Patents by Inventor Bryan Black

Bryan Black has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10842501
    Abstract: A system and method for rapidly accessing a tourniquet located in a pouch with a pull-away cover. The tourniquet holder allows users to safely store in a fabric pouch a prepared tourniquet that is quickly accessible and coupled to a removable cover of the pouch. Users are able to fold tourniquet in a manner that allow the tourniquet to be removed from the pouch and used nearly instantaneously.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: November 24, 2020
    Inventor: Bryan Black
  • Patent number: 10290606
    Abstract: Various interposers and method of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an identification structure to an interposer. The identification structure is operable to provide identification information about the interposer. The identification structure is programmable to create or alter the identification information.
    Type: Grant
    Filed: June 21, 2012
    Date of Patent: May 14, 2019
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Michael Alfano, Joe Siegel, Michael Z. Su, Bryan Black, Julius Din
  • Publication number: 20180256172
    Abstract: A system and method for rapidly accessing a tourniquet located in a pouch with a pull-away cover. The tourniquet holder allows users to safely store in a fabric pouch a prepared tourniquet that is quickly accessible and coupled to a removable cover of the pouch. Users are able to fold tourniquet in a manner that allow the tourniquet to be removed from the pouch and used nearly instantaneously.
    Type: Application
    Filed: March 10, 2017
    Publication date: September 13, 2018
    Inventor: Bryan Black
  • Patent number: 9806014
    Abstract: Various interposers and methods of manufacturing related thereto are disclosed. In one aspect, an apparatus is provided that includes an interposer that has a first side and a second side opposite the first side. The first side has a first reticle field and a second reticle field larger than the first reticle field. Plural conductor pads are positioned on the first side in the first reticle field. Plural dummy conductor pads are positioned on the first side in the second reticle field and outside the first reticle field.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: October 31, 2017
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Michael S. Alfano, Bryan Black, Michael Z. Su, Joseph R. Siegel, Julius E. Din, Anwar Kashem
  • Patent number: 9793239
    Abstract: Various semiconductor workpieces with selective backside metallizations and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor workpiece that has multiple dies. A backside metallization is fabricated on a first die of the dies but not on a second die of the dies.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: October 17, 2017
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Michael Z. Su, Michael S. Alfano, Bryan Black
  • Publication number: 20170213787
    Abstract: Various interposers and methods of manufacturing related thereto are disclosed. In one aspect, an apparatus is provided that includes an interposer that has a first side and a second side opposite the first side. The first side has a first reticle field and a second reticle field larger than the first reticle field. Plural conductor pads are positioned on the first side in the first reticle field. Plural dummy conductor pads are positioned on the first side in the second reticle field and outside the first reticle field.
    Type: Application
    Filed: January 27, 2016
    Publication date: July 27, 2017
    Inventors: Michael S. Alfano, Bryan Black, Michael Z. Su, Joseph R. Siegel, Julius E. Din, Anwar Kashem
  • Patent number: 9627281
    Abstract: A method of manufacturing is provided that includes applying a thermal interface tape to a side of a semiconductor wafer that includes at least one semiconductor chip. The thermal interface material tape is positioned on the at least one semiconductor chip. The at least one semiconductor chip is singulated from the semiconductor wafer with at least a portion of the thermal interface tape still attached to the semiconductor chip.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: April 18, 2017
    Assignees: Advanced Micro Device, Inc., ATI Technologies ULC
    Inventors: Seth Prejean, Dales Kent, Ronnie Brandon, Gamal Refai-Ahmed, Michael Z. Su, Michael Bienek, Joseph Siegel, Bryan Black
  • Publication number: 20170092712
    Abstract: Various through silicon via capacitors and methods of fabricating the same are disclosed. In one aspect, an apparatus is provided that includes a semiconductor substrate with a portion doped with a first impurity type and a doped region of a second impurity type in the portion of the semiconductor substrate. The doped region is operable to function as a first capacitor plate. A first via hole is in the doped region. The first via hole has a first sidewall. A first insulating layer is on the first sidewall. The first insulating layer is operable to function as a capacitor dielectric. A first conductive via is in the first via hole. The first conductive via is operable to function as a second capacitor plate.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventors: Joseph R. Siegel, Lawrence A. Bair, Bryan Black, Michael Su
  • Publication number: 20170092616
    Abstract: Various semiconductor workpieces with selective backside metallizations and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor workpiece that has multiple dies. A backside metallization is fabricated on a first die of the dies but not on a second die of the dies.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventors: Michael Z. Su, Michael S. Alfano, Bryan Black
  • Publication number: 20160365335
    Abstract: A semiconductor chip with conductive vias and a method of manufacturing the same are disclosed. The method includes forming a first plurality of conductive vias in a layer of a first semiconductor chip. The first plurality of conductive vias includes first ends and second ends. A first conductor pad is formed in ohmic contact with the first ends of the first plurality of conductive vias.
    Type: Application
    Filed: August 25, 2016
    Publication date: December 15, 2016
    Inventors: Bryan Black, Michael Z. Su, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean
  • Publication number: 20160329312
    Abstract: Various semiconductor chip and interposer devices are disclosed. In one aspect, an apparatus is provided that includes an interposer, a first semiconductor chip mounted on the interposer and a second semiconductor chip mounted on and electrically connected to the first semiconductor chip by the interposer. The second semiconductor chip includes offloaded logic of the first semiconductor chip.
    Type: Application
    Filed: May 5, 2015
    Publication date: November 10, 2016
    Inventors: Sean M. O'Mullan, Michael S. Alfano, Bryan Black
  • Patent number: 9437561
    Abstract: A semiconductor chip with conductive vias and a method of manufacturing the same are disclosed. The method includes forming a first plurality of conductive vias in a layer of a first semiconductor chip. The first plurality of conductive vias includes first ends and second ends. A first conductor pad is formed in ohmic contact with the first ends of the first plurality of conductive vias.
    Type: Grant
    Filed: September 9, 2010
    Date of Patent: September 6, 2016
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Bryan Black, Michael Z. Su, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean
  • Patent number: 9385055
    Abstract: A method of assembling a semiconductor chip device is provided that includes placing an interposer on a first semiconductor chip. The interposer includes a first surface seated on the first semiconductor chip and a second surface adapted to thermally contact a heat spreader. The second surface includes a first aperture. A second semiconductor chip is placed in the first aperture.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: July 5, 2016
    Assignees: ATI Technologies ULC, Advanced Micro Devices, Inc.
    Inventors: Gamal Refai-Ahmed, Michael Z. Su, Bryan Black, Maxat Touzelbaev, Yizhang Yang
  • Patent number: 9263364
    Abstract: Various semiconductor chip thermal interface material methods and apparatus are disclosed. In one aspect, a method of establishing thermal contact between a first semiconductor chip and a heat spreader is provided. The method includes placing a thermal interface material layer containing a support structure on the first semiconductor chip. The heat spreader is positioned proximate the thermal interface material layer. The thermal interface material layer is reflowed to establish thermal contact with both the first semiconductor chip and the heat spreader.
    Type: Grant
    Filed: August 23, 2011
    Date of Patent: February 16, 2016
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Maxat Touzelbaev, Gamal Refai-Ahmed, Yizhang Yang, Bryan Black
  • Patent number: 8909840
    Abstract: Techniques are disclosed relating to data inversion encoding. In one embodiment, an apparatus includes an interface circuit. The interface circuit is configured to perform first and second data bursts that include respective pluralities of data transmissions encoded using an inversion coding scheme. In such an embodiment, the initial data transmission of the second data burst is encoded using the final data transmission of the first data burst. In some embodiments, the first and second data bursts correspond to successive write operations or successive read operations to a memory module from a memory PHY.
    Type: Grant
    Filed: December 19, 2011
    Date of Patent: December 9, 2014
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Aaron J. Nygren, Anwar Kashem, Bryan Black, James Michael O'Connor, Warren Fritz Kruger
  • Patent number: 8866276
    Abstract: A method of manufacturing is provided that includes providing a semiconductor chip with an insulating layer. The insulating layer includes a trench. A second semiconductor chip is stacked on the first semiconductor chip to leave a gap. A polymeric filler is placed in the gap wherein a portion of the polymeric filler is drawn into the trench.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: October 21, 2014
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Michael Z. Su, Gamal Refai-Ahmed, Bryan Black
  • Patent number: 8856329
    Abstract: A method and system for flexibly processing content objects is disclosed. A content object is stored on one of a plurality of storage devices. A request is received for the content object. Information corresponding to the requested object (e.g., a unique identifier) is transmitted to one or more content directories. A response is received from a first content directory indicating a location of the content object. The content object is requested from the first location, and at least part of the content object is received.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: October 7, 2014
    Assignee: Limelight Networks, Inc.
    Inventors: Bryan Black, Jacob S. Roersma, Jared Boelens, Neil Dunbar, Sig Lange, Wylie Swanson
  • Patent number: 8796842
    Abstract: A method of assembling a semiconductor chip device is provided that includes providing a circuit board including a surface with an aperture. A portion of a first heat spreader is positioned in the aperture. A stack is positioned on the first heat spreader. The stack includes a first semiconductor chip positioned on the first heat spreader and a substrate that has a first side coupled to the first semiconductor chip.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: August 5, 2014
    Assignees: ATI Technologies ULC, Advanced Micro Devices, Inc.
    Inventors: Gamal Refai-Ahmed, Michael Z. Su, Bryan Black
  • Patent number: 8726139
    Abstract: Provided herein is a method and system for providing and analyzing unified data signaling that includes setting, or analyzing a state of a single indicator signal, generating or analyzing a data pattern of a plurality of data bits, and signal, or determine, based on the state of the single indicator signal and the pattern of the plurality of data bits, that data bus inversion has been applied to the plurality of data bits or that the plurality of data bits is poisoned.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: May 13, 2014
    Assignee: Advanced Micro Devices, Inc.
    Inventors: James O'Connor, Aaron Nygren, Anwar Kashem, Warren Fritz Kruger, Bryan Black
  • Patent number: 8704353
    Abstract: A method of manufacturing is provided that includes fabricating a first plurality of electrically functional interconnects on a front side of a first semiconductor chip and fabricating a first plurality of electrically non-functional interconnects on a back side of the first semiconductor chip. Additional chips may be stacked on the first semiconductor chip.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: April 22, 2014
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Michael Su, Bryan Black, Neil McLellan, Joe Siegel, Michael Alfano