Abstract: Apparatus for automatically alerting a user of a handheld communications device of an incoming transmission includes a plurality of sensors each of which produces a signal indicative of a physical parameter of a surrounding environment of the handheld communications device. Also included is a processor that executes a programmed set of instructions to determine an optimal alert mode setting based on a combination of the sensor signals. A plurality of output units produces one or more sensory alert outputs In response to the optimal alert mode setting. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. 37 CFR 1.72(b).

Abstract: A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each configured for separate, hinged mounting to the electronics rack. The apparatus further includes a coolant distribution apparatus, wherein a coolant supply manifold thereof is mounted to the first door and a coolant return manifold thereof is mounted to the second door. Separate connections are coupled in fluid communication with the coolant supply and return manifolds for facilitating supply and return of coolant to and from the manifolds, and for facilitating pivotal movement of the doors relative to the electronics rack. A plurality of coolant distribution ports are provided within the supply and return manifolds, and disposed to facilitate supply and return of coolant to the electronics drawers.

Abstract: A cooling system and method are provided which include a facility cooling unit, a cooling tower, and one or more thermal capacitor units. The facility cooling unit, which includes a heat dissipation coolant loop, facilitates thermal energy extraction from a facility, such as a data center, for expelling of the energy to coolant within the heat dissipation coolant loop. The cooling tower is in fluid communication with the coolant loop, and includes a liquid-to-air heat exchanger for expelling thermal energy from coolant of the heat dissipation coolant loop to the surrounding environment. The thermal capacitor unit is in fluid communication with the heat dissipation coolant loop to facilitate efficient thermal energy transfer from coolant with in the coolant loop to the surrounding environment with variation in ambient temperature about the cooling tower.

Abstract: The invention is a signal processing system and method having increased bandwidth. An embodiment of the invention is a method of processing an analog input signal. The analog input signal is split into a first set of signals. The first set of signals are filtered. The first set of signals are digitized to form a second set of signals. The second set of signals are filtered to form a third set of signals. The third set of signals are combined to form a combined signal by adding the signals in the third set signals together to form a digital version of the analog input signal.

Abstract: A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.

Abstract: A location system and a location system on a chip (LCoS) and method are described.

Abstract: A cooled electronic module and method of fabrication are provided employing a cooling apparatus for removing heat from one or more electronic devices disposed on a substrate. The cooling apparatus includes a supply manifold structure having a plurality of inlet orifices for injecting coolant onto a surface to be cooled, and a return manifold structure. The return manifold structure, which is fabricated of a thermally conductive material, has a base surface sealed to the surface to be cooled along a periphery thereof employing a thermally conductive, coolant-tight seal. The return manifold structure provides at least one return passageway for exhausting coolant after impinging on the surface to be cooled, wherein coolant exhausting through the at least one passageway cools the return manifold structure, thereby facilitating further cooling of the surface to be cooled in a region where the base surface is sealed to the surface to be cooled.

Abstract: A cooling apparatus is provided for facilitating cooling of electronics drawers of an electronics rack. The apparatus includes a bi-fold door assembly configured for mounting to the electronics rack. The door assembly includes a first door and a second door, each configured for separate, hinged mounting to the electronics rack. The apparatus further includes a coolant distribution apparatus, wherein a coolant supply manifold thereof is mounted to the first door and a coolant return manifold thereof is mounted to the second door. Separate swivel connections are coupled in fluid communication with the coolant supply and return manifolds for facilitating supply and return of coolant to and from the manifolds, and for facilitating pivotal movement of the doors relative to the electronics rack. A plurality of coolant distribution ports are provided within the supply and return manifolds, and disposed to facilitate supply and return of coolant to the electronics drawers.

Abstract: A system for interlocking a plurality of servers to a server system is disclosed. In a first aspect, a computer system comprises a plurality of servers, a management module coupled to each of the plurality of servers, and an interlock mechanism coupled to the management module, wherein the interlock mechanism assigns to each of the plurality of servers an identifier that associates each of the plurality of servers to the server system, thereby defining a plurality of interlocked servers.

Abstract: A system for cooling an electronics system is provided. The cooling system includes a monolithic structure preconfigured for cooling multiple electronic components of the electronics system when coupled thereto. The monolithic structure includes multiple liquid-cooled cold plates configured and disposed in spaced relation to couple to respective electronic components; a plurality of coolant-carrying tubes metallurgically bonded in fluid communication with the multiple liquid-cooled cold plates, and a liquid-coolant header subassembly metallurgically bonded in fluid communication with multiple coolant-carrying tubes. The header subassembly includes a coolant supply header metallurgically bonded to coolant supply tubes and a coolant return header metallurgically bonded to coolant return tubes.

Abstract: A cooling system and method are provided for cooling air exiting one or more electronics racks of a data center. The cooling system includes at least one cooling station separate and freestanding from at least one respective electronics rack of the data center, and configured for disposition of an air outlet side of electronics rack adjacent thereto for cooling egressing air from the electronics rack. The cooling station includes a frame structure separate and freestanding from the respective electronics rack, and an air-to-liquid heat exchange assembly supported by the frame structure. The heat exchange assembly includes an inlet and an outlet configured to respectively couple to coolant supply and coolant return lines for facilitating passage of coolant therethrough. The air-to-liquid heat exchange assembly is sized to cool egressing air from the air outlet side of the respective electronics rack before being expelled into the data center.

Abstract: An interdental toothbrush device includes a handle having one or more wires and fixed filaments disposed on each end, and a gage disposed on an outer end portion of the wires and having an outer diameter equal to or smaller than that of the filaments for limiting and guiding the wires and the filaments to engage into the predetermined or suitable or selected interdental spaces between the teeth of the user and for preventing the filaments from being inserted and engaged into the interdental spaces having a relatively smaller width and thus for preventing the user's gum from being hurt or injured by the greater filaments.

Abstract: A cooling apparatus and method of fabrication are provided for facilitating removal of heat from an electronic device. The cooling apparatus includes a manifold structure having a plurality of inlet and outlet passageways for injecting coolant onto, and exhausting coolant after impinging on, a surface to be cooled. The coolant inlet and outlet passageways are interleaved in the manifold structure, and coolant is injected and exhausted through a common edge of the manifold. The manifold structure further includes coolant inlet and outlet plenums, with coolant passing through the inlet passageways from the inlet plenum in a first direction and coolant passing through the outlet passageways to the outlet plenum in a second direction, the first and second directions being perpendicular to the surface to be cooled and being opposite directions, and wherein the manifold structure is contained within a rectangular volume defined by a projection of the common edge.

Abstract: A motorized interdental toothbrush includes one or more wires having fixed filaments, and a gage disposed on one end portion of the wires and having an outer diameter equal to or smaller than that of the filaments for limiting the wires and the filaments to engage into the selected interdental spaces between the teeth of the user and for preventing the filaments from being inserted and engaged into the interdental spaces having a relatively smaller width and for preventing the user's gum from being injured by the greater filaments, and a rotating device may be coupled to rotate and drive the brush device to clean the interdental space.

Abstract: An interdental toothbrush includes one or more wires having fixed filaments disposed on the wires, and a gage disposed on one end portion of the wires and having an outer diameter equal to or smaller than that of the filaments for limiting and guiding the wires and the filaments to engage into the predetermined or suitable or selected interdental spaces between the teeth of the user and for preventing the filaments from being inserted and engaged into the interdental spaces having a relatively smaller width and thus for preventing the user's gum from being hurt or injured by the greater filaments.

Abstract: A motorized interdental toothbrush includes one or more wires having fixed filaments, and a gage disposed on one end portion of the wires and having an outer diameter equal to or smaller than that of the filaments for limiting the wires and the filaments to engage into the selected interdental spaces between the teeth of the user and for preventing the filaments from being inserted and engaged into the interdental spaces having a relatively smaller width and for preventing the user's gum from being injured by the greater filaments, and a moving device may be coupled to move and drive the brush device to move back and forth or in a reciprocating action and to clean the interdental space.

Abstract: A conductive heat transport cooling system and method are provided for cooling primary and secondary heat generating components of an electronics system. The cooling system includes a liquid-based cooling subsystem including at least one liquid-cooled cold plate physically coupled to at least one primary heat generating component of the electronics system, and a thermally conductive coolant-carrying tube coupled to and in fluid communication with the at least one liquid-cooled cold plate. A thermally conductive auxiliary structure is coupled to the coolant-carrying tube and to at least one secondary heat generating component of the electronics system. When in use, the thermally conductive auxiliary structure provides conductive heat transport from the at least one secondary heat generating component to the at least one thermally conductive coolant-carrying tube coupled thereto, and hence via convection to liquid coolant passing therethrough.

Abstract: A system in which a networked device automatically evaluates hacker attack notification information and, based thereon, selects and executes responses to the attack. The notification may include information such as the address of the infected system, identification of the specific worm, and a list of vulnerable applications and operating systems. The evaluation is based on factors including criticality and vulnerability of applications running on the system and connectivity of the device. A variety of automatic responses can be selected, including notification of network administration, shutdown of the device or services running on the device, updating and activation of anti-virus software, and selective handling of data sent from the address of the suspect network device. The selection of responses can occur automatically based on rules input during setup or by intervention of network administration.