Patents by Inventor Byung Moon
Byung Moon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9014463Abstract: A system for real-time stereo matching is provided, which provides improved stereo matching speed and rate by gradually optimizing a disparity range used in the stereo matching based on the stereo matching result of the previous frame image and thus reducing unnecessary matching computations.Type: GrantFiled: November 20, 2012Date of Patent: April 21, 2015Assignee: Kyungpook National University Industry-Academic Cooperation FoundationInventors: Byung In Moon, Seung-Ho Ok, Kyeong-ryeol Bae, Hyeon-Sik Son
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Patent number: 8790584Abstract: Disclosed is a system for refining UMG Si including a vacuum chamber, a cold crucible disposed within the vacuum chamber, a device disposed within the vacuum chamber to supply Si to the cold crucible, a steam plasma torch disposed above the cold crucible to apply steam plasma formed by introducing a reactive gas into plasma flame by an inert gas to the Si supplied to the cold crucible, and an impurity collector disposed above the cold crucible within the vacuum chamber to collect impurity gas generated in the cold crucible and discharge the collected impurity gas to the outside of the vacuum chamber.Type: GrantFiled: November 3, 2010Date of Patent: July 29, 2014Assignee: Korea Institute of Industrial TechnologyInventors: Byung Moon Moon, Je Sik Shin, Tae U Yu, Hyun Jin Koo, Dong Ho Park, Ho Moon Lee
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Patent number: 8683684Abstract: A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.Type: GrantFiled: October 5, 2011Date of Patent: April 1, 2014Assignees: Samsung Electro-Mechanics Co., Ltd., Samsung Electronics Co., Ltd.Inventors: Suk-Hyeon Cho, Je-Gwang Yoo, Byung-Moon Kim, Han-Seo Cho
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Publication number: 20140037856Abstract: Disclosed is a method for producing a zinc-aluminum-based alloy-coated steel sheet with superior workability and corrosion resistance by coating a base zinc-aluminum-based alloy-coated steel sheet in a coating bath comprising 35 to 55% by weight of zinc, 0.5 to 3% by weight of silicon, 0.005 to 1.0% by weight of chromium, 0.01 to 3.0% by weight of magnesium, 0.001 to 0.1% by weight of titanium, and the balance of aluminum and inevitable impurities. With the method, it is possible to produce a zinc-aluminum-based alloy-coated steel sheet which exhibits superior workability through control of an intermetallic compound layer (Zn—Al—Si—Cr) and formation of AlCr2 due to Cr component present in the coating layer, reduces detachment of the coating layer and cracks of coating occurring during molding, exhibits superior corrosion resistance even after processing and has considerably superior corrosion resistance due to Mg2Si alloy phase and inhibition of oxide film formation.Type: ApplicationFiled: July 25, 2013Publication date: February 6, 2014Applicant: UNION STEEL CO., LTD.Inventors: Byung-Sun MOON, Byung-Moon LIM, Young-Keun SONG, Su-Hwan JUNG, Cheol-Ho KWON
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Publication number: 20130314111Abstract: An apparatus for testing a thyristor valve includes: a current source circuit that provides an electric current when a thyristor valve as a test target is turned on; a voltage source circuit that provides a reverse voltage or a forward voltage when the thyristor valve is turned off; and a first auxiliary valve provided between a connection point between the thyristor valve and the voltage source circuit and the current source circuit, and that insulates the current source circuit from the voltage source circuit to protect the current source circuit from a high voltage of the voltage source circuit.Type: ApplicationFiled: May 8, 2013Publication date: November 28, 2013Applicants: Myongji University Industry and Academia Cooperation Foundation, Lsis Co., Ltd.Inventors: Seung Taek BAEK, Byung Moon HAN, Eui Cheol NHO, Yong Ho CHUNG, Wook Hwa LEE
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Publication number: 20130243995Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.Type: ApplicationFiled: May 6, 2013Publication date: September 19, 2013Inventors: Jin Ho KIM, Jin Yong AHN, Ki Hwan KIM, Byung Moon KIM, Seok Kyu LEE
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Patent number: 8435376Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.Type: GrantFiled: May 25, 2010Date of Patent: May 7, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin Ho Kim, Jin Yong Ahn, Ki Hwan Kim, Byung Moon Kim, Seok Kyu Lee
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Publication number: 20120324723Abstract: The present invention has been made in an effort to provide a method of manufacturing a coreless substrate that forms an opening by patterning a dry film for forming the opening onto one surface of a carrier, separating the carrier from the substrate, and removing only the dry film for forming the opening. In the present invention, since the pad can be exposed by removing only the dry film for forming the opening, a process time for forming the opening can be reduced and since a process is simple, a cost is saved.Type: ApplicationFiled: April 17, 2012Publication date: December 27, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Myeong Ho Hong, Byung Moon Kim, Hyun Hee Ku, Soon Oh Jung, Jae Joon Lee
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Publication number: 20120030940Abstract: A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.Type: ApplicationFiled: October 5, 2011Publication date: February 9, 2012Applicants: SAMSUNG LED CO.,LTD., SAMSUNG ELECTRO-MECHANICS CO.,LTD.Inventors: Suk-Hyeon Cho, Je-Gwang Yoo, Byung-Moon Kim, Han-Seo Cho
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Publication number: 20120015886Abstract: The present invention relates to a method for producing a recombinant, spider toxin peptide and analgesic compositions containing said peptide. More specifically, the present invention relates to a method in which the gene for GsMTx4 is subcloned into a vector, so that it is linked to a secretion signal sequence of the alpha factor and under the control of methanol-inducible alcohol oxidase (AOX) promoter to construct a recombinant yeast expression plasmid. Yeast cells are transformed with this plasmid to produce the GsMTx4 peptide and analgesic compositions containing said peptide. The recombinant yeast expression system of the present invention affords a more stable method for producing GsMTx4 than its natural route. Thus the GsMTx4 peptide and its derivatives produced by the method of this invention can be used in the cure of related diseases such as heart failure as the peptide specifically inhibits mechanosensitive ion channels.Type: ApplicationFiled: October 19, 2010Publication date: January 19, 2012Applicant: SEOUL NATIONAL UNIVERSITY INDUSTRY FOUNDATIONInventors: UhTaek OH, Byung Moon Kim, Seung Pyo Park, Heung Sik Na
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Patent number: 8064217Abstract: A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component.Type: GrantFiled: September 5, 2007Date of Patent: November 22, 2011Assignees: Samsung Electro-Mechanics Co., Ltd., Samsung LED Co., Ltd.Inventors: Suk-Hyeon Cho, Je-Gwang Yoo, Byung-Moon Kim, Han-Seo Cho
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Publication number: 20110159282Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.Type: ApplicationFiled: May 25, 2010Publication date: June 30, 2011Inventors: Jin Ho KIM, Jin Yong Ahn, Ki Hwan Kim, Byung Moon Kim, Seok Kyu Lee
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Publication number: 20110142724Abstract: Disclosed is a system for refining UMG Si including a vacuum chamber, a cold crucible disposed within the vacuum chamber, a device disposed within the vacuum chamber to supply Si to the cold crucible, a steam plasma torch disposed above the cold crucible to apply steam plasma formed by introducing a reactive gas into plasma flame by an inert gas to the Si supplied to the cold crucible, and an impurity collector disposed above the cold crucible within the vacuum chamber to collect impurity gas generated in the cold crucible and discharge the collected impurity gas to the outside of the vacuum chamber.Type: ApplicationFiled: November 3, 2010Publication date: June 16, 2011Inventors: Byung Moon Moon, Je Sik Shin, Tae U. Yu, Hyun Jin Koo, Dong Ho Park, Ho Moon Lee
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Patent number: 7961971Abstract: A method and apparatus for performing parallel box filtering in region based image processing is provided. The method of performing parallel box filtering in region based image processing includes selecting parallel pixel blocks having a size of M×N to be operated in parallel, selecting pixels included in a mask region having a size of K×L that is a parallel pixel operation region and a first region having a size of (M+K?1)×(N+L?1) that corresponds to overlapping masks of M*N, selecting pixels of a second region commonly included in the mask regions of M*N and storing the results of operation with respect to the pixels of the second region as repeated operation values, and operating block operation values with respect to the parallel pixel blocks using the repeated operation values.Type: GrantFiled: October 29, 2010Date of Patent: June 14, 2011Assignee: Daegu Gyeongbuk Institute of Science and TechnologyInventors: Soon Kwon, Jong Hun Lee, Kyeong Ryeol Bae, Byung In Moon
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Publication number: 20110116727Abstract: A method and apparatus for performing parallel box filtering in region based image processing is provided. The method of performing parallel box filtering in region based image processing includes selecting parallel pixel blocks having a size of M×N to be operated in parallel, selecting pixels included in a mask region having a size of K×L that is a parallel pixel operation region and a first region having a size of (M+K?1)×(N+L?1) that corresponds to overlapping masks of M*N, selecting pixels of a second region commonly included in the mask regions of M*N and storing the results of operation with respect to the pixels of the second region as repeated operation values, and operating block operation values with respect to the parallel pixel blocks using the repeated operation values.Type: ApplicationFiled: October 29, 2010Publication date: May 19, 2011Applicant: Daegu Gyeongbuk Institute of Science and Technolog yInventors: Soon Kwon, Jong Hun Lee, Kyeong Ryeol Bae, Byung In Moon
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Publication number: 20110079349Abstract: The present invention provides a method of manufacturing a printed circuit board including the steps of: preparing a pair of raw materials, each formed by sequentially stacking a release film and a first insulating layer, and an adhesive layer, respectively; embedding the pair of raw materials, which are opposed to each other, in the adhesive layer while disposing the release films toward an inner layer; forming a second insulating layer, which has a via formed therethrough and a circuit pattern formed on an upper surface to be connected to the via, on the first insulating layer; cutting edge portions of the second and first insulating layers, the release film, and the adhesive layer; and removing the release film from the first insulating layer.Type: ApplicationFiled: December 17, 2009Publication date: April 7, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Suk Hyeon Cho, Chang Sup Ryu, Jin Yong An, Soon Oh Jung, Sung Won Jeong, Byung Moon Kim, Dong Ju Jeon, Seok Kyu Lee, Jin Ho Kim
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Publication number: 20110048786Abstract: Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.Type: ApplicationFiled: August 27, 2010Publication date: March 3, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Suk Hyeon Cho, Jin Yong Ahn, Soon Oh Jung, Dong Ju Jeon, Ki Hwan Kim, Byung Moon Kim
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Publication number: 20100072327Abstract: A model railroad track system including first, second and third portions of model railroad track, and a movable portion of track that is movable between a first and a second position. When the movable portion is in the first position the movable portion is configured to guide a model train from the first portion of track to the second portion of track when the train moves across the movable portion in a direction of travel. When the movable portion is in the second position the movable portion is configured to guide a train from the first portion of track to the third portion of track when the train moves across the movable portion generally in the direction of travel. The system further includes an actuator movable between first and second positions, and wherein the distance between the first and second positions of the actuator constitutes a stroke length.Type: ApplicationFiled: September 24, 2008Publication date: March 25, 2010Applicant: POLK'S MODEL CRAFT HOBBIES, INC.Inventor: Byung Moon Song
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Patent number: 7499291Abstract: A DC power transmission system of a voltage source converter using a pulse-interleaving auxiliary circuit is disclosed. The converter system comprises an IGBT converter for converting an AC power to a DC power or the DC power to the AC power; an open Y-Y transformer and a Y-? transformer for stepping up or stepping down the AC power having a predetermined magnitude; a capacitor for dividing a DC voltage; and a DC Auxiliary circuit composed of a normal transformer and half-bridge for overlapping a pulse type input voltage to increase the number of pulses of an output waveform. In using a DC auxiliary circuit composed of normal transformer and 3-level half-bridge to increase the number of pulses of the output waveform by superposing the voltage in the form of the pulse, a normal transformer may be used instead of the tapped transformer to reduce the size thereof and to obtain an accurate transformer ratio, and a 3-level half-bridge may be used instead of the H-bridge to reduce the switching loss.Type: GrantFiled: January 12, 2007Date of Patent: March 3, 2009Assignee: Myongji University Industry and Academia Cooperation FoundationInventor: Byung Moon Han
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Publication number: 20090023183Abstract: The present invention relates to a method for producing a recombinant, spider toxin peptide and analgesic compositions containing said peptide. More specifically, the present invention relates to a method in which the gene for GsMTx4 is subcloned into a vector, so that it is linked to a secretion signal sequence of the alpha factor and under the control of methanol-inducible alcohol oxidase (AOX) promoter to construct a recombinant yeast expression plasmid. Yeast cells are transformed with this plasmid to produce the GsMTx4 peptide and analgesic compositions containing said peptide. The recombinant yeast expression system of the present invention affords a more stable method for producing GsMTx4 than its natural route. Thus the GsMTx4 peptide and its derivatives produced by the method of this invention can be used in the cure of related diseases such as heart failure as the peptide specifically inhibits mechanosensitive ion channels.Type: ApplicationFiled: October 18, 2006Publication date: January 22, 2009Applicant: Seoul National University Industry FoundationInventors: UhTaek Oh, Byung Moon Kim, Seung Pyo Park, Heung Sik Na