Simple radio frequency integrated circuit (RFIC) packages with integrated antennas
A radio-frequency integrated circuit chip package has N integrated patch antennas, N being at least one. The package includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn includes at least one generally planar ground plane spaced inwardly from the N generally planar patches and parallel thereto. The ground plane is formed without any coupling apertures therein. The main portion also includes N feed lines spaced inwardly from the N generally planar patches and parallel thereto, and spaced outwardly from the generally planar ground plane and parallel thereto. Furthermore, the main portion includes at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, and the N generally planar patches and the chip are located in the antenna cavity. The package is formed without reflectors. Fabrication techniques are also described.
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The present invention generally relates to communications circuitry, and, more particularly, to radio frequency (RF) integrated circuit (IC) packages.
BACKGROUND OF THE INVENTIONIn a wireless network, the connectivity and communication between devices is achieved through antennas attached to receivers or transmitters, in order to radiate the desired signals to or from other elements of the network. In radio communication systems, such as millimeter-wave radios, discrete components are usually assembled with low integration levels. These systems are often assembled using expensive and bulky waveguides and package-level or board-level microstrip structures to interconnect semiconductors and their required transmitter- or receiver-antennas. With recent progress in semiconductor technology and packaging engineering, the dimensions of these radio communication systems have become smaller. For applications such as wireless universal serial bus (USB), the operating distance is limited to about a meter; and a single antenna with about 7 dBi at 60 GHz will provide the necessary antenna gain. For distances as long as 10 meters (such as wireless video) or longer (such as radar), in point-to-point applications, antenna gains as high as 30 dBi, depending on the application, are required. However, high gain antennas for wireless video applications have very narrow beam widths, so pointing the antenna is very difficult for consumers. Therefore, a radiation pattern steerable array, such as a phased array, is necessary. Phased arrays are also widely used in military radars. However, packaging RF chips with integrated antennas or phased arrays is extremely difficult and very expensive due to the expensive components and extensive labor involved.
SUMMARY OF THE INVENTIONPrinciples of the present invention provide techniques for simple radio frequency integrated circuit (RFIC) packages with integrated antennas.
In an exemplary embodiment, according to one aspect of the invention, a radio-frequency integrated circuit chip package has N integrated patch antennas, N being at least one. The package includes a cover portion with N generally planar patches, and a main portion coupled to the cover portion. The main portion in turn includes at least one generally planar ground plane spaced inwardly from the N generally planar patches and parallel thereto. The ground plane is formed without any coupling apertures therein. The main portion also includes N feed lines, the N feed lines being spaced inwardly from the N generally planar patches and parallel thereto, the N feed lines being spaced outwardly from the generally planar ground plane and parallel thereto. Furthermore, the main portion includes at least one radio frequency chip coupled to the feed lines and the ground plane. The cover portion and the main portion cooperatively define an antenna cavity, and the N generally planar patches and the chip are located in the antenna cavity. The package is formed without reflectors.
In another aspect, a method of fabricating a radio-frequency integrated circuit chip package with N integrated patch antennas, N being at least one, includes providing a cover portion and a main portion as just described, and securing the cover portion to the main portion.
In some embodiments of the package and the method, N is two or more, and thus, a phased array can be formed.
These and other objects, features and advantages of the present invention will become apparent from the following detailed description of illustrative embodiments thereof, which is to be read in connection with the accompanying drawings.
One or more embodiments of the invention provide an apparatus and method for low cost packages with integrated antennas and phased arrays operating in the millimeter wave (mmWave) range. An exemplary inventive package with integrated antennas is based on a multilayer printed circuit board (PCB). The package contains, for example, a rectangular or ring cavity for implementing high performance antenna(s) or antenna arrays and another cavity housing mmWave radio frequency (RF) integrated circuit chips. One or more embodiments of the invention also provide techniques to overcome the difficulties in making internal cavities and to avoid the need to employ wire bond technology at mmWave frequencies. Embodiments of the inventive packaging technology are consistent with the PCB manufacturing process and can be used for packages with an integrated antenna or antenna array.
Instances of the invention thus provide low cost packaging with integrated antennas or planar phased arrays; in particular, chip packaging with integrated antennas or planar phased array designs for mmWave frequencies and above.
Typical chip packages with integrated antennas have three major parts: (i) an RF chip, (ii) one or more antennas, and (iii) a package carrier (and in some instances, a package lid or cover, or an encapsulant to protect the package). One or more embodiments of the invention provide a package that has high performance antennas, an interface for flip-chipping an RF chip and an interface for flip-chipping the package to a printed circuit mother board.
Another substrate 112 is inward from ground plane 110. Another metal layer is inward from substrate 112 and is used to implement the antenna feed line(s) 114, pads 116, 118, 120 for RF chip connections (preferably a flip-chip/C4 (“controlled collapse chip connection”) type of connection), and interconnection(s) 122 (as appropriate) to one or more vias, such as via 124, in a further bound film layer 126 inward of the metal layer forming feed line 114, and a further substrate 128 inward of bound film 126. A still further metal layer provides all the pads for signal, control, power supply, and ground connections to the mother PCB (the mother PCB is omitted from the figure for clarity). Pads may include ground pad 130 interconnected with ground plane 110 through ground via 140, as well as one or more of signal, power, and control pads exemplified by pad 132 connected to interconnection 122 and antipad 142 by via 124. The vias may be, for example, plated through holes. Package pads 134 may also be provided. Depending on the patch antenna design, an optional reflector 144 can also be implemented on the same metal layer as the pads 130, 132, 134. In some instances, as discussed below, the reflector 144 is embedded.
To implement the flip-chip approach, the chip 162 preferably has a plurality of solder dots connected directly to the chip connection pads 116, 118, 120.
To enhance the patch antenna bandwidth, patches may be air suspended or supported with a foam material with a dielectric constant close to one at low frequency applications. However, at mmWave frequencies, especially for package applications, air suspended or foam supported patches are not realistic. Thus, in one or more embodiments of the invention, an air cavity 150 can be implemented in the packages. To avoid issues from hot gases during the PCB manufacturing process, vent hole(s) 152 can be employed. These holes can be designed such that they have little effect on the antenna performance. For example, hole 152 can be located near the middle of the cavity 150 or close to the edge of the cavity 150, and can be made relatively small, consistent with adequate venting. The vent holes can be on the top (outermost part of) the cavity 150 as shown in
The ground plane 110 is also used for making ground connections through vias (e.g., via 140) and signal, power, and control connections through vias and antipads (e.g., via 124 with antipad 142, illustrative of a via with antipad that could be used for signal, power, or control functionality). Antipads are beneficial from a manufacturing standpoint, and result in increased reliability, as it is difficult to achieve reliability in partial vias (i.e., vias such as via 124 that do not extend completely through a structure) without use of antipads.
An open chip-receiving cavity or socket 160 is realized in the substrate 128 and bound film 126. This socket is used to hold the RF chip 162. The chip is attached to the package through flip-chip bonding.
Note that all the mmWave components (antennas, power amplifiers, low noise amplifiers, and the like) are in the package 100. Vias 124, 140 are used to pass through DC or much lower frequency signals.
The package 100 may advantageously be attached to the mother board (not shown) through a ball grid array (BGA).
It will thus be appreciated that aspects of the invention include a package with a socket for an RF chip, and a planar antenna. In one or more instances, the RF chip is flip-chip attached to the package. Internal cavities can be used to improve the patch bandwidth. Venting holes can be used to remove the hot gases during the PCB manufacturing process. The package can be attached to the mother PCB through a BGA. The package can implement a planar phased array.
In view of the discussion of
Given the description herein, a person skilled in the PCB and antenna arts can make embodiments of the invention. Non-limiting examples of materials that may be used include thermoset plastic/ceramic/woven glass or similar laminates such as the Rogers RO4000® series of materials (and other compatible materials) available from Rogers Corporation of Rogers, Conn. USA, as well as copper for metal layers, possibly gold-plated on pads or other exposed areas. Similar techniques can be used for all the depicted embodiments, including
It will be appreciated that advantageously, embodiments of the invention, such as 100, 200, and 300, provide a complete package and not a mere patch antenna separate from the chip and other packaging.
Note that vias such as 124, 140 may be formed, for example, using plated through holes.
Embodiments of the invention may also include a second substrate layer, such as that formed by substrate 108 and bound films 106, 109, interposed in a region between the ground plane 110 and a plane defined by the patch 104. The patch 104 may be advantageously formed in a first metal layer and the ground plane 110 may be advantageously formed in a second metal layer.
In one or more embodiments, a third substrate layer, such as that formed by substrate 112, is interposed in a region between the ground plane 110 and the feed line 114. The feed line 114 may be advantageously formed in a third metal layer. Further, one or more packages in accordance with embodiments of the invention may include at least one via, such as via 190, formed in the third substrate layer 112 and coupled to the ground plane 110. A plurality of chip connection pads, such as pads 116, 118, 120, can be formed in the third metal layer. At least one of the chip connection pads, such as 118, can be coupled to the at least one via 190 in the third substrate layer. The chip connection pads couple the chip to the feed line 114 (pad 120), the via 190 (pad 118) and the via 124 (pad 116).
One or more embodiments of the invention may include one or more signals pads, one or more control pads, and one or more power supply pads, all of which are exemplified by pad 132, as well as one or more ground pads, such as 130. The signal, control, power supply and ground pads are advantageously formed in a fourth metal layer. As noted, package pads 134 can optionally be provided.
Also included in one or more embodiments is at least one ground via, such as 140, coupling the ground plane 110 and the ground pad 130. The at least one ground via 140 passes through the first and third substrate layers (e.g., substrate 112, bound film 126, and substrate 128), in a region not intersecting the feed line 114. One or more embodiments include at least one each of power, signal, and control antipads, such as antipad 142, formed substantially coplanar with the ground plane 110. At least one signal via couples the signal antipad and the signal pad, and passes through the first and third substrate layers. Similarly, at least one power via couples the power antipad and the power pad, and passes through the first and third substrate layers. Furthermore, at least one control via couples the control antipad and the control pad, and passes through the first and third substrate layers. As noted, pad 132, via 124, and antipad 142 are illustrative of pad, via, and antipad elements that may be provided for power, signal, and control functionality.
As also noted, in some instances, a reflector, such as 144, is spaced inwardly from the third substrate layer and is generally opposed to the coupling aperture slot 113. The reflector can be located on an inner surface of the first substrate layer (e.g., inmost surface of substrate 128). The reflector can be exposed, as in
Advantageously, the second substrate layer, such as that formed by films 106, 109 and substrate 108, is formed with an air cavity, such as cavity 150, therein. Air cavity 150 is located between the patch 104 and the coupling aperture slot 113 in the ground plane 110. Preferably, the air cavity is formed in communication with a vent, such as vent 152 or 352. In the latter case, as in
As noted with regard to
For array applications, the spacing between the antenna elements is approximately one-half of the free space wavelength (for example, about 2.5 mm at 60 GHz). Thus, it is challenging to implement multiple cavities for antennas, as the cavity wall is too thin. Embodiments of the invention which address this issue will be discussed with regard to
For smaller arrays, an offset or side-by-side configuration is possible, as shown in
One or more embodiments of the invention thus provide a package with a socket 160 for an RF chip 162, and an internal cavity 750 for planar antenna arrays. The antenna cavity 750 can be, for example, a circular or rectangular ring, or a large cavity for side-by-side configurations (an example of the latter is shown in
In view of the description of
A first substrate layer, such as that formed by bound film 126 and substrate 128, is spaced inwardly from the feed lines 114, and is formed with a chip-receiving cavity 160, with the chip 162 being located in the chip-receiving cavity. A second substrate layer, such as that formed by films 106, 109 and substrate 108, is interposed in a region between the ground plane 110 and a plane defined by the patches 104. The patches 104 are formed in a first metal layer, the ground plane 110 is formed in a second metal layer, and the second substrate layer defines an antenna cavity 750, with the N generally planar patches 104 being located in the antenna cavity 750.
In some instances, an island 702, 1702 is formed in the second substrate layer, within the cavity 750, thus defining a ring shape of the cavity, and the N generally planar patches 104 are located in the ring shape, with the island 702, 1702 being substantially opposed to the chip-receiving cavity 160. “Substantially opposed,” as used herein, is intended to describe a configuration where the island at least partially overlaps the chip-receiving cavity when viewed in plan, to help support insertion loads from insertion of chip 162 into cavity 160. The island and the cavity may have a variety of shapes, and may have the same or different shapes in any particular instance. In some exemplary, non-limiting cases, both are substantially rectangular (rectangular encompassing, but not limited to, square) when viewed in plan, while in other, exemplary, non-limiting cases, both are substantially circular when viewed in plan.
In some instances, a third substrate layer, such as that formed by substrate 112, is interposed in a region between the ground plane 110 and the feed lines 114, and the feed lines 114 are formed in a third metal layer. In one or more embodiments, N reflectors 144 are spaced inwardly from the third substrate layer and generally opposed to the coupling aperture slots 113. The reflectors 144 can be located, for example, on an inner surface of the first substrate layer. Furthermore, in some instances, a fourth substrate layer, such as that formed by bound film 170 and substrate 172, is spaced inwardly from the reflectors 144, with the reflectors 144 being embedded between the first and fourth substrate layers.
In other instances, such as shown in
In some instances, a cover, such as layer 102, is secured over the antenna cavity 750, and is at least partially supported by the island 702.
In another aspect, a method of fabricating a radio-frequency integrated circuit chip package of the kind described includes providing a package of the kind described, without the chip 162 inserted, and with the island 702 as described, as well as inserting at least one radio frequency chip 162 into the cavity 160, with the island 702 supporting loads induced by the insertion of the chip into the cavity.
In yet another aspect, a method of fabricating a radio-frequency integrated circuit chip package of the kind described includes providing a package of the kind described, without the chip 162 inserted, and with the antenna cavity spaced away from the chip-receiving cavity when viewed in plan (as shown, for example, in
Internal cavities can be produced in PCB-based packages, as described above, but may involve some challenging processes. Internal cavities are very difficult to implement in the low temperature co-fired ceramic (LTCC) process. To address these issues, additional aspects of the invention will now be described. Thus the package design can be implemented in both PCB and LTCC processes. In one or more embodiments, the package can be split into two parts: a main part and a cover.
Aspects of the invention provide an apparatus and method for low cost packages with integrated antennas and phased arrays, operating in the millimeter wave (mmWave) range. One or more embodiments of a package with integrated antennas are based on multilayer PCB or LTCC, and include a rectangular or ring cavity for implementing high performance antenna arrays and another cavity for housing mmWave RF chips. In one or more embodiments, the internal cavity is avoided by splitting the package into two parts: a main body and a cover. This approach is consistent with the PCB and LTCC manufacturing processes and can be used for packages with an integrated antenna or antenna array. Further, this approach is suitable for automatic processes and reduces the number of components involved with packaging antennas. The “splitting” approach relates generally to low cost packaging with integrated antennas or planar phased arrays, and to chip packaging with integrated antennas or planar phased array designs for mmWave frequencies and above.
Thus, in the “flipping” approach, the embedded (internal) cavity becomes an open cavity.
The embodiment of
Additional manufacturing steps are needed to make the island 702. To reduce the steps, ridges 2150 can be used as shown in
The antennas in
Adhesive layers, such as layers 170, 126, 2606, in
In embodiments such as those of
In a number of exemplary embodiments described above, the chip 162 is flip-chip attached to the package. The flip-chip attachment provides good interconnection performance. However, flip-chip process may, at least in some circumstances, cost more than the wirebonding process.
One or more embodiments thus provide ridged structures, such as 2150, that can be used to remove the center island (that is, the structure is no longer an island since it is connected to other parts). Furthermore, in some embodiments, such as in
Thus, one or more embodiments of a radio-frequency integrated circuit chip package with N integrated aperture-coupled patch antennas, N being at least one, include a cover portion 2102, 2602, 3202, with N generally planar patches; and a main portion (lower stackup in
In some cases, such as
In some cases, the main portion has a first substrate layer, as discussed above, spaced inwardly from the feed lines 114, and the first substrate layer is formed with a chip-receiving cavity 160, the chip being located in the chip-receiving cavity. In this case, the feed lines 114 are located inwardly of the ground plane 110. An island 702 can be formed within the antenna cavity, thus defining a ring shape of the cavity, the island being substantially opposed to the chip-receiving cavity. The island and/or cavity can be round, rectangular, or any other desirable shape consistent with manufacturability. One or more island support ridges 2150 can be located within the cavity.
In the case where the feed lines are inward from the ground plane, optionally, N reflectors 144 can be spaced inwardly from the ground plane and the feed lines and generally opposed to the coupling aperture slots.
As in
In some embodiments of the package, N is two or more. The N patches can be arranged to form a planar phased array.
As shown in
In another aspect, with reference to
As noted above, aspects of the invention provide an apparatus and method for low cost packages with integrated antennas and phased arrays operating in the millimeter wave (mmWave) range. In one or more embodiments, a package with integrated antennas is based on multilayer printed circuit board (PCB) or low temperature cofired ceramic (LTCC). The package includes a rectangular or ring cavity for implementing high performance antenna arrays and for housing mmWave RF chips. The need for an internal cavity is avoided by splitting the package into two parts: a main body and a cover. The packaging technology of such embodiments is consistent with the PCB and LTCC manufacturing processes and can be used for packages with an integrated antenna or antenna array. Thus, aspects of the invention relate generally to low cost packaging with integrated antennas or planar phased arrays, and in particular, relate to chip packaging with integrated antennas or planar phased array designs for mmWave frequencies and above. Aspects of the invention advantageously integrate antennas with their RF front-end circuits. One or more embodiments, such as are described with respect to
The ring cavity solution discussed above is quite beneficial, provides high performance, and is relatively easy to implement. However, two issues have been noted with the ring cavity solution. First, the reflectors may restrict or interfere with via implementation. This is particular true for arrays with eight or more elements where many vias are required, so the vias may spread to the reflector region. Second, the apertures on the ground plane will radiate some RF energy to the back side of the package even though the reflectors are used. One or more embodiments, such as the examples depicted in
As seen in
In the event that there are many pads for BGA (ball grid array) attachment of the package to the PCB, especially for large arrays, in at least some cases it will be necessary to spread the pads on the bottom of the package, as show in
If the package contains a high powered RFIC such as a transmitter, a heat dissipater 4980 can be attached on the cover 4102 of the package as shown in
In another aspect, it is also possible to use the chip 162 as a support for the cover 4102 to prevent the cover from sagging, as shown at location 5090 in
Thus, in view of
At least one radio frequency chip 162 is coupled to the feed lines 114 and the ground plane 4110. The cover portion 4102 and the main portion cooperatively define an antenna cavity 6000, and the N generally planar patches 104 and the chip 162 are located in the antenna cavity 6000. The package is formed without reflectors.
Optionally, N is at least two. Cavity 6000 may be, for example, rectangular, circular, ring-shaped, or the like, when viewed in plan. In some instances, as seen in
As seen in the non-limiting example of
Optionally, the N generally planar patches are arranged to form a planar phased array, as seen in
As seen in
As seen in
Furthermore, in some instances, one or more of the features discussed can be combined. For example, a package could implement a planar phased array, and could implement one or both of the heat dissipater aspect and cover support aspects of
With reference again to
In some instances, the main portion and the cover portion are formed with opposed ball limiting metallurgy pads, as shown in
The method continues at block 3912 (for example, one could stop or fabricate more packages). Again, in some embodiments of the method, N is two or more. The N patches can be arranged to form a planar phased array.
Aspects of the invention may be useful in a variety of different applications. For example, in low cost consumer applications with small array size, a package that contains a one-chip module with all the phase shifters and necessary control circuits, and a planar antenna array, can be valuable solution, and can be implemented using techniques set forth herein. One or more embodiments of phased array architecture can be implemented in the thin film technology or printed circuit board (PCB) or LTCC technology. A significant advantage of one or more embodiments is that all antenna elements can be implemented in a planar way and the RFIC module can be packaged with the antenna elements simultaneously. Furthermore, one or more phased array embodiments provide high antenna performance while maintaining easy manufacturability.
Note that, to avoid clutter and confusion, use of hidden (dashed) lines is generally avoided in the top (plan) views herein.
It will be appreciated and should be understood that the exemplary embodiments of the invention described above can be implemented in a number of different fashions. Given the teachings of the invention provided herein, one of ordinary skill in the related art will be able to contemplate other implementations of the invention.
Although illustrative embodiments of the present invention have been described herein with reference to the accompanying drawings, it is to be understood that the invention is not limited to those precise embodiments, and that various other changes and modifications may be made by one skilled in the art without departing from the scope of spirit of the invention.
Claims
1. A radio-frequency integrated circuit chip package with N integrated patch antennas, N being at least one, said package comprising:
- a cover portion with N generally planar patches; and
- a main portion coupled to said cover portion, said main portion in turn comprising: at least one generally planar ground plane spaced inwardly from said N generally planar patches and parallel thereto, said ground plane being formed without any coupling apertures therein; N feed lines, said N feed lines being spaced inwardly from said N generally planar patches and parallel thereto, said N feed lines being spaced outwardly from said generally planar ground plane and parallel thereto; and at least one radio frequency chip coupled to said feed lines and said ground plane;
- wherein: said cover portion and said main portion cooperatively define an antenna cavity, said N generally planar patches and said chip being located in said antenna cavity; and said package is formed without reflectors.
2. The package of claim 1, wherein N is at least two.
3. The package of claim 2, wherein said antenna cavity is rectangular when viewed in plan.
4. The package of claim 2, wherein said antenna cavity is circular when viewed in plan.
5. The package of claim 2, wherein said cover portion is formed with inward projections to define said antenna cavity.
6. The package of claim 2, wherein said main portion is formed with outward projections to define said antenna cavity.
7. The package of claim 2, wherein said main portion and said cover portion are formed with opposed ball limiting metallurgy pads, and said main portion is secured to said cover portion using solder balls soldered to said ball limiting metallurgy pads, to define said antenna cavity.
8. The package of claim 2, wherein said N generally planar patches are arranged to form a planar phased array.
9. The package of claim 2, wherein said N generally planar patches are coupled to said feed lines through electromagnetic coupling.
10. The package of claim 2, further comprising N coupling patches electrically interconnected with said N feed lines and coplanar therewith, wherein said N generally planar patches are coupled to said feed lines through said N coupling patches.
11. The package of claim 2, wherein said main portion and said cover portion are cooperatively configured such that said chip supports said cover portion to reduce flexure of said cover portion.
12. The package of claim 2, further comprising a heat dissipater secured to said cover and in thermal contact with said chip.
13. The package of claim 2, wherein said main portion has an innermost surface, further comprising at least one via with a chip-engaging pad and an external pad, said at least one via running from said chip to said innermost surface of said main portion, said via being stepped such that said external pad is offset from said chip-engaging pad.
14. The package of claim 2, wherein:
- said N generally planar patches are arranged to form a planar phased array;
- said N generally planar patches are coupled to said feed lines through electromagnetic coupling
- said main portion and said cover portion are cooperatively configured such that said chip supports said cover portion to reduce flexure of said cover portion; and
- said main portion has an innermost surface;
- further comprising: a heat dissipater secured to said cover and in thermal contact with said chip; and at least one via with a chip-engaging pad and an external pad, said at least one via running from said chip to said innermost surface of said main portion, said via being stepped such that said external pad is offset from said chip-engaging pad.
15. The package of claim 2, wherein:
- said N generally planar patches are arranged to form a planar phased array;
- said main portion and said cover portion are cooperatively configured such that said chip supports said cover portion to reduce flexure of said cover portion; and
- said main portion has an innermost surface;
- further comprising: N coupling patches electrically interconnected with said N feed lines and coplanar therewith, said N generally planar patches being coupled to said feed lines through said N coupling patches; a heat dissipater secured to said cover and in thermal contact with said chip; and at least one via with a chip-engaging pad and an external pad, said at least one via running from said chip to said innermost surface of said main portion, said via being stepped such that said external pad is offset from said chip-engaging pad.
16. A method of fabricating a radio-frequency integrated circuit chip package with N integrated patch antennas, N being at least one, said method comprising the steps of:
- providing a cover portion with N generally planar patches;
- providing a main portion comprising: at least one generally planar ground plane, said ground plane being formed without any coupling apertures therein; N feed lines, said N feed lines being spaced outwardly from said generally planar ground plane and parallel thereto; and at least one radio frequency chip coupled to said feed lines and said ground plane; and
- securing said cover portion to said main portion;
- wherein: said cover portion and said main portion cooperatively define an antenna cavity, said N generally planar patches and said chip being located in said antenna cavity; said N feed lines are spaced inwardly from said N generally planar patches and parallel thereto; and said package is formed without reflectors.
17. The method of claim 16, wherein N is at least two.
18. The method of claim 17, further comprising the additional step of locating said chip on said main portion such that, when said cover portion is secured to said main portion, said chip is located in said antenna cavity.
19. The method of claim 17, further comprising the additional step of forming at least said main portion using printed circuit board techniques.
20. The method of claim 17, further comprising the additional step of forming at least said main portion using low temperature co-fired ceramic techniques.
21. The method of claim 17, wherein said main portion and said cover portion are formed with opposed ball limiting metallurgy pads, and wherein said securing step comprises securing said cover portion to said main portion using solder balls soldered to said ball limiting metallurgy pads.
22. The method of claim 17, wherein said main portion further comprises N coupling patches electrically interconnected with said N feed lines and coplanar therewith, further comprising aligning said N generally planar patches with said N coupling patches.
23. The method of claim 17, wherein said main portion and said cover portion are cooperatively configured such that said chip supports said cover portion to reduce flexure of said cover portion, and wherein said securing step comprises securing said cover portion to said main portion with said cover portion supported by said chip.
24. The method of claim 17, wherein said cover portion further comprises a heat dissipater, and wherein said securing step comprises securing said cover portion to said main portion with said heat dissipater in thermal contact with said chip.
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Type: Grant
Filed: Jan 27, 2009
Date of Patent: Sep 18, 2012
Patent Publication Number: 20100190464
Assignees: International Business Machines Corporation (Armonk, NY), Media Tek (Hs in-Chu)
Inventors: Ho Chung Chen (Taipei), Brian A. Floyd (Mahopac, NY), Duixian Liu (Scarsdale, NY)
Primary Examiner: Dieu H Duong
Attorney: Ryan, Mason & Lewis, LLP
Application Number: 12/360,538
International Classification: H01Q 1/24 (20060101);