Patents by Inventor Byung-hee Kim

Byung-hee Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10409126
    Abstract: A thin film transistor includes a gate electrode, a first insulating layer disposed to cover the gate electrode, a semiconductor layer disposed on the first insulating layer that includes a first side surface portion, a source electrode disposed on the semiconductor layer, and a drain electrode disposed on the first insulating layer that includes a second side surface portion. The first side surface portion makes contact with the second side surface portion.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: September 10, 2019
    Assignees: SAMSUNG DISPLAY CO., LTD., KOOKMIN UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATION
    Inventors: Jihun Lim, Byung Du Ahn, Gun Hee Kim, Junhyun Park, Jehun Lee, Jaewoo Park, Dae Hwan Kim, Hyunkwang Jung, Jaehyeong Kim
  • Patent number: 10402620
    Abstract: A fan-out semiconductor package includes: a core member including a support layer, a first wiring layer, a second wiring layer, and through-vias and having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant covering the core member and the semiconductor chip and filling at least portions of the through-hole; a connection member including an insulating layer disposed on the first wiring layer and the semiconductor chip, a redistribution layer disposed on the insulating layer, first vias electrically connecting the redistribution layer and the connection pads to each other, and second vias electrically connecting the redistribution layer and the first wiring layer to each other; and a passivation layer disposed on the insulating layer and covering the redistribution layer, wherein a thickness of the passivation layer is within half a distance from an inactive surface of the semiconductor chip to a lower surface of the encapsulant.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: September 3, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byung Ho Kim, Da Hee Kim, Joon Sung Kim, Joo Young Choi, Hee Sook Park, Tae Wook Kim
  • Patent number: 10388841
    Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: August 20, 2019
    Assignee: LG Innotek Co., Ltd.
    Inventors: Byung Mok Kim, Hiroshi Kodaira, Su Jung Jung, Bo Hee Kang, Young Jin No, Yuichiro Tanda, Satoshi Ozeki
  • Patent number: 10388563
    Abstract: A semiconductor device includes a lower layer, an upper layer on the lower layer, a contact between the lower layer and the upper layer, the contact electrically connects the lower layer and the upper layer, a capping pattern wrapping around the contact and covering an upper surface of the contact, a barrier layer wrapping around the capping pattern and covering a lower surface of the capping pattern and a lower surface of the contact, and an interlayer insulating layer between the lower layer and the upper layer, the interlayer insulating layer wrapping around the barrier layer and exposing an upper surface of the capping pattern, wherein the capping pattern includes a material having an etching selectivity with respect to an oxide.
    Type: Grant
    Filed: August 3, 2017
    Date of Patent: August 20, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Rak Hwan Kim, Byung Hee Kim, Sang Bom Kang, Jong Jin Lee, Eun Ji Jung
  • Patent number: 10376480
    Abstract: A biguanide derivative compound with N1-N5 substitution, which is represented by Formula 1, or a pharmaceutically acceptable salt thereof, a method of preparing the same, and a pharmaceutical composition containing the same as an active ingredient are provided. The biguanide derivative may exhibit excellent effect on activation of AMPK? and inhibition of cancer cell proliferation in a low dose, compared to conventional drugs, and thus, may be useful to treat diabetes mellitus, obesity, hyperlipidemia, hypercholesterolemia, fatty liver, coronary artery disease, osteoporosis, polycystic ovarian syndrome, metabolic syndrome, cancer, etc.
    Type: Grant
    Filed: May 10, 2018
    Date of Patent: August 13, 2019
    Assignee: ImmunoMet Therapeutics Inc.
    Inventors: Sung Wuk Kim, Sung Soo Jun, Chang Hee Min, Young Woong Kim, Min Seok Kang, Byung Kyu Oh, Se Hwan Park, Yong Eun Kim, Duck Kim, Ji Sun Lee, Ju Hoon Oh
  • Patent number: 10380404
    Abstract: A display device includes a substrate, display elements, a window, and a photo sensor array. The substrate includes a display area and a non-display area. The display elements overlap the display area. The window is disposed on the substrate. The photo sensor array is disposed between the substrate and the window. The photo sensor array is configured to sense three-dimensional pattern information (e.g., epidermal ridge information) of a user via light reflected from a touch input of the user. One or more of the display elements is configured to illuminate a contact area of the touch input with the light.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: August 13, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Young Chan Kim, Il Nam Kim, Kyung Tea Park, Byung Han Yoo, Tae Hee Lee
  • Patent number: 10361377
    Abstract: A novel condensed cyclic compound and an organic light emitting device including the same are disclosed.
    Type: Grant
    Filed: January 8, 2015
    Date of Patent: July 23, 2019
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Hyung-Sun Kim, Byung-Ku Kim, Young-Kwon Kim, Chang-Woo Kim, Joo-Hee Seo, Chang-Ju Shin, Seung-Jae Lee, Kyu Young Hwang
  • Patent number: 10353234
    Abstract: A liquid crystal display is provided. A liquid crystal display comprising a first substrate which comprises a display area and a non-display area, a second substrate which faces the first substrate, a sealing member which is disposed in the non-display area between the first substrate and the second substrate, wherein the first substrate comprises a light-shielding pattern, a column spacer which is protruded from the light-shielding pattern toward the second substrate to maintain an interval between the first substrate and the second substrate, an opening which is disposed in the light-shielding pattern, and overlapping the sealing member.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: July 16, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sang Hee Yu, Byung Chul Kim, Won Gap Yoon, Jae Hong Park, Young Joo Jeon, Kyung Seon Tak
  • Publication number: 20190206755
    Abstract: A semiconductor package includes a support member having first and second surfaces, having a cavity, and including a wiring structure, a semiconductor chip having connection pads, a connection member including a first insulating layer, a first redistribution layer on the first insulating layer, and a plurality of first vias connecting the wiring structure and the connection pads to the first redistribution layer and an encapsulant encapsulating the semiconductor chip, The wiring structure includes wiring patterns disposed on the second surface of the support member, and the first insulating layer includes a first insulating coating covering the wiring patterns and a second insulating coating disposed on the first insulating coating and having a higher level of flatness than that of the first insulating coating.
    Type: Application
    Filed: June 12, 2018
    Publication date: July 4, 2019
    Inventors: Joo Young CHOI, Joon Sung KIM, Young Min KIM, Da Hee KIM, Tae Wook KIM, Byung Ho KIM
  • Publication number: 20190206756
    Abstract: A semiconductor package includes a support member having first and second surfaces opposing each other, including a cavity penetrating through the first and second surfaces, and having a primer layer disposed on the first surface; a connection member disposed on the first surface of the support member and having a redistribution layer, the primer layer being disposed between the connection member and the support member; a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, the connection pads being electrically connected to the redistribution layer; and an encapsulant covering the second surface of the support member and the inactive surface of the semiconductor chip.
    Type: Application
    Filed: August 31, 2018
    Publication date: July 4, 2019
    Inventors: Joon Sung KIM, Doo Hwan LEE, Joo Young CHOI, Byung Ho KIM, Da Hee KIM, Tae Wook KIM
  • Patent number: 10336990
    Abstract: The present invention provides an ?-1,3 fucosyltransferase mutant having an increased expression level of soluble protein and increased activity, a DNA encoding the ?-1,3 fucosyltransferase mutant, a recombinant vector comprising the DNA encoding the ?-1,3 fucosyltransferase mutant, a host cell transformed with the recombinant DNA vector, an extract of the host cell, a method for producing 3-fucosyloligosaccharide, a method for preparing an ?-1,3 fucosyltransferase mutant, and a method for screening an ?-1,3 fucosyltransferase mutant. The ?-1,3 fucosyltransferase mutant of the present invention has a significantly increased soluble protein expression level and activity.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: July 2, 2019
    Assignee: Seoul National University R&DB Foundation
    Inventors: Byung Gee Kim, Yun Hee Choi
  • Patent number: 10332791
    Abstract: A semiconductor device includes an insulating interlayer disposed on a substrate, a first protection pattern, a first barrier pattern, a first adhesion pattern, and a first conductive pattern. The insulating interlayer includes a via hole and a first trench. The via hole extends through a lower portion of the insulating interlayer. The first trench is connected to the via hole and extends through an upper portion of the insulating interlayer. The first protection pattern covers a lower surface and sidewalls of the via hole and a portion of a lower surface and a lower sidewall of the first trench, and includes a conductive material. The first barrier pattern covers the protection pattern and an upper sidewall of the first trench. The first adhesion pattern covers the first barrier pattern. The first conductive pattern is disposed on the first adhesion pattern, and fills the via hale and the first trench.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ho-Yun Jeon, Rak-Hwan Kim, Byung-Hee Kim, Kyoung-Hee Nam, Jong-Jin Lee, Jae-Won Hwang
  • Publication number: 20190189744
    Abstract: Semiconductor devices may include a diffusion prevention insulation pattern, a plurality of conductive patterns, a barrier layer, and an insulating interlayer. The diffusion prevention insulation pattern may be formed on a substrate, and may include a plurality of protrusions protruding upwardly therefrom. Each of the conductive patterns may be formed on each of the protrusions of the diffusion prevention insulation pattern, and may have a sidewall inclined by an angle in a range of about 80 degrees to about 135 degrees to a top surface of the substrate. The barrier layer may cover a top surface and the sidewall of each if the conductive patterns. The insulating interlayer may be formed on the diffusion prevention insulation pattern and the barrier layer, and may have an air gap between neighboring ones of the conductive patterns.
    Type: Application
    Filed: February 13, 2019
    Publication date: June 20, 2019
    Inventors: Jin-Nam Kim, Rak-Hwan Kim, Byung-Hee Kim, Jong-Min Baek, Sang-Hoon Ahn, Nae-In Lee, Jong-Jin Lee, Ho-Yun Jeon, Eun-Ji Jung
  • Publication number: 20190189540
    Abstract: A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a first interlayer insulating layer including a first trench, on a substrate a first liner layer formed along a side wall and a bottom surface of the first trench and including noble metal, the noble metal belonging to one of a fifth period and a sixth period of a periodic chart that follows numbering of International Union of Pure and Applied Chemistry (IUPAC) and belonging to one of eighth to tenth groups of the periodic chart, and a first metal wire filling the first trench on the first liner layer, a top surface of the first metal wire having a convex shape toward a bottom surface of the first trench.
    Type: Application
    Filed: February 22, 2019
    Publication date: June 20, 2019
    Inventors: Jin-Nam Kim, Tsukasa MATSUDA, Rak-Hwan KIM, Byung-Hee KIM, Nae-In LEE, Jong-Jin LEE
  • Patent number: 10325733
    Abstract: A key button and a method of manufacturing the same are provided. The key button includes an upper surface, a side surface formed at a certain height along a border of the upper surface, and at least two worked surfaces formed to have a certain slope in a boundary portion between the side surface and the upper surface, wherein at least one first worked surface and at least one second worked surface are formed such that a shortest distance between the upper surface and the side surface differs from each other.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: June 18, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Byung-Sun Kim, Tae-Youl Kang, Cheol-Hee Kim
  • Patent number: 10315401
    Abstract: The present invention relates to a transferring method of graphene using a self-adhesive film.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: June 11, 2019
    Assignees: Seoul National University R&DB Foundation, Graphene Square Inc.
    Inventors: Byung Hee Hong, Sang Jin Kim, Myung Jin Park, In Su Jo
  • Patent number: 10304734
    Abstract: A semiconductor device includes a first insulating interlayer on a substrate, metal lines in the first insulating interlayer, a first air gap between the metal lines in a first region of the substrate and a second air gap between the first insulating interlayer and at least one of the metal lines in a second region of the substrate, a liner layer covering top surfaces and side walls of the metal lines and a top surface and a side wall of the first insulating interlayer, adjacent to the first and second air gaps, and a second insulating interlayer on the liner layer and contacting the liner layer.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: May 28, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Woo Kyung You, Jong Min Baek, Sang Shin Jang, Byung Hee Kim, Vietha Nguyen, Nae In Lee, Woo Jin Lee, Eun Ji Jung, Kyu Hee Han
  • Publication number: 20190154666
    Abstract: The present invention relates to a method for screening drug candidates for treating a disease using the interaction between calcium and phosphatidylinositol phosphate. Particularly in the present invention, it was confirmed that the concentration of calcium was increased in the obesity induced insulin resistance animal model and the increased calcium concentration inhibited the migration of Akt protein containing PH domain and the signal transduction, while the protein containing C2 domain was able to migrate to the cell membrane by binding to calcium/PIP complex even under the condition of high calcium concentration. Therefore, the investigation of the interaction between calcium and PIP can be a useful method for screening of drug candidates for treating metabolic disease, cancer or hypertension.
    Type: Application
    Filed: November 21, 2018
    Publication date: May 23, 2019
    Inventors: Byung-Chul Oh, Jin Ku Kang, Ok Hee Kim, Cheol Soon Lee
  • Publication number: 20190153051
    Abstract: The present invention relates to a fusion protein consisting of a C2 domain and an Akt protein fragment, particularly the fragment consisting of the amino acid residues ranging from the 111th to the 480th amino acids from the N-terminus of the Akt protein, and a use of the said fusion protein. More specifically, the fusion protein of the present invention increases the Akt protein activity even under the condition of high calcium concentration, reduces body weight and fat in an animal model treated with a high fat diet infected with adenovirus containing the fusion protein above, improves insulin resistance and improves fatty liver, so that the fusion protein comprising the C2 domain and the fragment consisting of the amino acid residues ranging from the 111th to 480th amino acids from the N-terminus of Akt protein can be effectively used for the treatment of metabolic disease.
    Type: Application
    Filed: November 21, 2018
    Publication date: May 23, 2019
    Inventors: Byung-Chul Oh, Jin Ku Kang, Ok Hee Kim, Cheol Soon Lee
  • Publication number: 20190151465
    Abstract: The present invention relates to antibody-drug conjugates (ADCs) wherein a plurality of active agents are conjugated to an antibody through at least one branched linker. The branched linker may comprise a branching unit, and two active agents are coupled to the branching unit through a secondary linker and the branching unit is coupled to the antibody by a primary linker. The active agents may be the same or different. In certain such embodiments, two or more such branched linkers are conjugated to the antibody, e.g., 2-4 branched linkers, which may each be coupled to a different C-terminal cysteine of a heavy or light chain of the antibody. The branched linker may comprise one active agent coupled to the branching unit by a first branch and a second branch that comprises a polyethylene glycol moiety coupled to the branching unit. In certain such embodiments, two or more such branched linkers are conjugated to the antibody, e.g.
    Type: Application
    Filed: November 23, 2016
    Publication date: May 23, 2019
    Inventors: Yong Zu Kim, Yeong Soo Oh, Jeiwook Chae, Ho Young Song, Chul-Woong Chung, Yun Hee Park, Hyo Jung Choi, Kyung Eun Park, Hyoungrae Kim, Jinyeong Kim, Ji Young Min, Sung Min Kim, Byung Soo Lee, Dong Hyun Woo, Ji Eun Jung, Su In Lee