Patents by Inventor Byung-hee Kim

Byung-hee Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200058551
    Abstract: Methods of manufacturing a semiconductor chip are provided. The methods may include providing a semiconductor substrate including integrated circuit regions and a cut region. The cut region may be between the integrated circuit regions. The methods may also include forming a modified layer by emitting a laser beam into the semiconductor substrate along the cut region, polishing an inactive surface of the semiconductor substrate to propagate a crack from the modified layer, and separating the integrated circuit regions along the crack. The cut region may include a plurality of multilayer metal patterns on an active surface of the semiconductor substrate, which is opposite to the inactive surface of the semiconductor substrate. The plurality of multilayer metal patterns may form a pyramid structure when viewed in cross section.
    Type: Application
    Filed: March 20, 2019
    Publication date: February 20, 2020
    Inventors: Byung-moon Bae, Yoon-sung Kim, Yun-hee Kim, Hyun-su Sim, Jun-ho Yoon, Jung-ho Choi
  • Publication number: 20200058443
    Abstract: A multilayer capacitor includes a body, including a stacked structure formed of a plurality of dielectric layers and a plurality of internal electrodes, and a plurality of external electrodes. Each external electrode includes a conductive layer, disposed at the end of the body and connected to the plurality of internal electrodes, and a plating layer covering the conductive layer. Each conductive layer includes nickel (Ni) and barium titanate (BT), and an area occupied by nickel with respect to the total area of the respective conductive layer is 30% to 65%.
    Type: Application
    Filed: November 8, 2018
    Publication date: February 20, 2020
    Inventors: Sung Hyung KANG, Yong Koo KIM, Hyung Kyu KIM, Won Hee YOO, Jong Hyun CHO, Byung Kil YUN, Seok Kyoon WOO, Hyun Sung DONG
  • Publication number: 20200044133
    Abstract: A thermoelectric module and a thermoelectric generator, the thermoelectric module includes a first substrate provided with a first electrode, a second substrate provided with a second electrode and disposed opposite to the first substrate, and a plurality of thermoelectric elements disposed between the first substrate and the second substrate and electrically connected to the first electrode and the second electrode. The thermoelectric elements may be sintered and bonded to each other with bonding layers containing silver (Ag) to be electrically connected between the first substrate and the second substrate, and may include Skutterudite-based thermoelectric elements electrically connected to the first electrode and BiTe-based thermoelectric elements connected to the Skutterudite-based thermoelectric elements with the bonding layers and electrically connected to the second electrode.
    Type: Application
    Filed: August 20, 2018
    Publication date: February 6, 2020
    Applicant: LG CHEM, LTD.
    Inventors: Dong Sik KIM, Byung Kyu LIM, Jaeki LEE, Cheol Hee PARK
  • Publication number: 20200020604
    Abstract: Provided is a semiconductor chip capable of withstanding damage such as cracks created in the fabrication process. A semiconductor chip according to the inventive concept includes: a semiconductor substrate including a residual scribe lane surrounding a die region and a periphery of a die of the die region, a passivation layer covering a portion above the semiconductor substrate, a cover protection layer covering a portion of the passivation layer and the die region, and a cover protection layer formed integrally with a buffering protection layer covering a portion of the residual scribe lane, wherein the buffering protection layer includes a corner protection layer in contact with a portion of an edge adjacent to a corner of the semiconductor substrate, and an extending protection layer extending along the residual scribe lane from the corner protection layer and in contact with the cover protection layer.
    Type: Application
    Filed: January 21, 2019
    Publication date: January 16, 2020
    Inventors: Yun-Hee Kim, Yoon-Sung Kim, Byung-Moon Bae, Hyun-Su Sim
  • Publication number: 20200021886
    Abstract: Disclosed is a preference-based service providing method for operating preference-based service providing system and device by executing an artificial intelligence (AI) algorithm and/or a machine learning algorithm in a 5G environment connected for the Internet of things. A preference-based service providing method according to an embodiment of the present disclosure may include acquiring user video information obtained by imaging a user who is using an electronic device, analyzing a preference of the user for a service provided by the electronic device on the basis of the user video information including a face image and a posture image of the user, setting a priority of the service provided by the electronic device on the basis of the preference of the user, and providing a recommendation list of services provided by the electronic device on the basis of priorities of the services.
    Type: Application
    Filed: September 26, 2019
    Publication date: January 16, 2020
    Applicant: LG ELECTRONICS INC.
    Inventors: Dae Woo KAWK, Youn Hee KIM, Kyung Jun PARK, Byung June JEONG
  • Patent number: 10536201
    Abstract: A coordinated transmission method based on beam division multiple access and an apparatus performing the same are disclosed. The coordinated transmission method in a beam division multiple access environment, which divides a service target region into a plurality of beam sectors through a plurality of antenna arrays having at least one of a pattern characteristic and a polarization characteristic, includes receiving a coordination request from a user terminal located in the service target region and performing any one among a macro diversity operation, a coordinated silence operation, and a coordinated beamforming operation for the user terminal based on an interference level included in the coordination request.
    Type: Grant
    Filed: February 22, 2016
    Date of Patent: January 14, 2020
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Dong Ho Cho, Byung Chang Chung, Dae Hee Park, Joon Sang Han, Yun Sik Kim
  • Patent number: 10533275
    Abstract: A laundry machine and a control method thereof are provided in which laundering ability may be improved while also improving efficiency and noise/vibration. The laundry machine employs a plurality of drum motions by varying drum rotational speed, drum rotational direction, and drum starting and stopping point, to provide different motion of laundry items in the drum.
    Type: Grant
    Filed: November 2, 2010
    Date of Patent: January 14, 2020
    Assignee: LG ELECTRONICS INC.
    Inventors: Myong Hun Im, Soo Young Oh, Kyung Chul Woo, Woo Young Kim, Byung Keol Choi, Moon Hee Hong
  • Publication number: 20190381185
    Abstract: In some aspects, the invention relates to an antibody-drug conjugate, comprising an antibody; a linker; and at least two active agents. In preferred embodiments, the linker comprises a peptide sequence of a plurality of amino acids, and at least two of the active agents are covalently coupled to side chains of the amino acids. The antibody-drug conjugate may comprise a self-immolative group, preferably two-self-immolative groups. The linker may comprise an O-substituted oxime, e.g., wherein the oxygen atom of the oxime is substituted with a group that covalently links the oxime to the active agent; and the carbon atom of the oxime is substituted with a group that covalently links the oxime to the antibody.
    Type: Application
    Filed: November 23, 2016
    Publication date: December 19, 2019
    Applicant: LegoChem Biosciences, Inc.
    Inventors: Yong Zu Kim, Yeong Soo Oh, Jeiwook Chae, Ho Young Song, Chul-Woong Chung, Yun Hee Park, Hyo Jung Choi, Kyung Eun Park, Hyoungrae Kim, Jinyeong Kim, Ji Young Min, Sung Min Kim, Byung soo Lee, Dong Hyun Woo, Ji Eun Jung, Su In Lee
  • Patent number: 10502440
    Abstract: Provided is a multi-pulsed jets generating apparatus including: at least one actuator that generates pulsed jets in a plurality of orifices according to a volume change of a plurality of cavities caused by vibration of at least one diaphragm; and a manifold connected to the at least one actuator so as to generate multi-pulsed jets by receiving the pulsed jets occurring in the plurality of orifices. The velocity and uniformity of the pulsed jets occurring in the plurality of injection ports can be controlled according to vibration phases of a plurality of diaphragms.
    Type: Grant
    Filed: April 13, 2015
    Date of Patent: December 10, 2019
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Ki Hwan Kwon, Jin Wook Yoon, Eun Bi Seo, Min Hee Kim, Chong Am Kim, Byung Hyun Lee
  • Publication number: 20190348592
    Abstract: A thermoelectric module that has excellent thermal, electric properties, can realize high joining force between thermoelectric elements and an electrode, and can maintain stable joining even at a high temperature.
    Type: Application
    Filed: May 30, 2018
    Publication date: November 14, 2019
    Applicant: LG CHEM, LTD.
    Inventors: Su Jin KIM, Il Ha LEE, Dong Sik KIM, Byung Kyu LIM, Cheol Hee PARK, Ki Hwan KIM
  • Publication number: 20190329230
    Abstract: The disclosed relates to a method for preparing an organic zinc catalyst used in the synthesis of a polyalkylene carbonate resin, an organic zinc catalyst provided therefrom, and a method for preparing a polyalkylene carbonate resin using the catalyst. The organic zinc catalyst according to the present disclosure includes a predetermined amount of Zr on the surface through a simple process, and thus can exhibit improved catalytic activity as compared to a conventional catalyst in the polymerization process for preparing a polyalkylene carbonate resin.
    Type: Application
    Filed: August 28, 2018
    Publication date: October 31, 2019
    Applicant: LG CHEM, LTD.
    Inventors: Jungup BANG, Kyosung PARK, Seung Young PARK, Gyo Hyun HWANG, Byung Hee CHOI, Sung-Kyoung KIM, Yongju BANG
  • Patent number: 10418326
    Abstract: A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes an interlayer insulating film on a substrate, the interlayer insulating film including an opening, a barrier conductive film extending along a sidewall of the opening and a bottom surface exposed by the opening, a first film disposed on the barrier conductive film and in the opening, and the first film including cobalt, and a conductive liner on the barrier conductive film, the conductive liner extending along a portion of a side all of the opening and including a metal other than cobalt.
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: September 17, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun Ji Jung, Rak Hwan Kim, Byung Hee Kim, Young Hun Kim, Gyeong Yun Han
  • Patent number: 10418210
    Abstract: Disclosed is a DC circuit breaker capable of interrupting fault currents flowing in both forward and backward directions. The DC circuit breaker includes: a first mechanical switch for interrupting a current in a DC transmission line; a first diode connected in parallel with the first mechanical switch; a second mechanical switch, connected in series with the first mechanical switch, for interrupting a current in the DC transmission line; a second diode connected in parallel with the second mechanical switch; an LC circuit connected in parallel with the first and second mechanical switches and including a capacitor and a reactor connected in series to induce LC resonance; a first unidirectional switching device connected in parallel with the LC circuit and switching a current to induce LC resonance; and a bidirectional switching device connected in series with the LC circuit and switching currents flowing in both forward and backward directions.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: September 17, 2019
    Assignee: HYOSUNG HEAVY INDUSTRIES CORPORATION
    Inventors: Byung Choul Kim, Se Hee Han, Jung Ki Hong, Young Seong Han
  • Publication number: 20190279904
    Abstract: A method of fabricating a semiconductor package includes providing a substrate on a stage, the substrate including semiconductor dies and a modified layer along a partition lane and sequentially having an adhesive film and a base film on a surface thereof so that bottom surfaces of the adhesive film and the base film face the stage and top surfaces of the adhesive film and the base film face away from the stage and the bottom surface of the adhesive film faces the top surface of the base film; separating the semiconductor dies from each other by applying a force to the substrate in a lateral direction; applying a gas pressure to a top surface of each of the semiconductor dies; and irradiating ultraviolet rays toward the adhesive film after applying the gas pressure on the top surface of each of the semiconductor dies.
    Type: Application
    Filed: March 11, 2019
    Publication date: September 12, 2019
    Inventors: Byong-gook Jeong, Byung-ho Kim, Youn-jo Mun, Jeong-cheol An, Sung-il Cho, Dae-sang Chun, Man-hee Han
  • Publication number: 20190280768
    Abstract: In the present invention, by providing a device for determining a state of an optical network terminal line including: an optical signal transfer interface configured to transfer a downlink signal transmitted from an optical line terminal to an optical network terminal line and to transfer an uplink signal transmitted from an optical network terminal connected to the optical network terminal line to the optical line terminal; an optical signal transmitter configured to transmit an optical signal to the optical signal transfer interface; an optical signal receiver configured to receive the downlink signal through the optical signal transfer interface, to receive a reflected signal corresponding to the optical signal, and to detect intensity of the downlink signal and the reflected signal; a signal converter configured to convert the reflected signal from an analog form to a digital form; a signal processor configured to analyze the reflected signal of a digital form and to determine the state of the optical ne
    Type: Application
    Filed: March 12, 2019
    Publication date: September 12, 2019
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Byung-Hee SON, Geun Yong KIM, Ryangsoo KIM, Jaein KIM, Hee Do KIM, Moon Kyun OH, Hark YOO, Gi-Ha YOON
  • Patent number: 10409126
    Abstract: A thin film transistor includes a gate electrode, a first insulating layer disposed to cover the gate electrode, a semiconductor layer disposed on the first insulating layer that includes a first side surface portion, a source electrode disposed on the semiconductor layer, and a drain electrode disposed on the first insulating layer that includes a second side surface portion. The first side surface portion makes contact with the second side surface portion.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: September 10, 2019
    Assignees: SAMSUNG DISPLAY CO., LTD., KOOKMIN UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATION
    Inventors: Jihun Lim, Byung Du Ahn, Gun Hee Kim, Junhyun Park, Jehun Lee, Jaewoo Park, Dae Hwan Kim, Hyunkwang Jung, Jaehyeong Kim
  • Patent number: 10402620
    Abstract: A fan-out semiconductor package includes: a core member including a support layer, a first wiring layer, a second wiring layer, and through-vias and having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant covering the core member and the semiconductor chip and filling at least portions of the through-hole; a connection member including an insulating layer disposed on the first wiring layer and the semiconductor chip, a redistribution layer disposed on the insulating layer, first vias electrically connecting the redistribution layer and the connection pads to each other, and second vias electrically connecting the redistribution layer and the first wiring layer to each other; and a passivation layer disposed on the insulating layer and covering the redistribution layer, wherein a thickness of the passivation layer is within half a distance from an inactive surface of the semiconductor chip to a lower surface of the encapsulant.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: September 3, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byung Ho Kim, Da Hee Kim, Joon Sung Kim, Joo Young Choi, Hee Sook Park, Tae Wook Kim
  • Patent number: 10388841
    Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: August 20, 2019
    Assignee: LG Innotek Co., Ltd.
    Inventors: Byung Mok Kim, Hiroshi Kodaira, Su Jung Jung, Bo Hee Kang, Young Jin No, Yuichiro Tanda, Satoshi Ozeki
  • Patent number: 10388563
    Abstract: A semiconductor device includes a lower layer, an upper layer on the lower layer, a contact between the lower layer and the upper layer, the contact electrically connects the lower layer and the upper layer, a capping pattern wrapping around the contact and covering an upper surface of the contact, a barrier layer wrapping around the capping pattern and covering a lower surface of the capping pattern and a lower surface of the contact, and an interlayer insulating layer between the lower layer and the upper layer, the interlayer insulating layer wrapping around the barrier layer and exposing an upper surface of the capping pattern, wherein the capping pattern includes a material having an etching selectivity with respect to an oxide.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: August 20, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Rak Hwan Kim, Byung Hee Kim, Sang Bom Kang, Jong Jin Lee, Eun Ji Jung
  • Patent number: 10376480
    Abstract: A biguanide derivative compound with N1-N5 substitution, which is represented by Formula 1, or a pharmaceutically acceptable salt thereof, a method of preparing the same, and a pharmaceutical composition containing the same as an active ingredient are provided. The biguanide derivative may exhibit excellent effect on activation of AMPK? and inhibition of cancer cell proliferation in a low dose, compared to conventional drugs, and thus, may be useful to treat diabetes mellitus, obesity, hyperlipidemia, hypercholesterolemia, fatty liver, coronary artery disease, osteoporosis, polycystic ovarian syndrome, metabolic syndrome, cancer, etc.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: August 13, 2019
    Assignee: ImmunoMet Therapeutics Inc.
    Inventors: Sung Wuk Kim, Sung Soo Jun, Chang Hee Min, Young Woong Kim, Min Seok Kang, Byung Kyu Oh, Se Hwan Park, Yong Eun Kim, Duck Kim, Ji Sun Lee, Ju Hoon Oh