Patents by Inventor Byong Jin Kim

Byong Jin Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10910298
    Abstract: An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer. In one embodiment, a package body encapsulates the top surface of the insulating material and the electronic device, wherein the land bottom surfaces are exposed to the outside of the package body.
    Type: Grant
    Filed: February 3, 2018
    Date of Patent: February 2, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Ji Young Chung
  • Patent number: 10886339
    Abstract: A display device prevents cracks from spreading to an active area. The display device includes a substrate including an active area and a non-active area having a bending area, a thin-film transistor disposed in the active area, a light-emitting element disposed in the active area and connected to the thin-film transistor, an encapsulation layer disposed on the light-emitting element, a touch sensor disposed on the encapsulation layer, a touch pad disposed in the non-active area, a first routing line connecting the touch sensor to the touch pad via a second routing line in the bending area, and a crack prevention layer disposed on the second routing line in the bending area. Thus, the crack prevention layer is capable of preventing the occurrence of cracks in the bending area BA, thus preventing cracks from spreading to the active area AA.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: January 5, 2021
    Assignee: LG Display Co., Ltd.
    Inventors: Sang-Hyuk Won, Min-Joo Kim, Jae-Won Lee, Sang-Hoon Pak, Byong-Hoo Kim, Ji-Hye Lee, Jae-Man Jang, Sung-Jin Kim, Jae-Hyung Jang
  • Patent number: 10872935
    Abstract: Disclosed is a display device capable of being manufactured through a simplified process and having improved touch sensitivity. The display device includes an encapsulation unit disposed on a light-emitting element, a touch sensor disposed on the encapsulation unit, and an intermediate layer disposed between the encapsulation unit and the touch sensor. The intermediate layer includes a first intermediate layer, having a dielectric constant that is lower than a dielectric constant of an organic film disposed above or under the intermediate layer, and a second intermediate layer, having greater hardness than the first intermediate layer, whereby touch sensitivity is improved while processing is simplified.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: December 22, 2020
    Assignee: LG DISPLAY CO., LTD.
    Inventors: Byong-Hoo Kim, Min-Joo Kim, Eun-Pyo Hong, Jae-Won Lee, Sang-Hoon Pak, Sang-Hyuk Won, Jae-Man Jang, Sung-Jin Kim, Jae-Hyung Jang
  • Patent number: 10844286
    Abstract: The present invention relates to a method for producing an impregnated pitch from a petroleum-based raw material and to an impregnated pitch produced using the same, and when the method for producing an impregnated pitch according to the present invention is used, it is possible to produce an impregnated pitch having a high carbonization yield (40 wt % or more) and low quinoline insoluble matter (QI, 2% or less) for improving efficiency of an impregnation process from a petroleum-based raw material. Therefore, when an impregnation process is applied to a carbon compact by using the impregnated pitch according to the present invention, it is possible to remarkably reduce micropores inside the carbon compact, and to produce a carbon compact having physical properties such as excellent electrical conductivity and mechanical strength.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: November 24, 2020
    Assignee: KOREA RESEARCH INSTITUTE OF CHEMICAL TECHNOLOGY
    Inventors: Jong Gu Kim, Young-Pyo Jeon, Ji Sun Im, Byung Jin Song, Byong Chol Bai, Seung Hyun Ko, Jong Eun Choi
  • Patent number: 10814535
    Abstract: A hybrid lower arm and a hybrid upper arm include an arm body made of a metal material, and an insert injection-molded integrally with the arm body so that the insert is inserted into an inside of the arm body. The arm body has a weight ratio of 50% or more and 90% or less with respect to the total weight of the hybrid lower arm or the hybrid upper arm, thus achieving the rigidity increase as well as the weight reduction in the lower arm and the upper arm of a suspension system.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: October 27, 2020
    Assignee: ILJIN CO., LTD.
    Inventors: Sung Keun Lee, Hyun Woo Kim, Tae Sung Kwon, Byong Suk Yu, Se Woong Jeong, Hyuk Kwon, Ig Jin Kwon, Young In Yoon, Min Kook Park, Soon Chan Kwon, Dae Ju Lee
  • Publication number: 20200273789
    Abstract: Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process.
    Type: Application
    Filed: November 4, 2019
    Publication date: August 27, 2020
    Inventors: Seung Woo Lee, Byong Jin Kim, Won Bae Bang, Sang Goo Kang
  • Publication number: 20200258803
    Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.
    Type: Application
    Filed: April 29, 2020
    Publication date: August 13, 2020
    Applicant: Amkor Technology Singapore Holding Pte. Ltd
    Inventors: Won Bae BANG, Byong Jin KIM, Gi Jeong KIM, Jae Doo KWON, Hyung Il JEON
  • Publication number: 20200251422
    Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.
    Type: Application
    Filed: April 24, 2020
    Publication date: August 6, 2020
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
  • Publication number: 20200210005
    Abstract: Disclosed is a display device capable of reducing the reflection of external light. The display device includes an optical adhesive layer disposed between an element substrate, on which a light-emitting element and a touch sensor are disposed, and a cover substrate, wherein the optical adhesive layer includes a first lower adhesive layer disposed so as to overlap an emission area, in which the light-emitting element is disposed, and a second lower adhesive layer formed so as to have a shape different from the shape of the first lower adhesive layer, the second lower adhesive layer being disposed so as to overlap a non-emission area, excluding the emission area, whereby it is possible to improve optical efficiency while reducing the reflection of external light.
    Type: Application
    Filed: December 10, 2019
    Publication date: July 2, 2020
    Inventors: Keun-Young KIM, Byong-Hoo KIM, Young-Sub SHIN, Sung-Jin KIM
  • Patent number: 10685897
    Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: June 16, 2020
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon
  • Publication number: 20200152708
    Abstract: Disclosed is a display device capable of being manufactured through a simplified process and having improved touch sensitivity. The display device includes an encapsulation unit disposed on a light-emitting element, a touch sensor disposed on the encapsulation unit, and an intermediate layer disposed between the encapsulation unit and the touch sensor. The intermediate layer includes a first intermediate layer, having a dielectric constant that is lower than a dielectric constant of an organic film disposed above or under the intermediate layer, and a second intermediate layer, having greater hardness than the first intermediate layer, whereby touch sensitivity is improved while processing is simplified.
    Type: Application
    Filed: November 11, 2019
    Publication date: May 14, 2020
    Inventors: Byong-Hoo KIM, Min-Joo Kim, Eun-Pyo Hong, Jae-Won Lee, Sang-Hoon Pak, Sang-Hyuk Won, Jae-Man Jang, Sung-Jin Kim, Jae-Hyung Jang
  • Publication number: 20200152707
    Abstract: A display device prevents cracks from spreading to an active area. The display device includes a substrate including an active area and a non-active area having a bending area, a thin-film transistor disposed in the active area, a light-emitting element disposed in the active area and connected to the thin-film transistor, an encapsulation layer disposed on the light-emitting element, a touch sensor disposed on the encapsulation layer, a touch pad disposed in the non-active area, a first routing line connecting the touch sensor to the touch pad via a second routing line in the bending area, and a crack prevention layer disposed on the second routing line in the bending area. Thus, the crack prevention layer is capable of preventing the occurrence of cracks in the bending area BA, thus preventing cracks from spreading to the active area AA.
    Type: Application
    Filed: October 28, 2019
    Publication date: May 14, 2020
    Inventors: Sang-Hyuk WON, Min-Joo KIM, Jae-Won LEE, Sang-Hoon PAK, Byong-Hoo KIM, Ji-Hye LEE, Jae-Man JANG, Sung-Jin KIM, Jae-Hyung JANG
  • Publication number: 20200123448
    Abstract: The present invention relates to a method for producing an impregnated pitch from a petroleum-based raw material and to an impregnated pitch produced using the same, and when the method for producing an impregnated pitch according to the present invention is used, it is possible to produce an impregnated pitch having a high carbonization yield (40 wt % or more) and low quinoline insoluble matter (QI, 2% or less) for improving efficiency of an impregnation process from a petroleum-based raw material. Therefore, when an impregnation process is applied to a carbon compact by using the impregnated pitch according to the present invention, it is possible to remarkably reduce micropores inside the carbon compact, and to produce a carbon compact having physical properties such as excellent electrical conductivity and mechanical strength.
    Type: Application
    Filed: December 26, 2017
    Publication date: April 23, 2020
    Inventors: Jong Gu Kim, Young-Pyo Jeon, Ji Sun Im, Byung Jin Song, Byong Chol Bai, Seung Hyun Ko, Jong Eun Choi
  • Publication number: 20200124606
    Abstract: The present disclosure relates to a method for providing diagnostic information for biliary tract cancer and an apparatus for diagnosing biliary tract cancer. According to an aspect of the present disclosure, there is provided a method for providing diagnostic information for biliary tract cancer including obtaining biological samples; measuring concentration of a marker for predicting biliary tract cancer in the biological samples; and providing diagnostic information for biliary tract cancer using the measured concentration of the marker, where the marker includes Nudifloramide.
    Type: Application
    Filed: May 24, 2017
    Publication date: April 23, 2020
    Inventors: BYONG CHUL YOO, KYUNG HEE KIM, SANG MYUNG WOO, SUN-YOUNG KONG, TAE HYUN KIM, SANG JAE PARK, WOO JIN LEE, SUNG-SIK HAN
  • Patent number: 10468343
    Abstract: Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: November 5, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Seung Woo Lee, Byong Jin Kim, Won Bae Bang, Sang Goo Kang
  • Patent number: 10442262
    Abstract: A hybrid arm according to an embodiment of the present disclosure may include: a first body made of a metal material and formed with a plurality of end portions; a second body formed so as to fill an inner side of the first body by being insert-injection-molded to the first body; and a ball joint formed integrally at a first end portion among the plurality of end portions of the first body. The ball joint may include: a reinforcement member coupled to the first end portion; a bearing member formed with a space therein; a ball stud including a ball rotatably inserted into the space of the bearing member and a rod extending upward of the ball; and a housing interposed between the reinforcement member and the bearing member and formed integrally with the second body.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: October 15, 2019
    Assignee: ILJIN CO., LTD.
    Inventors: Tae-Sung Kwon, Sung-Geun Lee, Byong Suk Yu, Se Woong Jeong, Hyun-Woo Kim, Hyuk Kwon, Ig-Jin Kwon, Young In Yoon, Min Kook Park, Soon Chan Kwon
  • Patent number: 10410758
    Abstract: The present invention relates to a method for patterning a metal nanowire-based transparent conductive film through surface treatment and, more particularly, to a method wherein the refractive index is adjusted by adding an optical functional layer prior to a patterning process, the surface of a metal nanowire transparent conductive film is oxidized using a surface treatment agent composition or a salt compound is generated, thereby changing the color and insulating the surface, and a film having excellent visibility is patterned.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: September 10, 2019
    Assignee: DONGJIN SEMICHEM CO., LTD.
    Inventors: Byong Wook Lee, Sung Hyun Lee, Kyung Eun Kim, Myeong Jin Kim, Dong Min Seo, Seong Bae Kim
  • Patent number: 10366943
    Abstract: An electronic package includes a substrate having a conductive element. The conductive element includes a stepped portion disposed at an end of the conductive element. In one embodiment, the conductive element is a lead. In another embodiment, the conductive element is a die pad. The stepped portion includes a first groove extending inward from a lower surface of the first conductive element, and a second groove extending further inward from the first groove towards an upper surface of the conductive element. An electronic component is connected to the conductive element. In one embodiment, a clip is used to electrically connect the electronic component to the conductive element. An encapsulant encapsulates the electronic component and a portion of the substrate such that the stepped portion is exposed outside an exterior side surface of the encapsulant. The stepped portion is configured to improve the bonding strength of the electronic package when attached to a next level of assembly.
    Type: Grant
    Filed: September 16, 2017
    Date of Patent: July 30, 2019
    Assignee: Amkor Technology, Inc.
    Inventors: Byong Jin Kim, Jia Yunn Ting, Hyeong Il Jeon
  • Publication number: 20190088574
    Abstract: An electronic package includes a substrate having a conductive element. The conductive element includes a stepped portion disposed at an end of the conductive element. In one embodiment, the conductive element is a lead. In another embodiment, the conductive element is a die pad. The stepped portion includes a first groove extending inward from a lower surface of the first conductive element, and a second groove extending further inward from the first groove towards an upper surface of the conductive element. An electronic component is connected to the conductive element. In one embodiment, a clip is used to electrically connect the electronic component to the conductive element. An encapsulant encapsulates the electronic component and a portion of the substrate such that the stepped portion is exposed outside an exterior side surface of the encapsulant. The stepped portion is configured to improve the bonding strength of the electronic package when attached to a next level of assembly.
    Type: Application
    Filed: September 16, 2017
    Publication date: March 21, 2019
    Applicant: Amkor Technology, Inc.
    Inventors: Byong Jin KIM, Jia Yunn TING, Hyeong Il JEON
  • Patent number: 10224218
    Abstract: In one embodiment, a semiconductor package includes a multi-layer encapsulated conductive substrate having a fine pitch. The multi-layer encapsulated conductive substrate includes a conductive leads spaced apart from each other, a first encapsulant disposed between the leads, a first conductive layer electrically connected to the plurality of leads, conductive pillars disposed on the first conductive layer, a second encapsulant encapsulating the first conductive layer and the conductive pillars, and a second conductive layer electrically connected to the conductive pillars and exposed in the second encapsulant. A semiconductor die is electrically connected to the second patterned conductive layer. A third encapsulant covers at least the semiconductor die.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: March 5, 2019
    Assignee: Amkor Technology Inc.
    Inventors: Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Ji Young Chung