Abstract: A method for fabricating an asymmetric printed circuit board with minimized warpage. The method includes determining a first resin area and a second resin area in a stack of printed circuit board layers. The method further includes performing computer modeling to predict a warpage of the printed circuit board layers during a predicted use of the printed circuit board layers. The method further includes determining a first target coefficient of thermal expansion for the first resin area and a second target coefficient of thermal expansion for the second resin area based on the computer modeling. The method further includes differentially curing resin in the first resin area and the second resin area based on the first target coefficient of thermal expansion and the second target coefficient of thermal expansion. The method further includes forming an asymmetric printed circuit board from the stack of printed circuit board layers.

Abstract: A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.

Abstract: Fabrication of a reliable circuit board assembly with soldered, plated through-hole structures is facilitated by characterizing plating of a plated through-hole of the circuit board using time-domain reflectance to obtain a base reflectance measurement, and applying solder to the plated through-hole. Based on applying the solder, the plating of the plated through-hole of the circuit board is re-characterized using time-domain reflectance to obtain a new reflectance value. Based on a deviation between the new reflectance measurement and the base reflectance measurement exceeding a threshold, dissolution, at least in part, of the plating of the plated through-hole due to applying the solder is identified.

Abstract: According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.

Abstract: A system for manufacturing a product includes a mating connector connected to solder pins to provide an electrical conducting path, the solder pins being aligned against solder pads so that each solder pin is thermally and electrically connected to its corresponding solder pad by a solder paste bead. The system also includes a controller to adjust electrical resistive heating of a solder paste bead during a soldering process according to a temperature of the solder paste bead. A method of manufacturing a product includes aligning the solder pins against the solder pads, connecting the mating connector to the solder pins, and heating a solder paste bead by an electrical resistive heating, the solder paste bead undergoing a soldering process, where a temperature of the solder paste bead is being evaluated and the electrical resistive heating is adjusted according to the temperature of the solder paste bead.

Abstract: A process of improving resistance to conductive anodic filament (CAF) formation is disclosed. The process includes dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution. The process also includes applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process. The process further includes removing the solvent via a thermal process that partially converts the base resin material. The thermal process results in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material utilized to form a prepreg material for manufacturing a printed circuit board. During one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent CAF formation pathways.

Abstract: A glass fiber cloth includes a first warp glass fiber, a second warp glass fiber, and a weft glass fiber. The second warp glass fiber is adjacent to the first warp glass fiber. The weft glass fiber is overlaid over the first warp glass fiber and the second warp glass fiber. The weft glass fiber is attached to the first warp glass fiber.

Abstract: A process of in-situ detection of hollow fiber formation includes immersing a plurality of individual glass fibers in an index-matching material. The index-matching material has a first refractive index that substantially matches a second refractive index of the glass fibers. The process also includes exposing the individual glass fibers to a light source during immersion in the index-matching material. The process further includes utilizing one or more optical components to collect optical data for the individual glass fibers during immersion in the index-matching material. The process also includes determining, based on the optical data, that a particular glass fiber of the plurality of individual glass fibers includes a hollow fiber.

Abstract: Fabrication of a reliable circuit board assembly with soldered, plated through-hole structures is facilitated by characterizing plating of a plated through-hole of the circuit board using time-domain reflectance to obtain a base reflectance measurement, and applying solder to the plated through-hole. Based on applying the solder, the plating of the plated through-hole of the circuit board is re-characterized using time-domain reflectance to obtain a new reflectance value. Based on a deviation between the new reflectance measurement and the base reflectance measurement exceeding a threshold, dissolution, at least in part, of the plating of the plated through-hole due to applying the solder is identified.

Abstract: An immersion weaving system includes a first drum immersed in a first bath of a liquid. The first drum is configured to form a glass strand from individual glass filaments. The immersion weaving system also includes a second drum immersed in the first bath of the liquid. The second drum is configured to form a yarn spool from the glass strand. The immersion weaving system further includes a loom immersed in a second bath of the liquid. The loom is configured to form a void-free glass cloth.

Abstract: A process of in-situ detection of hollow fiber formation includes immersing a plurality of individual glass fibers in an index-matching material. The index-matching material has a first refractive index that substantially matches a second refractive index of the glass fibers. The process also includes exposing the individual glass fibers to a light source during immersion in the index-matching material. The process further includes utilizing one or more optical components to collect optical data for the individual glass fibers during immersion in the index-matching material. The process also includes determining, based on the optical data, that a particular glass fiber of the plurality of individual glass fibers includes a hollow fiber.

Abstract: A process of improving resistance to conductive anodic filament (CAF) formation is disclosed. The process includes dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution. The process also includes applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process. The process further includes removing the solvent via a thermal process that partially converts the base resin material. The thermal process results in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material utilized to form a prepreg material for manufacturing a printed circuit board. During one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent CAF formation pathways.

Abstract: A component having a coating comprising a material in a first phase (e.g., solid and/or liquid phase) with a transition temperature. The component is mechanically and/or electrically attached to a substrate. Exposure of the coating to a temperature that meets or exceeds the transition temperature causes the material to undergo a phase change. The phase change of the material alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment, thereby mitigating damage to the substrate and/or component.

Abstract: A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.

Abstract: A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.

Abstract: An apparatus is configured with a component having a coating comprising a material in a first phase (e.g., solid and/or liquid phase) with a transition temperature. The component is mechanically and/or electrically attached to a substrate. Exposure of the coating to a temperature that meets or exceeds the transition temperature causes the material to undergo a phase change. The phase change of the material alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment, thereby mitigating damage to the substrate and/or component.

Abstract: A process of improving resistance to conductive anodic filament (CAF) formation is disclosed. The process includes dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution. The process also includes applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process. The process further includes removing the solvent via a thermal process that partially converts the base resin material. The thermal process results in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material utilized to form a prepreg material for manufacturing a printed circuit board. During one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent CAF formation pathways.

Abstract: A layup for multiple-layer printed circuit board manufacturing is formed according to a process that includes selectively applying a dielectric resin to a high resin demand region of a circuitized core layer without applying the dielectric resin to another region of the circuitized core layer. The process also includes partially curing the dielectric resin within the high resin demand region. The process further includes forming a layup that includes a layer of pre-impregnated (prepreg) material adjacent to the partially cured dielectric resin within the high resin demand region of the circuitized core layer.

Abstract: According to one aspect, a glass-free pre-impregnated material includes a polybenzimidazole (PBI) sheet and a partially cured resin encapsulating the PBI sheet. According to another aspect, a process of forming a glass-free pre-impregnated material includes encapsulating a PBI sheet within a resin and partially curing the resin to form the glass-free pre-impregnated material. According to yet another aspect, a printed circuit board comprises a glass-free dielectric layer that includes a PBI sheet encapsulated within a cured resin.

Abstract: An apparatus is provided with a component configured to be operatively coupled to an interface. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to a thermal event that meets or exceeds a first temperature the resilient material is subject to undergo a state change to a second state. The state change includes a physical transformation of the interface, and includes a position change of the component.