Abstract: A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.

Abstract: Primary and alternate optimization procedures are used to improve the ITU-T G.723.1 speech coding standard (the “Standard”) by replacing the Hamming window of the Standard with an optimized window, with two windows, or with two windows and an additional performance of an autocorrelation method. When two windows replace the Hamming window, at least one of which is an optimized window, generally the first is used to determine optimized unquantized LP coefficients which are used to define an optimized perceptual weighting filter, and the second is used to determine optimized unquantized LP coefficients which are used to determine optimized synthesis coefficients. Optimized windows created using the primary and alternate optimization procedures and used in the Standard yield improvements in the objective and subjective quality of synthesized speech produced by the Standard. The improved Standard, methods, and widow can all be implemented as computer readable software code.

Abstract: A system for obtaining location information of a server. More particularly, embodiments of the present invention cause a node to obtain correlation of a first address of at least one target server with a second address of the at least one target server based on the second address of the at least one target server and a plurality of addresses similar in type to the first address. Embodiments further retrieve the correlation from the node. As a result, a client may access the correlated location information and communicate directly with the target server.

Abstract: Automated locating of electronics racks within a data center room is provided. The automated approach employs n wireless identification units associated with respective electronics racks of the data center, and first and second transceiver units positioned within the data center along a common plane at known X,Y locations. A monitor unit is in communication with the transceiver units, and automatically determines X,Y location within the data center room of each respective electronics rack employing, in part, first time differentials between transmission of a first broadcast signal by the first transceiver unit and receipt of response signals from the wireless identification units, second time differentials between transmission of a second broadcast signal from the second transceiver unit and receipt of response signals thereto from the wireless identification units, and the known X,Y locations within the data center of the transceiver units.

Abstract: Augmenting air cooling of electronics system using a cooling fluid to cool air entering the system, and to remove the heat dissipated by the electronics. A cooled electronics system includes a frame with drawers containing electronics components to be cooled. The frame includes a front with an air inlet and a back with an air outlet. A cabinet encases the frame, and includes a front cover positioned over the air inlet, a back cover positioned over the air outlet, and first and second side air returns at opposite sides of the frame. At least one air moving device establishes air flow across the electronics drawers. The air flow bifurcates at the back cover and returns to the air inlet via the first and second side air returns and the front cover. An air-to-liquid heat exchanger cools the air flowing across the electronics drawers.

Abstract: Compositions comprising nonpolar amino acids and specific binding agents to hepatocyte growth factor (HGF) are provided. Methods of making and using such compositions are also provided.

Abstract: A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.

Abstract: A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.

Abstract: A system for sensing an absolute two-dimensional position of an object having a two-dimensional target pattern thereon comprises a sensor and a controller. The sensor is for capturing an image of a subset of the target pattern. The controller is for generating a first image vector representing summations of rows of pixel values from the image, and a second image vector representing summations of columns of pixel values from the image. The controller is configured to determine an absolute two-dimensional position of the subset of the target pattern with respect to the origin of the target pattern based on the first image vector, the second image vector and target vectors that represent the target pattern.

Abstract: Cooling apparatuses and methods are provided for cooling an assembly including a substrate supporting multiple electronics components. The cooling apparatus includes: multiple discrete cold plates, each having a coolant inlet, a coolant outlet and at least one coolant chamber disposed therebetween; and multiple coolant-carrying tubes, each tube extending from a respective cold plate and being in fluid communication with the coolant inlet or outlet of the cold plate. An enclosure is provided having a perimeter region which engages the substrate to form a cavity with the electronics components and cold plates being disposed within the cavity. The enclosure is configured with multiple bores, each bore being sized and located to receive a respective coolant-carrying tube of the tubes extending from the cold plates. Further, the enclosure is configured with a manifold in fluid communication with the tubes for distributing coolant in parallel to the cold plates.

Abstract: An apparatus is provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.

Abstract: A heat exchanger, method of fabrication and cooled electronics system employing the heat exchanger are provided. The heat exchanger, which in one embodiment cools air provided to heat generating components of a computer system, is disposed at an angle with respect to a direction of airflow. The heat exchanger includes a plurality of primary fins oriented parallel, and at least one plurality of secondary fins extending from at least one of a leading edge and a trailing edge of the plurality of primary fins. Each secondary fin extends from a respective primary fin at an angle other than 0° to facilitate airflow through the heat exchanger. Additionally, the secondary fins are fixedly positioned relative to and integral with the primary fins, thereby providing an increased heat transfer surface area.

Abstract: An aggregated server blade system includes a plurality of individual server blades and a management module which can be designated as a bootable device. A boot list maintained and executed in each server blade includes a management module entry in its list of bootable devices. In response to the management module entry being selected or otherwise made active as the bootable device for a particular blade, an alternative bootable-devices list maintained on the management module is referenced and the boot process proceeds according to the alternative list.

Abstract: A method and system for load balancing switch modules in a server system and a computer system utilizing the same is disclosed. In a first aspect, the method comprises assigning each of a plurality of servers to a switch module of a plurality of switch modules, such that a number of servers assigned to each of the plurality of switch modules is substantially equal. In a second aspect, a computer system comprises a plurality of servers coupled to a plurality of switch modules, a management module, and a load balancing mechanism coupled to the management module, wherein the load balancing mechanism assigns each of the plurality of servers to a switch module of the plurality of switch modules, such that a number of servers assigned to each of the plurality of switch modules is substantially equal.

Abstract: A cooling method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center.