Abstract: Various semiconductor chip thermal interface material methods and apparatus are disclosed. In one aspect, a method of establishing thermal contact between a first semiconductor chip and a heat spreader is provided. The method includes placing a thermal interface material layer containing a support structure on the first semiconductor chip. The heat spreader is positioned proximate the thermal interface material layer. The thermal interface material layer is reflowed to establish thermal contact with both the first semiconductor chip and the heat spreader.

Abstract: Techniques are disclosed relating to data inversion encoding. In one embodiment, an apparatus includes an interface circuit. The interface circuit is configured to perform first and second data bursts that include respective pluralities of data transmissions encoded using an inversion coding scheme. In such an embodiment, the initial data transmission of the second data burst is encoded using the final data transmission of the first data burst. In some embodiments, the first and second data bursts correspond to successive write operations or successive read operations to a memory module from a memory PHY.

Abstract: A method of manufacturing is provided that includes providing a semiconductor chip with an insulating layer. The insulating layer includes a trench. A second semiconductor chip is stacked on the first semiconductor chip to leave a gap. A polymeric filler is placed in the gap wherein a portion of the polymeric filler is drawn into the trench.

Abstract: A method and system for flexibly processing content objects is disclosed. A content object is stored on one of a plurality of storage devices. A request is received for the content object. Information corresponding to the requested object (e.g., a unique identifier) is transmitted to one or more content directories. A response is received from a first content directory indicating a location of the content object. The content object is requested from the first location, and at least part of the content object is received.

Abstract: A method of assembling a semiconductor chip device is provided that includes providing a circuit board including a surface with an aperture. A portion of a first heat spreader is positioned in the aperture. A stack is positioned on the first heat spreader. The stack includes a first semiconductor chip positioned on the first heat spreader and a substrate that has a first side coupled to the first semiconductor chip.

Abstract: Provided herein is a method and system for providing and analyzing unified data signaling that includes setting, or analyzing a state of a single indicator signal, generating or analyzing a data pattern of a plurality of data bits, and signal, or determine, based on the state of the single indicator signal and the pattern of the plurality of data bits, that data bus inversion has been applied to the plurality of data bits or that the plurality of data bits is poisoned.

Abstract: A method of manufacturing is provided that includes fabricating a first plurality of electrically functional interconnects on a front side of a first semiconductor chip and fabricating a first plurality of electrically non-functional interconnects on a back side of the first semiconductor chip. Additional chips may be stacked on the first semiconductor chip.

Abstract: A method of manufacturing is provided that includes providing a semiconductor chip with an insulating layer. The insulating layer includes a trench. A second semiconductor chip is stacked on the first semiconductor chip to leave a gap. A polymeric filler is placed in the gap wherein a portion of the polymeric filler is drawn into the trench.

Abstract: A method of manufacturing is provided that includes placing a removable cover on a surface of a substrate. The substrate includes a first semiconductor chip positioned on the surface. The first semiconductor chip includes a first sidewall. The removable cover includes a second sidewall positioned opposite the first sidewall. A first underfill is placed between the first semiconductor chip and the surface wherein the second sidewall provides a barrier to flow of the first underfill. Various apparatus are also disclosed.

Abstract: A method of manufacturing is provided that includes providing a semiconductor chip with an insulating layer. The insulating layer includes a trench. A second semiconductor chip is stacked on the first semiconductor chip to leave a gap. A polymeric filler is placed in the gap wherein a portion of the polymeric filler is drawn into the trench.

Abstract: Various interposers and methods of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a first test structure onboard an interposer that has a first side and second side opposite the first side. Additional test structures may be fabricated.

Abstract: Various interposers and method of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an identification structure to an interposer. The identification structure is operable to provide identification information about the interposer. The identification structure is programmable to create or alter the identification information.

Abstract: A method for processing content objects with resources associated with a content delivery network (CDN) having a plurality of geographically distributed points of presence (POPs) is disclosed. The resources are enrolled to be accessible from the CDN. Each resource is categorized using tags that categorize the resources. Selection of a policy from a plurality of policies is received, where the plurality of policies define processes to perform on content objects. The selected policy includes an applicability criteria and a call to the resource. Metadata is received at the CDN, the metadata being related to a content object, a requester of the content object and/or a provider of the content object. It is determined that the policy is applicable through analysis of the metadata and/or applicability criteria. The resource is called according to the call in the policy to cause the resource to perform specified processing on the content object.

Abstract: A method of manufacturing is provided that includes providing a semiconductor chip device that has a circuit board and a first semiconductor chip coupled thereto. A lid is placed on the circuit board. The lid includes an opening and an internal cavity. A liquid thermal interface material is placed in the internal cavity for thermal contact with the first semiconductor chip and the circuit board.

Abstract: A method and system for flexibly processing content objects is disclosed. A content object is stored on one of a plurality of storage devices. A request is received for the content object. Information corresponding to the requested object (e.g., a unique identifier) is transmitted to one or more content directories. A response is received from a first content directory indicating a location of the content object. The content object is requested from the first location, and at least part of the content object is received.

Abstract: A method of manufacturing is provided that includes fabricating a first plurality of electrically functional interconnects on a front side of a first semiconductor chip and fabricating a first plurality of electrically non-functional interconnects on a back side of the first semiconductor chip. Additional chips may be stacked on the first semiconductor chip.

Abstract: A method of manufacturing is provided that includes fabricating a first set of interconnect structures on a side of a first semiconductor substrate. The first semiconductor substrate is operable to have at least one of plural semiconductor substrates stacked on the side. The first set of interconnect structures is arranged in a pattern. Each of the plural semiconductor substrates has a second set of interconnect structures arranged in the pattern, one of the plural semiconductor substrates has a smallest footprint of the plural semiconductor substrates. The pattern has a footprint smaller than the smallest footprint of the plural semiconductor substrates.

Abstract: A method of manufacturing is provided that includes forming a first proximity interconnect on a first side of a first semiconductor chip and a first plurality of interconnect structures projecting from the first side. A second proximity interconnect is formed on a second side of a second semiconductor chip and a second plurality of interconnect structures are formed projecting from the second side. The second semiconductor chip is coupled to the first semiconductor chip so that the second side faces the first side and the first interconnect structures are coupled to the second interconnect structures. The first and second proximity interconnects cooperate to provide a proximity interface. The coupling of the first interconnect structures to the second interconnect structures provides desired vertical and lateral alignment of the first and second proximity interconnects.

Abstract: A method for populating edge servers within a content delivery network (CDN) having a plurality of points of presence (POPs) is disclosed. A first function is performed that gathers popularity information for a content object. Popularity trends for the popularity information are determined through analysis with historical popularity information. A number of copies of the content object for each of the plurality of POPs is determined. The number is passed as a variable to a second function. The second function is performed that adds or deletes copies of the content object for each of the plurality of POPs as a function of the popularity trend and the number.

Abstract: A method for processing content objects with a content delivery network (CDN) having a plurality of geographically distributed points of presence is disclosed. Selection of a policy is received from a plurality of policies, where the plurality of policies define processes to perform on content objects stored at the CDN. Each policy includes an applicability criteria and a storage disposition. Metadata is received at the CDN, the metadata characterizing a content object, a requester of the content object and/or a provider of the content object. The content object is received for storage at the CDN. A policy and other policies are determined to be applicable to the content object through analysis of the metadata and/or the applicability criteria. Overlap is resolved between the policy and the other policies found applicable to the content object. The processing of the policy is performed on the content object.