Abstract: A method of manufacturing a memory structure includes forming a plurality of vertically-stacked horizontal line layers, interleaving a plurality of electrically conductive vertical lines with the electrically conductive horizontal lines, and forming a memory film at and between intersections of the electrically conductive vertical lines and the horizontal lines. In one embodiment of the invention, the electrically conductive vertical lines are interleaved with the horizontal lines such that a row of vertical lines is positioned between each horizontally-adjacent pair of horizontal lines in each horizontal line layer. By configuring the electrically conductive vertical lines and electrically conductive horizontal lines so that a row of vertical lines is positioned between each horizontally-adjacent pair of horizontal lines, a unit memory cell footprint of just 2F2 may be realized.

Abstract: Thyristor memory cell arrays and their fabrication have improved features. Assist-gates between thyristor memory cells in an array operate on both sides of an assist-gate. The assist-gates can be arranged in various ways for optimized performance and the materials of the assist-gate are selected to control the bias voltage of the assist-gate in operation. The PNPN (or NPNP) thyristor layers of the memory cell can be fabricated in different process flows according to manufacturing concerns and the dopant concentrations of the layers are selected to reduce temperature sensitivity of the memory cell.

Abstract: A volatile memory array using vertical thyristors is disclosed together with methods of operating the array to read data from and write data to the array.

Abstract: A vertical thyristor memory array including: a vertical thyristor memory cell, the vertical thyristor memory cell including: a p+ anode; an n-base located below the p+ anode; a p-base located below the n-base; a n+ cathode located below the p-base; an isolation trench located around the vertical thyristor memory cell; an assist gate located in the isolation trench adjacent the n-base wherein an entire vertical height of the assist gate is positioned within an entire vertical height of the n-base.

Abstract: Operations with reduced current overall are performed on single thyristor memory cells forming a volatile memory cell cross-point array. An operation is performed on at least one memory cell in a first group of memory cells out of a plurality of groups of memory cells coupled to a line. A first voltage is applied across the first group of memory cells for the operation and a lower second voltage is applied across the other groups of memory cells. The first voltage is then applied across a second group of memory cells while the second voltage is applied across the other groups including the first group of memory cells. These steps may repeated until the operations covers all the groups.

Abstract: Single thyristor memory cells form a volatile memory array. A sense amplifier reads the state of the thyristor in a selected memory cell against a dummy cell through precharged lines.

Abstract: Memory cells are formed with vertical thyristors to create a volatile memory array. Power consumption in such arrays is reduced or controlled with various techniques including encoding the data stored in the arrays.

Abstract: A volatile memory array using vertical thyristors is disclosed together with methods of operating the array to read, write, retain and refresh data stored therein.

Abstract: A memory cell based upon thyristors for an SRAM integrated circuit can be implemented in different combinations of MOS and bipolar select transistors, or without select transistors, with thyristors in a semiconductor substrate with shallow trench isolation. Standard CMOS process technology can be used to manufacture the SRAM cells. Special circuitry provides lowered power consumption during standby.

Abstract: A method of manufacturing a memory structure includes forming a plurality of vertically-stacked horizontal line layers, interleaving a plurality of electrically conductive vertical lines with the electrically conductive horizontal lines, and forming a memory film at and between intersections of the electrically conductive vertical lines and the horizontal lines. In one embodiment of the invention, the electrically conductive vertical lines are interleaved with the horizontal lines such that a row of vertical lines is positioned between each horizontally-adjacent pair of horizontal lines in each horizontal line layer. By configuring the electrically conductive vertical lines and electrically conductive horizontal lines so that a row of vertical lines is positioned between each horizontally-adjacent pair of horizontal lines, a unit memory cell footprint of just 2F2 may be realized.

Abstract: A volatile memory array using vertical thyristors is disclosed together with methods of operating the array to read data from and write data to the array.

Abstract: A vertical thyristor memory array including: a vertical thyristor memory cell, the vertical thyristor memory cell including: a p+ anode; an n-base located below the p+ anode; a p-base located below the n-base; a n+ cathode located below the p-base; an isolation trench located around the vertical thyristor memory cell; an assist gate located in the isolation trench adjacent the n-base wherein an entire vertical height of the assist gate is positioned within an entire vertical height of the n-base.

Abstract: A vertical thyristor memory cell array with each of the thyristor memory cells connected to bit and word lines, the bit lines are connected to the inputs of multiplexers which are connected to sense amplifiers, is adaptable to LPDDR4 requirements. The lack of refresh operations for the vertical thyristor memory cell array is not apparent to a LPDDR4 memory controller so that a standard or an LPDDR4 memory controller which omits refresh operations and specifically adapted for a vertical thyristor memory can control the transfer of data to and from the plurality of vertical thyristor memory integrated circuits.

Abstract: In a vertical thyristor memory cell array with each of the thyristor memory cells connected to bit and word lines, the bit lines are connected to the inputs of multiplexers which are connected to sense amplifiers. The vertical memory cells, multiplexers and sense amplifiers are arranged in described MATs (Memory Array Tiles) which have very packing efficiency compared to conventional DRAMs, especially in current 2X-nm process technology. The MATs can be arranged for an effective LPDDR4 architecture.

Abstract: Memory cells are formed with vertical thyristors to create a volatile memory array. Power consumption in such arrays is reduced or controlled with various techniques including encoding the data stored in the arrays.

Abstract: A two-transistor memory cell based upon a thyristor for an SRAM integrated circuit is described together with a process for fabricating it. The memory cell can be implemented in different combinations of MOS and bipolar select transistors, or without select transistors, with thyristors in a semiconductor substrate with shallow trench isolation. Standard CMOS process technology can be used to manufacture the SRAM.

Abstract: A volatile memory array using vertical thyristors is disclosed together with methods of operating the array to read data from and write data to the array.

Abstract: A vertical thyristor memory array including: a vertical thyristor memory cell, the vertical thyristor memory cell including: a p+ anode; an n-base located below the p+ anode; a p-base located below the n-base; a n+ cathode located below the p-base; an isolation trench located around the vertical thyristor memory cell; an assist gate located in the isolation trench adjacent the n-base wherein an entire vertical height of the assist gate is positioned within an entire vertical height of the n-base.

Abstract: A volatile memory array using vertical thyristors is disclosed together with methods of fabricating the array.

Abstract: A volatile memory array using vertical thyristors is disclosed together with methods of fabricating the array.