Patents by Inventor C. Chu
C. Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140102668Abstract: Apparatus and method are provided for cooling an electronic component. The apparatus includes a refrigerant evaporator in thermal communication with a component(s) to be cooled, and a refrigerant loop coupled in fluid communication with the evaporator for facilitating flow of refrigerant through the evaporator. The apparatus further includes a compressor in fluid communication with a refrigerant loop, an air-cooled heat sink coupled to the refrigerant evaporator, for providing backup cooling to the electronic component in a backup, air cooling mode, and a controllable refrigerant heater coupled to the heat sink. The refrigerant heater is in thermal communication across the heat sink with refrigerant passing through the refrigerant evaporator, and is controlled in a primary, refrigeration cooling mode to apply an auxiliary heat load to refrigerant passing through the refrigerant evaporator to ensure that refrigerant in the refrigerant loop entering the compressor is in a superheated thermodynamic state.Type: ApplicationFiled: December 19, 2013Publication date: April 17, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. CAMPBELL, Richard C. CHU, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Robert E. SIMONS
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Publication number: 20140102672Abstract: An automated multi-fluid cooling system and method are provided for cooling an electronic component(s). The cooling system includes a coolant loop, a coolant tank, multiple valves, and a controller. The coolant loop is at least partially exposed to outdoor ambient air temperature(s) during normal operation, and the coolant tank includes first and second reservoirs containing first and second fluids, respectively. The first fluid freezes at a lower temperature than the second, the second fluid has superior cooling properties compared with the first, and the two fluids are soluble. The multiple valves are controllable to selectively couple the first or second fluid into the coolant in the coolant loop, wherein the coolant includes at least the second fluid. The controller automatically controls the valves to vary first fluid concentration level in the coolant loop based on historical, current, or anticipated outdoor air ambient temperature(s) for a time of year.Type: ApplicationFiled: October 11, 2012Publication date: April 17, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Michael J. ELLSWORTH, Jr., Madhusudan K. IYENGAR, Robert E. SIMONS, Prabjit SINGH, Jing ZHANG
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Publication number: 20140096387Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).Type: ApplicationFiled: December 13, 2013Publication date: April 10, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Robert E. SIMONS
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Publication number: 20140096386Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).Type: ApplicationFiled: December 13, 2013Publication date: April 10, 2014Applicant: International Business Machines CorporationInventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Robert E. SIMONS
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Patent number: 8689861Abstract: A hybrid air and liquid coolant conditioning unit is provided for facilitating cooling of electronics rack(s) of a data center. The unit includes a first heat exchange assembly, including a liquid-to-liquid heat exchanger, a system coolant loop and a facility coolant loop, and a second heat exchange assembly, including an air-to-liquid heat exchanger, an air-moving device, and the facility coolant loop. The system coolant loop provides cooled system coolant to the electronics rack(s), and expels heat in the liquid-to-liquid heat exchanger from the electronics rack(s) to the facility coolant. The air-to-liquid heat exchanger extracts heat from the air of the data center and expels the heat to the facility coolant of the facility coolant loop. The facility coolant loop provides chilled facility coolant in parallel to the liquid-to-liquid heat exchanger and the air-to-liquid heat exchanger. In one implementation, the hybrid coolant conditioning unit includes a vapor-compression heat exchange assembly.Type: GrantFiled: April 26, 2011Date of Patent: April 8, 2014Assignee: International Business Machines CorporationInventors: Levi A. Campbell, Richard C. Chu, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Robert E. Simons
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Publication number: 20140085823Abstract: Cooling apparatuses and methods are provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The cooling apparatus includes a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.Type: ApplicationFiled: September 26, 2012Publication date: March 27, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Roger R. SCHMIDT, Robert E. SIMONS
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Publication number: 20140085822Abstract: Cooling apparatus and methods are provided for facilitating cooling of electronic components of an electronic system. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and an immersion-cooling fluid is disposed within the compartment. At least one component of the electronic system is at least partially non-immersed within the fluid in the compartment. A wicking film element is physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment. A coupling element physically couples the wicking film element to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.Type: ApplicationFiled: September 26, 2012Publication date: March 27, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Roger R. SCHMIDT, Robert E. SIMONS
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Publication number: 20140085817Abstract: A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board.Type: ApplicationFiled: March 7, 2013Publication date: March 27, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Roger R. SCHMIDT, Robert E. SIMONS
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Publication number: 20140068943Abstract: Thermoelectric-enhanced air and liquid cooling of an electronic system is facilitated by providing a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure.Type: ApplicationFiled: March 7, 2013Publication date: March 13, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Roger R. SCHMIDT, Robert E. SIMONS
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Publication number: 20140071626Abstract: A vapor condenser is provided which includes a three-dimensional folded structure which defines, at least in part, a set of coolant-carrying channels and a set of vapor condensing channels, with the coolant-carrying channels being interleaved with and extending parallel to the vapor condensing channels. The folded structure includes a thermally conductive sheet with multiple folds in the sheet. One side of the sheet is a vapor condensing surface, and the opposite side of the sheet is a coolant-cooled surface, with at least a portion of the coolant-cooled surface defining the coolant-carrying channels, and being in contact with coolant within the coolant-carrying channels. The vapor condenser further includes, in one embodiment, a top plate, and first and second end manifolds which are coupled to opposite ends of the folded structure and in fluid communication with the coolant-carrying channels to facilitate flow of coolant through the coolant-carrying channels.Type: ApplicationFiled: September 13, 2012Publication date: March 13, 2014Applicant: International Business Machines CorporationInventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, JR., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
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Publication number: 20140071627Abstract: Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component.Type: ApplicationFiled: September 13, 2012Publication date: March 13, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Roger R. SCHMIDT, Robert E. SIMONS
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Publication number: 20140069111Abstract: Thermoelectric-enhanced air and liquid cooling of an electronic system is provided by a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.Type: ApplicationFiled: September 13, 2012Publication date: March 13, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Roger R. SCHMIDT, Robert E. SIMONS
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Publication number: 20140053575Abstract: Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter.Type: ApplicationFiled: October 30, 2013Publication date: February 27, 2014Applicant: International Business Machines CorporationInventors: Levi A. CAMPBELL, Richard C. CHU, Evan G. COLGAN, Milnes P. DAVID, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Robert E. SIMONS
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Publication number: 20140055949Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.Type: ApplicationFiled: October 25, 2013Publication date: February 27, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. CAMPBELL, Richard C. CHU, Michael J. Ellsworth, JR., Madhusudan K. IYENGAR, Robert E. SIMONS
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Publication number: 20140049914Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.Type: ApplicationFiled: October 25, 2013Publication date: February 20, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. CAMPBELL, Richard C. CHU, Michael J. Ellsworth, JR., Madhusudan K. IYENGAR, Robert E. SIMONS
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Publication number: 20140049917Abstract: Dehumidifying cooling apparatus and method are provided for an electronics rack. The apparatus includes an air-to-liquid heat exchanger disposed at an air inlet or outlet side of the rack, wherein air flows through the rack from the air inlet to the air outlet side. The heat exchanger is positioned for air passing through the electronics rack to pass across the heat exchanger, and is in fluid communication with a coolant loop for passing coolant therethrough at a temperature below a dew point temperature of the air passing across the heat exchanger so that air passing across the heat exchanger is dehumidified and cooled. A condensate collector, disposed below the heat exchanger, collects liquid condensate from the dehumidifying of air passing through the electronics rack, wherein the heat exchanger includes a plurality of sloped surfaces configured to facilitate drainage of liquid condensate from the heat exchanger to the condensate collector.Type: ApplicationFiled: October 25, 2013Publication date: February 20, 2014Applicant: International Business Machines CorporationInventors: Levi A. CAMPBELL, Richard C. CHU, Michael J. Ellsworth, JR., Madhusudan K. IYENGAR, Robert E. SIMONS
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Publication number: 20140047702Abstract: A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.Type: ApplicationFiled: October 25, 2013Publication date: February 20, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Robert E. SIMONS, Prabjit SINGH
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Patent number: D700217Type: GrantFiled: July 16, 2013Date of Patent: February 25, 2014Inventor: Henry C. Chu
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Patent number: D700218Type: GrantFiled: July 16, 2013Date of Patent: February 25, 2014Inventor: Henry C. Chu
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Patent number: D700628Type: GrantFiled: July 16, 2013Date of Patent: March 4, 2014Inventor: Henry C. Chu