q (IQ) signal values. A phase correction module is configured to derive from the received IQ signal values a correction signal and apply the correction signal to the phase rotator in a path of the local oscillator.

Abstract: Methods, systems, and computer readable media for a tunable filter employing feedforward cancellation are disclosed. According to one aspect, the subject matter described herein includes a tunable transmissive filter that includes a splitter for splitting an input signal into a first signal and a second signal, a first modifier circuit for modifying a characteristic of the first signal to produce a modified first signal, a second modifier circuit for using feedforward cancellation to modify a characteristic of the second signal to produce a modified second signal, the second modifier circuit including an N-path filter, N being an integer greater than 0; and a combiner for combining the modified first signal and the modified second signal to produce a filtered output signal having a bandpass response.

Abstract: An apparatus and method to control signal phase in a radio device includes an analog phase rotator that accepts differential in-phase (I) and quadrature (Q) inputs, connected in two differential pairs. The analog phase rotator is driven by a local oscillator and is configured to control a phase of the local oscillator's output. A phase error determination module is configured to determine phase error information based on received I and Q (IQ) signal values. A phase correction module is configured to derive from the received IQ signal values a correction signal and apply the correction signal to the phase rotator in a path of the local oscillator.

Abstract: A system and method is shown for receiving microwave/millimeter-wave signals. The system and method are balanced and can be effectively implemented on a silicon substrate using single pole double throw switches.

Abstract: A staged rocket apparatus includes first and second stages connected by a releasable connector. A plurality of pressurized gas struts are connected between the first and second stages and provide a separating force urging the first and second stages apart. The gas struts are held in a telescopingly collapsed first position by the releasable connector. The separating force is maintained at a minimum value so long as the releasable connector holds the struts in their first position. When the releasable connector is disconnected the separating force increases due to gas flow through a metering passage having a progressively increasing flow area from a high pressure chamber to a low pressure chamber.

Abstract: A phased-array receiver that may be effectively implemented on a silicon substrate. A receiver includes multiple radio frequency (RF) front-ends, each configured to receive a signal with a given delay relative to the others such that the gain of the received signal is highest in a given direction. The receiver also includes a power combination network configured to accept an RF signal from each of the RF front-ends and to pass a combined RF signal to a down-conversion element, where the power distribution network includes a combination of active and passive components. Each RF front-end includes a phase shifter configured to delay the signal in accordance with the given direction and a variable amplifier configured to adjust the gain of the signal.

Abstract: A phased-array transmitter and receiver that may be effectively implemented on a silicon substrate. The transmitter distributes to front-ends, and the receiver combines signals from front-ends, using a power distribution/combination tree that employs both passive and active elements. By monitoring the power inputs and outputs, a digital control is able to rapidly provide phase and gain correction information to the front-ends. Such a transmitter/receiver includes a plurality of radio frequency (RF) front-ends and a power splitting/combining network that includes active and passive components configured to distribute signals to/from the front-ends.

Abstract: A radio-frequency integrated circuit chip package has N integrated patch antennas, N being at least one. The package includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn includes at least one generally planar ground plane spaced inwardly from the N generally planar patches and parallel thereto. The ground plane is formed without any coupling apertures therein. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and parallel thereto, and spaced outwardly from the generally planar ground plane and parallel thereto. Furthermore, the main portion includes at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, and the N generally planar patches and the chip are located in the antenna cavity. The package is formed without reflectors. Fabrication techniques are also described.

Abstract: A radio-frequency integrated circuit chip package has at least one integrated antenna. The package includes at least one generally planar ground plane formed with at least one slot therein. A first substrate structure has an outer surface and an inner surface. The at least one generally planar ground plane is formed on the outer surface of the first substrate structure. At least one feed line is spaced inwardly from the ground plane and parallel thereto. The at least one feed line has an inner surface and an outer surface and is a transmission line formed on the inner surface of the first substrate structure with the outer surface of the at least one feed line adjacent the inner surface of the first substrate structure. At least one radio frequency chip is coupled to the feed line and the ground plane. A second substrate structure, spaced inwardly from the feed line, defines a chip-receiving cavity. The chip is located in the chip-receiving cavity.

Abstract: A staged rocket apparatus includes first and second stages connected by a releasable connector. A plurality of pressurized gas struts are connected between the first and second stages and provide a separating force urging the first and second stages apart. The gas struts are held in a telescopingly collapsed first position by the releasable connector. The separating force is maintained at a minimum value so long as the releasable connector holds the struts in their first position. When the releasable connector is disconnected the separating force increases due to gas flow through a metering passage having a progressively increasing flow area from a high pressure chamber to a low pressure chamber.

Abstract: A staged rocket apparatus includes first and second stages connected by a releasable connector. A plurality of pressurized gas struts are connected between the first and second stages and provide a separating force urging the first and second stages apart. The gas struts are held in a telescopingly collapsed first position by the releasable connector. The separating force is maintained at a minimum value so long as the releasable connector holds the struts in their first position. When the releasable connector is disconnected the separating force increases due to gas flow through a metering passage having a progressively increasing flow area from a high pressure chamber to a low pressure chamber.

Abstract: A system and method is shown for receiving microwave/millimeter-wave signals. The system and method are balanced and can be effectively implemented on a silicon substrate using single pole double throw switches.

Abstract: A phased-array transmitter and receiver that may be effectively implemented on a silicon substrate. The transmitter distributes to front-ends, and the receiver combines signals from front-ends, using a power distribution/combination tree that employs both passive and active elements. By monitoring the power inputs and outputs, a digital control is able to rapidly provide phase and gain correction information to the front-ends. Such a transmitter/receiver includes a plurality of radio frequency (RF) front-ends and a power splitting/combining network that includes active and passive components configured to distribute signals to/from the front-ends.

Abstract: A radio-frequency integrated circuit chip package has at least one integrated antenna. The package includes at least one generally planar ground plane formed with at least one slot therein. A first substrate structure has an outer surface and an inner surface. The at least one generally planar ground plane is formed on the outer surface of the first substrate structure. At least one feed line is spaced inwardly from the ground plane and parallel thereto. The at least one feed line has an inner surface and an outer surface and is a transmission line formed on the inner surface of the first substrate structure with the outer surface of the at least one feed line adjacent the inner surface of the first substrate structure. At least one radio frequency chip is coupled to the feed line and the ground plane. A second substrate structure, spaced inwardly from the feed line, defines a chip-receiving cavity. The chip is located in the chip-receiving cavity.

Abstract: A radio-frequency integrated circuit chip package has N integrated patch antennas, N being at least one. The package includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn includes at least one generally planar ground plane spaced inwardly from the N generally planar patches and parallel thereto. The ground plane is formed without any coupling apertures therein. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and parallel thereto, and spaced outwardly from the generally planar ground plane and parallel thereto. Furthermore, the main portion includes at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, and the N generally planar patches and the chip are located in the antenna cavity. The package is formed without reflectors. Fabrication techniques are also described.

Abstract: A radio-frequency integrated circuit chip package with N integrated aperture-coupled patch antennas, N being at least one, includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn comprises at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein. The slots are substantially opposed to the patches. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and substantially parallel thereto, and at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, with the N generally planar patches located in the antenna cavity. Fabrication techniques are also described. In some embodiments, N is two or more and a phased array is formed.

Abstract: A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein, and the slots are substantially opposed to the patches. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is spaced inwardly from the feed lines, and is formed with a chip-receiving cavity, with the chip located in the chip-receiving cavity.

Abstract: A radio-frequency integrated circuit chip package with N integrated aperture-coupled patch antennas, N being at least one, includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn comprises at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein. The slots are substantially opposed to the patches. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and substantially parallel thereto, and at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, with the N generally planar patches located in the antenna cavity. Fabrication techniques are also described. In some embodiments, N is two or more and a phased array is formed.