Patents by Inventor Byong Jin Kim
Byong Jin Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961794Abstract: An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer. In one embodiment, a package body encapsulates the top surface of the insulating material and the electronic device, wherein the land bottom surfaces are exposed to the outside of the package body.Type: GrantFiled: December 22, 2020Date of Patent: April 16, 2024Assignee: Amikor Technology Singapore Holding Pte. Ltd.Inventors: Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Ji Young Chung
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Publication number: 20240120262Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.Type: ApplicationFiled: December 15, 2023Publication date: April 11, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il JEON, Gi Jeong KIM, Yong Ho SON, Byong Jin KIM, Jae Min BAE, Seung Woo LEE
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Publication number: 20240096858Abstract: In one example, an electronic device comprises a lower substrate comprising a lower dielectric structure and a lower conductive structure, an electronic component coupled with a bottom side of the lower substrate and coupled with the lower conductive structure, an upper substrate over a top side of the lower substrate and comprising an upper dielectric structure and an upper conductive structure, an internal interconnect between the upper substrate and the lower substrate and coupled with the upper conductive structure and the lower conductive structure, and a first antenna component between the upper substrate and the lower substrate and coupled with the upper conductive structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: September 15, 2022Publication date: March 21, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Jae Beom Shim, Byong Jin Kim
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Publication number: 20240096766Abstract: In one example, a semiconductor device includes a substrate. The substrate includes a base including a top side and a cavity side opposite to the top side, leads extending from the cavity side, and an encapsulant interposed between the leads. An electronic component is located on the cavity side and spaced apart from the encapsulant. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: September 17, 2022Publication date: March 21, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il JEON, Byong Jin KIM, Gi Jeong KIM
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Publication number: 20240096725Abstract: In one example, an electronic device includes an embedded module, which includes a module substrate and module components coupled to the module substrate. A device substrate is coupled to the first module substrate. Device terminals are coupled to the module components and a device encapsulant structure encapsulates the embedded module, the device substrate, and the device terminals. A portion of the device substrate is exposed from the device encapsulant structure and portions of the device terminals are exposed from the device encapsulant structure. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: August 18, 2023Publication date: March 21, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Dae Young PARK, Byong Jin KIM, Gi Jeong KIM, Hyeong Il JEON, Kwang Soo SANG, Jin Young KHIM
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Publication number: 20240088059Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent to the package body, which is electrically connected to the conductive spaced-apart pillar structures.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Young Woo LEE, Jae Ung LEE, Byong Jin KIM, EunNaRa CHO, Ji Hoon OH, Young Seok KIM, Jin Young KHIM, Tae Kyeong HWANG, Jin Seong KIM, Gi Jung KIM
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Patent number: 11908779Abstract: A semiconductor package structure includes a substrate comprising a land structure. The land structure includes a first land section having a first height in a cross-sectional view and a second land section having a second height in the cross-sectional view that is different than the first height. A mold encapsulant is disposed adjacent a lateral portion of the first land section and is disposed below a bottom portion of the second land section. A semiconductor die is attached to the substrate, and includes a first major surface, a second major surface opposing the first major surface, and an outer perimeter. The semiconductor die further includes a bonding structure disposed adjacent the first major surface, which is coupled to the second land section such that the first land section is disposed outside the perimeter of the semiconductor die A mold member encapsulates at least portions of the semiconductor die.Type: GrantFiled: April 19, 2021Date of Patent: February 20, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung
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Patent number: 11887916Abstract: In one example, an electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. In some examples, the lead can further include a lead trace at the second side of the substrate. In some examples, the substrate can include a redistribution structure at the first side of the substrate.Type: GrantFiled: September 9, 2020Date of Patent: January 30, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Hyeong Il Jeon, Gi Jeong Kim, Yong Ho Son, Byong Jin Kim, Jae Min Bae, Seung Woo Lee
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Patent number: 11855000Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.Type: GrantFiled: June 6, 2022Date of Patent: December 26, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Young Woo Lee, Jae Ung Lee, Byong Jin Kim, EunNaRa Cho, Ji Hoon Oh, Young Seok Kim, Jin Young Khim, Tae Kyeong Hwang, Jin Seong Kim, Gi Jung Kim
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Publication number: 20230335883Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad. In an example, the conductive pillar structure can extend from the first package body surface to the second package body surface, the elongated conductive beam structure can be disposed adjoining the first package body surface and can be electrically connected to the conductive pillar structure, and a portion of the elongated conductive beam structure can be exposed outside of the package body.Type: ApplicationFiled: April 28, 2023Publication date: October 19, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Marc Alan MANGRUM, Hyung Jun CHO, Byong Jin KIM, Gi Jeong KIM, Jae Min BAE, Seung Mo KIM, Young Ju LEE
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Publication number: 20230240457Abstract: An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer. In one embodiment, a package body encapsulates the top surface of the insulating material and the electronic device, wherein the land bottom surfaces are exposed to the outside of the package body.Type: ApplicationFiled: December 22, 2020Publication date: August 3, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Won Bae BANG, Byong Jin KIM, Gi Jeong KIM, Ji Young CHUNG
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Patent number: 11677135Abstract: A method for forming packaged electronic device structure includes providing a conductive leadframe. The leadframe can include a die pad with a first major surface and a second major surface opposite to the first major surface, and a plurality of conductive leads. The method can include coupling an electronic device to the plurality of conductive leads. The method can include providing an antenna structure, which can include a conductive pillar structure and an elongated conductive beam structure. The method can include providing a package body encapsulating the electronic device, at least portions of each conductive lead, and at least portions of the die pad.Type: GrantFiled: January 27, 2021Date of Patent: June 13, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae, Seung Mo Kim, Young Ju Lee
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Publication number: 20230178459Abstract: In one example, a packaged electronic device includes a molded substrate. The molded substrate includes a conductive structure having an edge lead with an edge lead outward side and an edge lead inward side opposite to the edge lead outward side, and an inner lead having an inner lead outward side and an inner lead inward side opposite to the inner lead outward side. The molded substrate includes a substrate encapsulant covering a lower portion of the edge lead inward side, a lower portion of the inner lead inward side, and a lower portion of the inner lead outward side. An upper portion of the edge lead outward side and an upper portion of the inner lead outward side are exposed from the substrate encapsulant. An electronic component is connected to the edge lead and the inner lead. A body encapsulant covers the electronic component and portions of the conductive structure.Type: ApplicationFiled: December 7, 2021Publication date: June 8, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Gi Jeong KIM, Hyeong Il JEON, Byong Jin KIM, Junichiro ABE
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Publication number: 20230083412Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.Type: ApplicationFiled: November 18, 2022Publication date: March 16, 2023Applicant: Amkor Technology Singapore Holding Pte. LtdInventors: Won Bae BANG, Byong Jin KIM, Gi Jeong KIM, Jae Doo KWON, Hyung Il JEON
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Patent number: 11569163Abstract: Provided are a method for fabricating a semiconductor package and a semiconductor package using the same, which can simplify a fabricating process of the semiconductor package by forming a lead frame on which a semiconductor die can be mounted without a separate grinding process, and can improve product reliability by preventing warpage from occurring during a grinding process.Type: GrantFiled: October 11, 2021Date of Patent: January 31, 2023Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Seung Woo Lee, Byong Jin Kim, Won Bae Bang, Sang Goo Kang
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Publication number: 20230012815Abstract: In one example, a semiconductor device, includes a substrate having a substrate top side, a substrate bottom side, a substrate dielectric structure, and a substrate conductive structure. The substrate conductive structure includes a transceiver pattern proximate to a substrate top side. An antenna structure includes an antenna dielectric structure coupled to the substrate top side, an antenna conductive structure having an antenna element, and a cavity below the antenna element. The antenna element overlies the transceiver pattern. The cavity includes a cavity ceiling, a cavity base, and a cavity sidewall between the cavity ceiling and the cavity base.Type: ApplicationFiled: July 14, 2021Publication date: January 19, 2023Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Corey REICHMAN, Kyoung Yeon LEE, Se Man OH, Byong Jin KIM
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Patent number: 11508635Abstract: A packaged semiconductor device includes a routable molded lead frame structure with a surface finish layer. In one embodiment, the routable molded lead frame structure includes a first laminated layer including the surface finish layer, vias connected to the surface finish layer, and a first resin layer covering the vias leaving the top surface of the surface finish layer exposed. A second laminated layer includes second conductive patterns connected to the vias, bump pads connected to the second conductive patterns, and a second resin layer covering one side of the first resin layer, the second conductive patterns and the bump pads. A semiconductor die is electrically connected to the surface finish layer and an encapsulant covers the semiconductor die and another side of the first resin layer. The surface finish layer provides a customizable and improved bonding structure for connecting the semiconductor die to the routable molded lead frame structure.Type: GrantFiled: April 29, 2020Date of Patent: November 22, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon
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Publication number: 20220320010Abstract: A selectively shielded and/or three-dimensional semiconductor device and a method of manufacturing thereof. For example and without limitation, various aspects of this disclosure provide a semiconductor device that comprises a composite plate for selective shielding and/or a three-dimensional embedded component configuration.Type: ApplicationFiled: June 17, 2022Publication date: October 6, 2022Inventors: Jin Young Kim, Keun Soo Kim, Byong Jin Kim, Jae Yoon Kim, Do Hyun Na, Hyun Il Moon, Dae Byong Kang
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Publication number: 20220302043Abstract: An electronic device structure having a shielding structure includes a substrate with an electronic component electrically connected to the substrate. The shielding structure includes conductive spaced-apart pillar structures that have proximate ends connected to the substrate and distal ends spaced apart from the substrate, and that are laterally spaced apart from the first electronic component. In one embodiment, the conductive pillar structures are conductive wires attached at one end to the substrate with an opposing end extending away from the substrate so that the conductive wires are provided generally perpendicular to the substrate. A package body encapsulates the electronic component and the conductive spaced-apart pillar structures. In one embodiment, the shielding structure further includes a shielding layer disposed adjacent the package body, which is electrically connected to the conductive spaced-apart pillar structures. In one embodiment, the electrical connection is made through the package.Type: ApplicationFiled: June 6, 2022Publication date: September 22, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Young Woo Lee, Jae Ung Lee, Byong Jin Kim, EunNaRa Cho, Ji Hoon Oh, Young Seok Kim, Jin Young Khim, Tae Kyeong Hwang, Jin Seong Kim, Gi Jung Kim
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Publication number: 20220262762Abstract: In one example, a semiconductor device comprises an electronic component comprising a component face side, a component base side, a component lateral side connecting the component face side to the component base side, and a component port adjacent to the component face side, wherein the component port comprises a component port face. A clip structure comprises a first clip pad, a second clip pad, a first clip leg connecting the first clip pad to the second clip pad, and a first clip face. An encapsulant covers portions of the electronic component and the clip structure. The encapsulant comprises an encapsulant face, the first clip pad is coupled to the electronic component, and the component port face and the first clip face are exposed from the encapsulant face. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: May 6, 2022Publication date: August 18, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Ji Yeon RYU, Jae Beom SHIM, Tai Yong LEE, Byong Jin KIM