Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

Abstract: Cooling apparatuses and methods are provided for immersion-cooling one or more electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a fluid-tight compartment about the electronic component(s), and a boiling fluid mixture of first and second dielectric fluids within the fluid-tight compartment, with the electronic component(s) immersed within the mixture. A condensing fluid is also provided within the fluid-tight compartment, and is immiscible with the boiling fluid mixture. The condensing fluid has a lower specific gravity and a higher thermal conductivity than the boiling fluid mixture, and facilitates condensing of vaporized boiling fluid mixture. A cooling structure is provided within the compartment, and includes a condensing region and a sub-cooling region, with the condensing region being in contact with the condensing fluid, and the sub-cooling region being in contact with the boiling fluid mixture.

Abstract: A lithium-ion battery is provided that has a fast charge and discharge rate capability and low rate of capacity fade during high rate cycling. The battery can exhibit low impedance growth and other properties allowing for its use in hybrid electric vehicle applications and other applications where high power and long battery life are important features.

Abstract: A cooling system and method are provided for facilitating cooling of a liquid-cooled electronics rack. The cooling system includes a coolant flow controller, a modular cooling unit and a pressure controller. The flow controller is associated with a respective electronics rack and controls flow of coolant through that electronics rack based on its changing cooling requirements. The cooling unit includes an adjustable coolant pump for facilitating supply of coolant to the rack. The pressure controller is associated with the cooling unit for controlling pressure of coolant at an output of the cooling unit via control of pump speed of the pump. Responsive to adjusting coolant flow through the electronics rack, the pressure controller automatically adjusts pump speed of the adjustable pump to maintain pressure about a constant coolant pressure set point at an output of the cooling unit, thereby conserving power while still cooling the liquid-cooled electronics rack.

Abstract: Compression and decompression of image data, including a first image of an object. The first image may be divided into portions. For each portion, it may be determined whether the portion includes a part of the object. The image data may be compressed based on said determining. If a threshold ratio of portions that do not include a part of the object is reached, portions including a part of the object may be compressed according to a first compression method and portions not including a part of the object may not be compressed, where background information is stored for the portions not including a part of the object. If the threshold ratio of portions that do not include a part of the object is not reached, each portion of the object may be compressed according to the first compression method. The compressed data may be decompressed in a reverse fashion.

Abstract: A method of and system for determining cross-polarization isolation is described. In one embodiment, a modulated signal is obtained from a communication link. The modulated signal includes a modulated co-polarized signal component and a modulated cross-polarized signal component. Cross-polarization isolation is determined using the modulated co-polarized signal component and the modulated cross-polarized signal component. The determined cross-polarization isolation can be used to adjust an antenna.

Abstract: A heat sink, and cooled electronic structure and cooled electronic apparatus utilizing the heat sink, are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).

Abstract: A tissue-implantable sensor for measurement of solutes in fluids and gases, such as oxygen and glucose, is provided. The sensor includes: i) a detector array including at least one detector; ii) a telemetry transmission portal; iii) an electrical power source; and iv) circuitry electrically connected to the detector array including signal processing means for determining an analyte level, such as glucose level, in a body fluid contacting the detectors. The sensor components are disposed in a hermetically sealed housing having a size and shape suitable for comfortable, safe, and unobtrusive subcutaneous implantation allowing for in vivo detection and long term monitoring of tissue glucose concentrations by wireless telemetry.

Abstract: Vapor condensers and cooling apparatuses to facilitate vapor condensation cooling of a coolant employed in cooling an electronic device or electronic subsystem. The vapor condenser includes a thermally conductive base structure having an operational orientation when the condenser is facilitating vapor condensate formation, and a plurality of thermally conductive condenser fins extending from the thermally conductive base structure. The plurality of thermally conductive condenser fins have a varying cross-sectional perimeter along at least a portion of their length. The cross-sectional perimeters of the plurality of thermally conductive condenser fins are configured to increase in a direction of condensate travel.

Abstract: Apparatus and method are provided for facilitating cooling of one or more components of an electronics rack. The apparatus includes a liquid-cooled structure associated with the electronic component(s) to be cooled, and a liquid-to-air heat exchanger coupled in fluid communication with the liquid-cooled structure via a coolant loop to receive coolant from and supply coolant to the liquid-cooled structure. The heat exchanger is disposed external to the electronics rack within a cool air plenum of the data center containing the rack, and the plenum is coupled to a cool air source providing cooled air to the data center. Cooled air of the cool air plenum passes across the heat exchanger and cools coolant passing through the heat exchanger, which dissipates heat from the coolant passing therethrough to the cool air passing across the heat exchanger to facilitate liquid cooling of the electronic component(s) associated with the liquid-cooled structure.

Abstract: The present invention provides a method and apparatus for determining the transmit location of an emitter using a single geostationary satellite. In an embodiment, a signal is received at a ground station from the emitter and relayed by the geostationary satellite. The signal is received at the ground station at a plurality of time instances and has a plurality of observed frequencies, one for each time instance. A plurality of lines of position are determining based on the plurality of observed frequencies. The transmit location of the emitter is determined based on at least one intersection among the plurality of lines of position.

Abstract: A cooling apparatus and method are provided. The cooling apparatus includes a coolant-cooled heat exchanger for facilitating dissipation of heat generated within an electronics rack, and a coolant control apparatus. The coolant control apparatus includes at least one coolant recirculation conduit coupled in fluid communication between a facility coolant supply and return, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) associated with the recirculation conduit(s) and a controller which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a dew point temperature.

Abstract: Monitoring of cooling of an electronic component is provided, which includes: determining a current thermal resistance associated with one or more of the electronic component, a heat sink coupled to the electronic component, or a thermal interface coupling the electronic component and the heat sink; and determining, by a processor, whether the current thermal resistance exceeds a set thermal resistance threshold, and responsive to the current thermal resistance exceeding the set thermal resistance threshold, indicating a thermal resistance fault. As an enhancement, rate of change over time of the thermal resistance is determined, and compared against a rate of change threshold, and if exceeding the threshold, a rate of change thermal resistance warning is provided.

Abstract: Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.