Abstract: The present invention relates to transferring torque between a first unit, which is typically a mobile machine or a robot, and a second unit, which is typically a fixed or stationary machine. The units are arranged such that a drive coupler of the first unit designed for delivering torque about a drive axis can engage the driven coupler, which belongs to the second unit and has a driven axis, along an engagement direction that is nearly perpendicular to the direction of the driven axis. A lateral displacement mechanism in provided is in the first unit to achieve a first-order coaxial alignment between the drive and driven axes. Additional measures such as compliance mechanisms are provided for improving engagement, coupling and reducing the level of axial misalignment in the apparatus and methods of the invention.

Abstract: The present invention relates to transferring torque between a first unit, such as a mobile machine or a robot, and a second unit, such as a fixed or stationary machine. The units are arranged such that a drive coupler of the first unit designed for delivering torque about a drive axis can engage the driven coupler, which belongs to the second unit and has a driven axis, along an engagement direction that is nearly perpendicular to the direction of the driven axis. A lateral displacement mechanism of the first unit achieves a first-order coaxial alignment between the drive and driven axes. Additional measures are provided for improving engagement, coupling and reducing the level of axial misalignment. The invention further pertains to a dual-mode torque delivery apparatus tolerant of imprecise alignment.

Abstract: Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling apparatus includes a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.

Abstract: Thermoelectric-enhanced air and liquid cooling of an electronic system is provided by a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.

Abstract: A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.

Abstract: A system for and method of removing one or more unwanted inband signals from a received communications signal is described. The inband signal or signals may comprise noise, interference signals, or any other unwanted signals that impact the quality of the underlying communications. A receiver receives a communication signal, the received communication signal including the desired communication signal and one or more inband signals. A signal separator processes the received signal to form an estimate of the desired communication signal and an estimate of the inband signals. A performance improver processes the received signal and the estimate of the one or more inband signals to form an improved estimate of the desired communication signal and an improved estimate of the inband signals.

Abstract: A cooling apparatus is provided which includes one or more coolant-cooled structures attached to one or more electronic components, one or more coolant conduits, and one or more coolant manifolds. The coolant-cooled structure(s) includes one or more coolant-carrying channels, and the coolant manifolds includes one or more rotatable manifold sections. One coolant conduit couples in fluid communication a respective rotatable manifold section and the coolant-carrying channel(s) of a respective coolant-cooled structure. The respective rotatable manifold section is rotatable relative to another portion of the coolant manifold to facilitate detaching of the coolant-cooled structure from its associated electronic component while maintaining the coolant-cooled structure in fluid communication with the respective rotatable manifold section through the one coolant conduit, which in one embodiment, is a substantially rigid coolant conduit.

Abstract: System and method for identifying tones present in a short segment of digitized music stream, and for reporting simultaneously and quantitatively their respective magnitude and phase in near real time. Also captured are pitch deviations from the nominal tones of a predetermined music scale. The resulting spectral data can be scrolled manually from frame to frame to facilitate detail music evaluation and editing. The apparatus can also operate at real time to display notes being played, or to tone-activate audio-visual music enhancement and display with automatic synchronization.

Abstract: Apparatus and method are provided for facilitating cooling of an electronic component of varying heat load. The apparatus includes a refrigerant evaporator coupled in thermal communication with the electronic component, a refrigerant loop coupled in fluid communication with the refrigerant evaporator for facilitating flow of refrigerant through the evaporator, and a thermoelectric array disposed in thermal communication with the evaporator. The thermoelectric array includes one or more thermoelectric elements, and is powered by a voltage and by a current of switchable polarity, which are controlled to maintain heat load on refrigerant flowing through the refrigerant evaporator within a steady state range, notwithstanding varying of the heat load applied to the refrigerant flowing through the refrigerant by the at least one electronic component.

Abstract: A plurality of microphones of a communication device is grouped into multiple microphone groups, such that each microphone group includes two or more microphones. For each microphone group, output of the corresponding microphones is processed to form an acoustic null in a corresponding spatial direction, such that sound from the corresponding spatial direction is attenuated in the processed output. One of the microphone groups is selected based on various factors leading to maximal echo attenuation and rejection of reverberant components of the room. The selected microphone group is then used to detect sound from a near end talker of the communication device.

Abstract: A method is provided for facilitating powering and cooling of one or more electronics racks. The method includes: providing a frame; associating at least one bulk power assembly with the frame, the at least one bulk power assembly being configured to provide power to the electronics rack(s), wherein the frame with the associated one or more bulk power assemblies is distinct from the electronics rack(s); and associating one or more heat exchange assemblies with the frame, the heat exchange assembly(ies) being configured to cool system coolant provided to the electronics rack(s). In operation, heat is transferred by the heat exchange assembly(ies) from the system coolant to a facility coolant, and the frame with the associated bulk power assembly(ies) and associated heat exchange assembly(ies) provides both power and cooling to the electronics rack(s).

Abstract: Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The cooled electronic module includes a substrate supporting the electronic component(s), and the cooling apparatus couples to the substrate, and includes a housing at least partially surrounding and forming a compartment about the electronic component(s). Additionally, the cooling apparatus includes a fluid and a deionization structure disposed within the compartment. The electronic component is at least partially immersed within the fluid, and the fluid is a water-based fluid. The deionization structure includes deionizing material, which ensures deionization of the fluid within the compartment. The deionization structure facilitates boiling heat transfer from the electronic component(s) to a condenser structure disposed in the compartment.

Abstract: An apparatus for facilitating servicing of a liquid-cooled electronics rack is provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.

Abstract: The invention encompasses pharmaceutical compositions comprising an antibody and methods of formulating antibodies. The heavy and/or a light chain variable region of the antibody may have certain characteristics. In some embodiments, the antibody may comprise an N-glycan site in a heavy and/or light chain variable region. The compositions may comprise a buffering agent and, optionally, a sugar and/or a salt.

Abstract: Techniques for utilizing blind source separation as a front-end to an acoustic echo canceller are described herein. The techniques include removing a first portion of an acoustic echo from an audio signal using blind source separation and a reference signal. The techniques then further remove a second portion of the acoustic echo using an acoustic echo canceller and the reference signal. Further, output of the blind source separation may be used to improve double-talk detection.

Abstract: A method for interlocking a plurality of servers to a server system is disclosed. The method comprises assigning an identifier to each of the plurality of servers, wherein the identifier associates each of the plurality of servers to the server system, thereby defining a plurality of interlocked servers.

Abstract: A heat exchange assembly and apparatus and method employing the heat exchange assembly are provided. The heat exchange assembly includes a coolant-to-refrigerant heat exchanger and a heater. The heat exchanger includes a coolant inlet and a coolant outlet for passing a coolant through the heat exchanger, and a refrigerant inlet and a refrigerant outlet for separately passing a refrigerant through the heat exchanger. The heat exchanger cools coolant passing through the heat exchanger by dissipating heat from coolant passing through the heat exchanger to refrigerant passing through the heat exchanger. The heater is integrated with the heat exchanger and applies an auxiliary heat load to refrigerant passing through the heat exchanger to facilitate ensuring that refrigerant passing through the heat exchanger absorbs at least a specified minimum heat load, for example, to ensure that refrigerant egressing from the refrigerant outlet of the heat exchanger is superheated vapor refrigerant.

Abstract: Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.