Abstract: Monitoring method and system are provided for dynamically determining flow rate of a first fluid and a second fluid through a heat exchanger. The method includes: pre-characterizing the heat exchanger to generate pre-characterized correlation data correlating effectiveness of the heat exchanger to various flow rates of the first and second fluids through the heat exchanger; sensing inlet and outlet temperatures of the first and second fluids through the heat exchanger, when operational; automatically determining flow rates of the first and second fluids through the heat exchanger using the sensed inlet and outlet temperatures of the first and second fluids and the pre-characterized correlation data; and outputting the determined flow rates of the first and second fluids. The automatically determining employs the determined effectiveness of the heat exchanger in interpolating from the pre-characterized correlation data the flow rates of the first and second fluids.

Abstract: Method and air-cooling unit are provided for dynamically adjusting airflow rate through and heat removal rate of the air-cooling unit to facilitate cooling of one or more electronics racks of a data center. The air-cooling unit includes a housing, an air-moving device, and an air-to-liquid heat exchanger. The air-moving device moves air through the housing from the air inlet side to the air outlet side thereof, and the heat exchanger cools the air passing through the housing. A control unit controls the air-moving device and the flow of liquid coolant through the heat exchanger to automatically, dynamically adjust airflow rate and heat removal rate of the air-cooling unit to achieve a current airflow rate target and current heat removal rate target therefore. The current targets are based on airflow rate through and heat load generated by one or more associated electronics racks of the data center.

Abstract: Monitoring method and system are provided for dynamically determining rack airflow rate and rack power consumption employing a heat exchanger disposed at an air outlet side of the electronics rack. The method includes: sensing air temperature at the air outlet side of the electronics rack, sensing coolant temperature at a coolant inlet and coolant temperature at a coolant outlet of the heat exchanger, and determining airflow rate through the electronics rack; and outputting the determined airflow rate through the electronics rack. The determining employs the sensed air temperature at the air outlet side of the rack and the sensed coolant temperatures at the coolant inlet and outlet of the heat exchanger. In one embodiment, the heat exchanger is an air-to-air heat exchanger, and in another embodiment, the heat exchanger is an air-to-liquid heat exchanger.

Abstract: Identifying an operating system running on a computer system. In one aspect of the invention, an enumeration pattern is collected, the enumeration pattern describing an enumeration of a device that has been performed between the device and the operating system running on a host computer system. The type of the operating system running on the host computer system is identified based on the collected enumeration pattern.

Abstract: A fluid displacement apparatus includes a housing for receiving a refrigerant, a driving shaft rotatably received in the housing, a magnetic clutch attached to the driving shaft for rotation transmitting purposes, a fixed scroll disposed in the housing, an orbiting scroll rotatably received and engaged in the housing and interfitting with the fixed scroll for compressing the refrigerant and for generating a pressurized refrigerant, the housing includes a compartment communicating with the inner chamber of the housing with a passage for receiving a pressure sensing device which may sense the pressure of the pressurized refrigerant for detecting whether the refrigerant in the housing is over pressure or not.

Abstract: A method is provided for facilitating installation of one or more electronics racks within a data center. The method includes: placing a plurality of thermal simulators in the data center in a data center layout to establish a thermally simulated data center, each thermal simulator simulating at least one of airflow intake or heated airflow exhaust of a respective electronics rack of a plurality of electronics racks to be installed in the data center; monitoring temperature within the thermally simulated data center at multiple locations, and verifying the data center layout if measured temperatures are within respective acceptable temperature ranges for the data center when containing the plurality of electronics racks; and establishing the plurality of electronics racks within the data center using the verified data center layout, the establishing including at least one of reconfiguring or replacing each thermal simulator with a respective electronics rack.

Abstract: Apparatus and method are provided for facilitating simulation of heated airflow exhaust of an electronics subsystem, electronics rack or row of electronics racks. The apparatus includes a thermal simulator, which includes an air-moving device and a fluid-to-air heat exchanger. The air-moving device establishes airflow from an air inlet to air outlet side of the thermal simulator tailored to correlate to heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The fluid-to-air heat exchanger heats airflow through the thermal simulator, with temperature of airflow exhausting from the simulator being tailored to correlate to temperature of the heated airflow exhaust of the electronics subsystem, rack or row of racks being simulated. The apparatus further includes a fluid distribution apparatus, which includes a fluid distribution unit disposed separate from the fluid simulator and providing hot fluid to the fluid-to-air heat exchanger of the thermal simulator.

Abstract: Semiconductor integrated thermoelectric devices are provided, which are formed having high-density arrays of thermoelectric (TE) elements using semiconductor thin-film and VLSI (very large scale integration) fabrication processes. Thermoelectric devices can be either separately formed and bonded to semiconductor chips, or integrally formed within the non-active surface of semiconductor chips, for example.

Abstract: An apparatus for acclimating an aquatic organism, contained in a partially water filled plastic bag, to an environment in an aquarium includes an aquarium frame comprising a first portion exterior to the aquarium and a second portion interior to the aquarium. A bag holder is operable to hold a top of the plastic bag in an open position. The bag holder is positioned on the second portion where the top of the plastic bag is above a top level of water in the aquarium and a substantial portion of the plastic bag is below the top level. A dripping cup is operable to release water obtained from the aquarium into the plastic bag. The dripping cup is joinable to the first portion, whereby the aquatic organism is acclimated to a chemistry and temperature of the water in the aquarium.

Abstract: A hybrid air and liquid coolant conditioning unit is provided for facilitating cooling of electronics rack(s) of a data center. The unit includes a first heat exchange assembly, including a liquid-to-liquid heat exchanger, a system coolant loop and a facility coolant loop, and a second heat exchange assembly, including an air-to-liquid heat exchanger, an air-moving device, and the facility coolant loop. The system coolant loop provides cooled system coolant to the electronics rack(s), and expels heat in the liquid-to-liquid heat exchanger from the electronics rack(s) to the facility coolant. The air-to-liquid heat exchanger extracts heat from the air of the data center and expels the heat to the facility coolant of the facility coolant loop. The facility coolant loop provides chilled facility coolant in parallel to the liquid-to-liquid heat exchanger and the air-to-liquid heat exchanger. In one implementation, the hybrid coolant conditioning unit includes a vapor-compression heat exchange assembly.

Abstract: Apparatus and method for facilitating servicing of a liquid-cooled electronics rack are provided. The apparatus includes a coolant tank, a coolant pump in fluid communication with the coolant tank, multiple parallel-connected coolant supply lines coupling the coolant pump to a coolant supply port of the apparatus, and a coolant return port and a coolant return line coupled between the coolant return port and the coolant tank. Each coolant supply line includes a coolant control valve for selectively controlling flow of coolant therethrough pumped by the coolant pump from the coolant tank. At least one coolant supply line includes at least one filter, and one coolant supply line is a bypass line with no filter. When operational, the apparatus facilitates filling of coolant into a cooling system of a liquid-cooled electronics rack by allowing for selective filtering of coolant inserted into the cooling system.

Abstract: A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center.

Abstract: Electroactive compositions are disclosed for use in lithium ion battery electrodes. The compositions, such as multifunctional mixed metal olivines, provide an electrochemical cell having a plurality of open circuit voltages at different states of charge. The compositions afford improved state-of-charge monitoring, overcharge protection and/or overdischarge protection for lithium ion batteries.

Abstract: A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes.

Abstract: A docking station is provided for cooling an electronics rack of a data center. The docking station includes an enclosure having at least one wall, a cover coupled to the at least one wall, and a central opening sized to receive the electronics rack therein through an access opening in the wall. The enclosure is separate and freestanding from the electronics rack, and when the electronics rack is operatively positioned within the central opening, the enclosure surrounds the electronics rack and facilitates establishing a closed loop airflow path passing through air inlet and outlet sides of the rack and through an air return pathway of the enclosure. The docking station further includes an air-to-liquid heat exchange assembly disposed within the air return pathway of the enclosure for cooling circulating air passing through the closed loop airflow path.

Abstract: A docking station is provided for cooling an electronics rack of a data center. The docking station includes an enclosure having at least one wall, a cover coupled to the at least one wall, and a central opening sized to receive the electronics rack therein. The enclosure is separate and freestanding from the electronics rack and surrounds the electronics rack, and facilitates establishing a closed loop airflow path passing through air inlet and outlet sides of the rack and through an air return pathway of the enclosure. The docking station further includes an air-to-liquid heat exchange assembly, disposed within the air return pathway for cooling circulating air passing through the closed loop airflow path, and at least one modular cooling unit, disposed within the enclosure for providing system coolant to the air-to-liquid heat exchange assembly and to at least one electronics subsystem of the electronics rack.

Abstract: Applying firmware updates to servers in a data center, the servers including one or more active servers and a standby server, each server mapped to separate remote computer boot storage, including applying the firmware updates to the standby server; selecting an active server for firmware updating; powering off the selected active server by the system management server; remapping the standby server to the remote computer boot storage for the selected active server; rebooting the standby server from the remote computer boot storage for the selected active server, designating the standby server as an active server; remapping the selected active server to the remote computer boot storage formerly mapped to the standby server; and rebooting the selected active server from the remote boot storage formerly mapped to the standby server, designating the selected active server as a standby server.

Abstract: A method and system for a failover management module for a server blade chassis. A virtual out-of-band network connects management modules in different server blade chassis. Upon a detection of a failure of the management module(s) in a first server blade chassis, a management module in a second server blade chassis takes over control of the first server blade chassis.