Abstract: A system, method and computer program product are provided. In use, a first key is exchanged between a granting node and a requesting node via a peer-to-peer wireless network. Further, a human-perceptible hash is generated at the granting node and the requesting node, utilizing the first key. Such human-perceptible hashes are then compared via an out-of-band communication channel. To this end, a second key may then be transmitted to the requesting node for providing access to a centrally-based wireless network.

Abstract: A method and associated system is provided for cooling of a data center. The method includes providing coolant to multiple cooling elements in the data center using a heat pump refrigeration cycle to cool the coolant and provide a high temperature at the condenser. This allows the reclaiming of at least a portion of the heat removed from the refrigeration cycle using a heat engine. The engine is disposed between the refrigeration condenser and the ambient environment or cooling medium.

Abstract: An apparatus and method for cooling electronic components housed in a computer rack while performing maintenance operations is provided. The apparatus, in one embodiment, comprises a heat exchange assembly disposed within an outlet door cover of the computer rack, having one or more perforations. One or more air moving device(s) are also disposed on the outlet door and activated by an activator when the door is opened such that the devices when activated force hot air into the heat exchanger. Cool air is then exhausted through a planar containment plate having a plurality of edges. The plate is secured to top of the outlet door along one of its edges.

Abstract: A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.

Abstract: A cooling apparatus and method of fabrication are provided for facilitating removal of heat from a heat-generating electronic device. The method of fabrication includes: obtaining a solder material; disposing the solder material on a surface to be cooled; and reflowing and shaping the solder material disposed on the surface to be cooled to configure the solder material as a base with a plurality of fins extending therefrom. In addition to being in situ-configured on the surface to be cooled, the base is simultaneously metallurgically bonded to the surface to be cooled. The solder material, configured as the base with a plurality of fins extending therefrom, is a single, monolithic structure thermally attached to the surface to be cooled via the metallurgical bonding thereof to the surface to be cooled.

Abstract: A hybrid immersion cooling apparatus and method is provided for cooling of electronic components housed in a computing environment. The components are divided into primary and secondary heat generating components and are housed in a liquid sealed enclosure. The primary heat generating components are cooled by indirect liquid cooling provided by at least one cold plate having fins. The cold plate is coupled to a first coolant conduit that circulates a first coolant in the enclosure and supplies the cold plate. Immersion cooling is provided for secondary heat generating components through a second coolant that will be disposed inside the enclosure such as to partially submerge the cold plate and the first coolant conduit as well as the heat generating components.

Abstract: A hybrid immersion cooling apparatus and method is provided for cooling of electronic components housed in a computing environment. The components are divided into primary and secondary heat generating components and are housed in a liquid sealed enclosure. The primary heat generating components are cooled by indirect liquid cooling provided by at least one cold plate having fins. The cold plate is coupled to a first coolant conduit that circulates a first coolant in the enclosure and supplies the cold plate. Immersion cooling is provided for secondary heat generating components through a second coolant that will be disposed inside the enclosure such as to partially submerge the cold plate and the first coolant conduit as well as the heat generating components.

Abstract: Monitoring method and system are provided for dynamically determining rack airflow rate and rack power consumption employing a heat exchanger disposed at an air outlet side of the electronics rack. The method includes: sensing air temperature at the air outlet side of the electronics rack, sensing coolant temperature at a coolant inlet and coolant temperature at a coolant outlet of the heat exchanger, and determining airflow rate through the electronics rack; and outputting the determined airflow rate through the electronics rack. The determining employs the sensed air temperature at the air outlet side of the rack and the sensed coolant temperatures at the coolant inlet and outlet of the heat exchanger. In one embodiment, the heat exchanger is an air-to-air heat exchanger, and in another embodiment, the heat exchanger is an air-to-liquid heat exchanger.

Abstract: Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic system having multiple different types of electronic components. The apparatus includes a container sized to receive the electronic system, a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container, and a manifold structure associated with the container. The manifold structure includes a coolant jet plenum with an inlet opening in fluid communication with the coolant inlet port, and one or more jet orifices in fluid communication with the coolant jet plenum. The jet orifices are positioned to facilitate cooling of at least one electronic component of the multiple different types of electronic components by jet impingement of coolant thereon when the electronic system is operatively positioned within the container for immersion-cooling thereof.

Abstract: Apparatus and method are provided for facilitating liquid cooling of a plurality of blades of an electronic system chassis. The apparatus includes a chassis-level manifold assembly with a first coolant path and a plurality of second coolant paths. The first coolant path is isolated from the plurality of second coolant paths by a heat exchanger. The heat exchanger facilitates transfer of heat from coolant within the second coolant paths to coolant within the first coolant path. Each second coolant path is isolated from the other second coolant paths, and coolant passing therethrough facilitates cooling of a respective blade. When operational, each second coolant path forms a portion of a respective closed loop coolant path extending between the manifold assembly and the electronic system chassis, and in one embodiment, each blade is an immersion-blade, with multiple components thereof immersion-cooled by coolant flowing through the respective second coolant path.

Abstract: Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container. The apparatus further includes a coolant pump assembly coupled in fluid communication with the coolant inlet and outlet ports of the container for facilitating active pumping of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant is pumped through the container, the multiple different types of components of the electronic subsystem are immersion-cooled by the coolant.

Abstract: A method and associated assembly is provided for cooling of a computing embodiment having electronic components. The heat generating components are disposed in the vicinity of at least one cold plate providing direct liquid cooling. Coolant is provided to the cold plate which will eventually exit it through one or more ports or orifices placed on the sides or both side and bottom of the cold plate. The placement, size and number of port(s) or orifice(s) can be selectively adjusted to control amount of coolant flow. Effluent flow from the cold plate flows over the remaining immersion cooled components and then exits the liquid tight enclosure which houses the electronic components.

Abstract: Apparatus and method are provided for facilitating immersion-cooling of an electronic subsystem having multiple different types of components to be immersion-cooled. The apparatus includes a container sized to receive the electronic subsystem, and a hermetically sealed electrical connector disposed on a wall of the container. The electrical connector is sized and configured to receive an electrical and network connector of the electronic subsystem when the electronic subsystem is operatively inserted into the container, and to facilitate external electrical and network coupling to the subsystem. The apparatus further includes coolant inlet and outlet ports coupled to the container for facilitating ingress and egress of coolant through the container. When the electronic subsystem is operatively inserted into the container and coolant flows through the container, the electronic subsystem is immersion-cooled by the coolant.

Abstract: Embodiments provide systems and methods for determining the geolocation of an emitter on earth. A solution is obtained from two TDOA measurements that need not be acquired at the same time. A solution is obtained from a TDOA measurement and an FDOA measurement that need not be acquired at the same time and need not be coming from the same satellite pair. A location of an emitter can be determined from minimizing a cost function of the weighted combination of the six solutions derived from the two TDOA measurements and the two FDOA measurements, where the weight of each solution in the combination is determined based on the intersection angle of the two curves that define the possible locations of the emitter based on the TDOA and/or FDOA measurements.