Patents by Inventor Byung Deuk Jeon

Byung Deuk Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140124953
    Abstract: A multi-chip semiconductor apparatus includes a plurality of semiconductor chips electrically connected and stacked. Each of the semiconductor chips trims a voltage level used in the semiconductor chip in response to a chip select signal.
    Type: Application
    Filed: January 10, 2014
    Publication date: May 8, 2014
    Applicant: SK hynix Inc.
    Inventors: Byung Deuk JEON, Nam Pyo HONG
  • Patent number: 8713384
    Abstract: A semiconductor apparatus includes first and second chips sharing first and second data channels. The first and second chips output normal data of the respective chips through the first and second data channels in a normal operation, and the first chip outputs test data of the first chip through the first data channel, and the second chip outputs test data of the second chip through the second data channel in a test operation.
    Type: Grant
    Filed: August 27, 2011
    Date of Patent: April 29, 2014
    Assignee: SK Hynix Inc.
    Inventor: Byung Deuk Jeon
  • Publication number: 20130279269
    Abstract: A semiconductor device includes two or more memory chips electrically coupled. Each of the memory chips includes global lines, a MUX unit, a selection unit, and an output unit. The global lines transmit data stored in memory cells. The MUX unit receives the data loaded onto the global lines to output a test data. The selection unit is inserted into two or more of the global lines and configured to output the test data instead of the data loaded onto the two or more global lines, in a test mode. The output unit is coupled to the global lines and is configured to output the data in a normal mode, and output the test data received from any one of the two or more global lines connected to the selection unit to an I/O pad based on information about the memory chip in a test mode.
    Type: Application
    Filed: August 31, 2012
    Publication date: October 24, 2013
    Applicant: SK hynix Inc.
    Inventor: Byung Deuk JEON
  • Publication number: 20130249107
    Abstract: A multi-chip semiconductor apparatus includes a plurality of semiconductor chips electrically connected and stacked. Each of the semiconductor chips trims a voltage level used in the semiconductor chip in response to a chip select signal.
    Type: Application
    Filed: August 30, 2012
    Publication date: September 26, 2013
    Applicant: SK HYNIX INC.
    Inventors: Byung Deuk JEON, Nam Pyo HONG
  • Patent number: 8493798
    Abstract: An apparatus for outputting data in a semiconductor integrated circuit includes a clock generation block configured to activate a first clock signal for outputting a data signal and a second clock signal for outputting a data strobe signal based on a predetermined timing, and a data output block configured to latch a pre-data signal and a pre-data strobe signal in response to the first clock signal and the second clock signal, respectively.
    Type: Grant
    Filed: December 31, 2008
    Date of Patent: July 23, 2013
    Assignee: SK hynix Inc.
    Inventor: Byung-Deuk Jeon
  • Publication number: 20130002342
    Abstract: A semiconductor apparatus includes first and second chips sharing first and second data channels. The first and second chips output normal data of the respective chips through the first and second data channels in a normal operation, and the first chip outputs test data of the first chip through the first data channel, and the second chip outputs test data of the second chip through the second data channel in a test operation.
    Type: Application
    Filed: August 27, 2011
    Publication date: January 3, 2013
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventor: Byung Deuk JEON
  • Patent number: 8339150
    Abstract: A semiconductor integrated circuit includes a bump pad through which data is outputted, a probe test pad having a larger size than the bump pad, a first output drive unit configured to drive the bump pad at a first drivability in response to output data, a second output drive unit configured to drive the probe test pad at a second drivability higher than the first drivability in response to the output data, and a multiplexing unit configured to transfer the output data to the first output drive unit or the second output drive unit in response to a test mode signal.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: December 25, 2012
    Assignee: Hynix Semiconductor, Inc.
    Inventors: Byung-Deuk Jeon, Dong-Geum Kang, Young-Jun Yoon
  • Patent number: 8305108
    Abstract: A semiconductor integrated circuit includes first and second bump pads configured to output data, a probe test pad coupled to the first bump pad, and a pipe latch unit configured to selectively transfer data loaded on first and second data lines to one of the first and second bump pads in response to a pipe output dividing signal during a normal mode, and sequentially transfer the data loaded on the first and second data lines to the probe test pad in response to the pipe output dividing signal during a test mode.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: November 6, 2012
    Assignee: Hynix Semiconductor Inc.
    Inventors: Byung-Deuk Jeon, Dong-Geum Kang, Young-Jun Yoon
  • Patent number: 8203371
    Abstract: A semiconductor integrated circuit includes a first node through which an input signal passes and an adjustment block including at least one delay unit electrically connected to the first node. The semiconductor integrated circuit also includes a correction block configured to generate a control signal which controls whether to activate a delay unit.
    Type: Grant
    Filed: July 20, 2010
    Date of Patent: June 19, 2012
    Assignee: SK Hynix Inc.
    Inventor: Byung Deuk Jeon
  • Patent number: 8031548
    Abstract: A voltage stabilization circuit includes a control signal generating unit to generate a control signal that is enabled when a supply voltage is unstable and a voltage level maintaining unit for selectively controlling total capacitance of a plurality of capacitors to stabilize the supply voltage in response to the control signal.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: October 4, 2011
    Assignee: Hynix Semiconductor Inc.
    Inventor: Byung Deuk Jeon
  • Publication number: 20110221468
    Abstract: A semiconductor integrated circuit includes first and second bump pads configured to output data, a probe test pad coupled to the first bump pad, and a pipe latch unit configured to selectively transfer data loaded on first and second data lines to one of the first and second bump pads in response to a pipe output dividing signal during a normal mode, and sequentially transfer the data loaded on the first and second data lines to the probe test pad in response to the pipe output dividing signal during a test mode.
    Type: Application
    Filed: May 24, 2011
    Publication date: September 15, 2011
    Inventors: Byung-Deuk Jeon, Dong-Geum Kang, Young-Jun Yoon
  • Publication number: 20110156731
    Abstract: A semiconductor integrated circuit includes a first bump pad and a second bump pad configured to perform at least one of a data input operation and a data output operation in a normal mode; a probe pad configured to perform at least one of a data input operation and a data output operation in a test mode; a data output unit configured to communicate a data to one of the first bump pad and the probe pad; a data input unit configured to communicate a data from one of the second bump pad and the probe pad; a first switching unit configured to connect the probe pad and the data output unit in response to a test mode signal; and a second switching unit configured to connect the probe pad and the data input unit in response to the test mode signal.
    Type: Application
    Filed: April 2, 2010
    Publication date: June 30, 2011
    Inventors: Young-Jun YOON, Dong-Geum Kang, Byung-Deuk Jeon
  • Publication number: 20110156738
    Abstract: A semiconductor integrated circuit includes a bump pad through which data is outputted, a probe test pad having a larger size than the bump pad, a first output drive unit configured to drive the bump pad at a first drivability in response to output data, a second output drive unit configured to drive the probe test pad at a second drivability higher than the first drivability in response to the output data, and a multiplexing unit configured to transfer the output data to the first output drive unit or the second output drive unit in response to a test mode signal.
    Type: Application
    Filed: December 29, 2009
    Publication date: June 30, 2011
    Inventors: Byung-Deuk Jeon, Dong-Geum Kang, Young-Jun Yoon
  • Publication number: 20110156748
    Abstract: A semiconductor integrated circuit includes first and second bump pads configured to output data, a probe test pad coupled to the first bump pad, and a pipe latch unit configured to selectively transfer data loaded on first and second data lines to one of the first and second bump pads in response to a pipe output dividing signal during a normal mode, and sequentially transfer the data loaded on the first and second data lines to the probe test pad in response to the pipe output dividing signal during a test mode.
    Type: Application
    Filed: February 15, 2010
    Publication date: June 30, 2011
    Inventors: Byung-Deuk JEON, Dong-Geum Kang, Young-Jun Yoon
  • Publication number: 20110156790
    Abstract: A semiconductor integrated circuit includes: a first node through which an input signal passes; an adjustment block including at least one delay unit electrically connected to the first node; and a correction block configured to generate a control signal which controls whether to activate a delay unit.
    Type: Application
    Filed: July 20, 2010
    Publication date: June 30, 2011
    Applicant: Hynix Semiconductor Inc.
    Inventor: Byung Deuk Jeon
  • Patent number: 7969180
    Abstract: A semiconductor integrated circuit includes first and second bump pads configured to output data, a probe test pad coupled to the first bump pad, and a pipe latch unit configured to selectively transfer data loaded on first and second data lines to one of the first and second bump pads in response to a pipe output dividing signal during a normal mode, and sequentially transfer the data loaded on the first and second data lines to the probe test pad in response to the pipe output dividing signal during a test mode.
    Type: Grant
    Filed: February 15, 2010
    Date of Patent: June 28, 2011
    Assignee: Hynix Semiconductor Inc.
    Inventors: Byung-Deuk Jeon, Dong-Geum Kang, Young-Jun Yoon
  • Publication number: 20090257286
    Abstract: An apparatus for outputting data in a semiconductor integrated circuit includes a clock generation block configured to activate a first clock signal for outputting a data signal and a second clock signal for outputting a data strobe signal based on a predetermined timing, and a data output block configured to latch a pre-data signal and a pre-data strobe signal in response to the first clock signal and the second clock signal, respectively.
    Type: Application
    Filed: December 31, 2008
    Publication date: October 15, 2009
    Applicant: Hynix Semiconductor Inc.
    Inventor: Byung Deuk Jeon
  • Publication number: 20090160542
    Abstract: A stable voltage generating circuit for a delay locked loop for generating a stable internal voltage for a delay locked loop and a semiconductor memory device including the same, and a method of generating a stable voltage for a delay locked loop is disclosed. The voltage generating circuit includes a first detector which compares a feedback voltage that represents the internal voltage for the delay locked loop with a reference voltage and outputs the comparison result as a first detection signal. A second detector detects the escape timing of a power down mode to provide a second detection signal having a configurable enable width interval after the escape timing of the power down mode. Finally, the voltage generating circuit includes a voltage driver which drives and outputs the internal voltage either the first detection signal or the second detection signal is enabled to maintain a stable internal voltage level.
    Type: Application
    Filed: July 2, 2008
    Publication date: June 25, 2009
    Inventor: Byung Deuk Jeon
  • Publication number: 20090147593
    Abstract: An output driver of a semiconductor memory apparatus comprises a voltage dividing block configured to generate divide voltages by dividing an internal voltage, a threshold voltage detecting block configured to generate a detecting voltage corresponding to a change in a threshold voltage of a transistor, a drive capability control signal generating block 300 configured to generate a compare signal by comparing the levels of the detecting voltage with the divide voltage and generate a control signal in response to an input signal when the compare signal is enabled, and a drive capability controlling block comprising a driver configured to perform a driving operation in response to the input signal, and a control driver configured to perform a driving operation in response to the control signal.
    Type: Application
    Filed: July 8, 2008
    Publication date: June 11, 2009
    Applicant: Hynix Semiconductor, Inc.
    Inventor: Byung Deuk Jeon
  • Publication number: 20080279030
    Abstract: A voltage stabilization circuit includes a control signal generating unit not generating a control signal that is enabled when a supply voltage is unstable and a voltage level maintaining unit for selectively controlling total capacitance of a plurality of capacitors to stabilize the supply voltage in response to the control signal.
    Type: Application
    Filed: December 20, 2007
    Publication date: November 13, 2008
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventor: Byung Deuk Jeon