Abstract: A semiconductor package has a semiconductor chip on a wiring board, sealed with a sealant. A semiconductor package substrate is formed with V grooves along division lines from a resin layer side by use of a V blade. The wiring board is divided along the V grooves into individual semiconductor packages, while forming an inclined surface and a vertical surface at each package side surface. A shield layer is formed on the package upper surface and the package side surfaces. In this instance, the aspect ratio at the vertical surface side of the package interval is controlled, whereby an appropriate shield layer is formed on the package upper surface and the package inclined surfaces, thereby securing a shielding effect, and the shield layer is formed in a thin form on the package vertical surfaces and on the groove bottom between the packages, thereby restraining generation of burs.

Abstract: Disclosed herein is a method of manufacturing a semiconductor package including a semiconductor chip sealed by a sealing synthetic resin. The method includes preparing a wiring board in which upstanding encircling walls with side-surface shield layers embedded therein surround mounts on which semiconductor chips are to be mounted, mounting the semiconductor chips on the mounts surrounded by the upstanding encircling walls on the wiring board, supplying a sealing synthetic resin to spaces surrounded by the upstanding encircling walls thereby to produce an sealed board, dividing the sealed board along projected dicing lines into individual semiconductor packages, and forming an upper-surface shield layer for blocking electromagnetic waves on the semiconductor packages.

Abstract: A plurality of semiconductor packages are manufactured by a method that includes the steps of bonding a plurality of semiconductor chips on the front side of a wiring substrate, next supplying a sealing compound to the front side of the wiring substrate to form a resin layer from the sealing component on the front side of the wiring substrate, thereby forming a sealed substrate including the wiring substrate and the resin layer covering the semiconductor chips, next cutting the sealed substrate from the resin layer side by using a V blade to thereby form a V groove along each division line, next dividing the wiring substrate along each V groove to obtain a plurality of individual bare packages, and finally forming an electromagnetic shield layer on the upper surface and an inclined side surface of each bare package, thereby obtaining the plural semiconductor packages.