Patents by Inventor C. Lin

C. Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10804205
    Abstract: The interconnect substrate mainly includes a stiffener, a core layer, a warp balancer and a routing circuitry. The stiffener has an elastic modulus higher than 100 GPa and is laterally surrounded by the core layer. The warp balancer is disposed over the top surface of the core layer and laterally surrounds a cavity aligned with the stiffener. The routing circuitry is disposed under the bottom surfaces of the stiffener and the core layer and electrically connected to the stiffener. By the high modulus of the stiffener, local thermo-mechanical stress induced by un-even thickness can be counterbalanced. Furthermore, adjusting the ratio of the stiffener thickness to the cavity dimension can maintain the cavity area stiffness and modulate the global flatness.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: October 13, 2020
    Assignee: BRIDGE SEMICONDUCTOR CORP.
    Inventors: Charles W. C. Lin, Chia-Chung Wang
  • Publication number: 20200303280
    Abstract: An integrally formed metal layer is plated on spacers and a top surface of the heat spreader and a bottom surface of a heat generating component to establish a metallic interfacial structure that connects the heat generating component to the heat spreader. Accordingly, the heat can be conducted from the heat generating component to the heat spreader primarily through the metallic interfacial structure and the spacers.
    Type: Application
    Filed: March 19, 2020
    Publication date: September 24, 2020
    Inventor: Charles W. C. LIN
  • Publication number: 20200277691
    Abstract: New aluminum alloys are disclosed and generally include 0.6-1.4 wt. % Si, 0.25-0.90 wt. % Mg, wherein the ratio of wt. % Si to wt. % Mg is from 1.05:1 to 5.0:1, 0.25-2.0 wt. % Cu, 0.10-3.5 wt. % Zn, 0.01-1.0 wt. % Fe, up to 0.8 wt. % Mn, up to 0.25 wt. % Cr, up to 0.20 wt. % Zr, up to 0.20 wt. % V, and up to 0.15 wt. % Ti, wherein the total of Fe+Mn+Cr+Zr+V+Ti is not greater than 2.0 wt. %, the balance being aluminum and impurities. The new aluminum alloys may include Q phase precipitates. In some embodiments, the solvus temperature of the Q phase precipitates is not greater than 950° F.
    Type: Application
    Filed: April 14, 2020
    Publication date: September 3, 2020
    Inventors: Jen C. Lin, Gabriele F. Ciccola, Santosh Prasad, Wei Wen, Raymond J. Kilmer
  • Publication number: 20200280349
    Abstract: Aspects of the present disclosure generally pertains a system and method for wireless inter-networking between a wireless wide area network (WWAN) and a local area network (WLAN) employing one or more extended range wireless inter-networking devices. Aspects of the present disclosure more specifically are directed toward a high powered wireless interconnect device that includes high efficiency circuitry to make it possible to implement in a portable or in-vehicle form factor, which may provide reasonable battery life, size, weight, and thermal dissipation.
    Type: Application
    Filed: May 18, 2020
    Publication date: September 3, 2020
    Inventors: Thomas R. Bilotta, Edward C. Lin, Steven A. Morley, Robert E. LaRose
  • Patent number: 10762156
    Abstract: A source system receives, from at least one of the user associated with an entity or the human operator associated with the source system, an indication to suppress all listings associated with the entity on one or more provider systems, wherein the indication comprises identification data of the entity and an indication that the identification data of the entity is no longer valid. The source system retrieves, from a database associated with the source system, a list of one or more provider systems associated with the source system and having at least one listing corresponding to the entity. For each provider system in the list of one or more provider systems: the source system searches the provider system for listings having identification data matching the identification data of the entity.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: September 1, 2020
    Assignee: Yext, Inc.
    Inventors: Howard C. Lerman, Thomas C. Dixon, Kevin Caffrey, David C. Lin
  • Publication number: 20200272796
    Abstract: Systems and methods of identifying wearable tags or other items within a facility. The location of the identifiable item can be calculated by the system and used to improve the efficiency of the facility or to dispatch emergency help or maintenance to the location of the badge.
    Type: Application
    Filed: May 13, 2020
    Publication date: August 27, 2020
    Inventors: Shahpour Ashaari, David C. Lin, Seth S. Vasa, Scott R. Bombaugh, Mario Andre Salisbury, Thomas Jay Graham, Erich Joseph Petre
  • Publication number: 20200256077
    Abstract: A production and consumption system of three-dimensional vertical planting landscape and capable of achieving healthy, low-cost and environmental protection includes an aquatic raising zone, a crop planting zone, an animal raising zone, an insect culturing zone, a food processing zone, a consumption zone, a sport health zone, providing a shopping suggestion list automatically for reference based on a consumer's purchase traceability, and offering a sport suggestion list and a food suggestion list that are suitable for the consumer based on a physiological data so as to allow the consumer to do exercise and control diet, thereby attaining effects of low-cost, environmental protection, super-freshness, high efficiency, high quality of production of vegetables, meat and aquatic products, and functions of purchase, health, shopping, tourism, exercise, fitness and health monitoring.
    Type: Application
    Filed: February 13, 2019
    Publication date: August 13, 2020
    Inventor: JAMES C. LIN
  • Patent number: 10740369
    Abstract: A method of generating search suggestions includes receiving an indication of a current location of the user device. After a user accesses a search function on the user device and before the user submits a search request, the method includes determining search results associated with locations in proximity to the current location of the user device, using query log data indicating selections of past search results by users after presentation of the past search results in response to respective past queries. The method also includes determining relative positioning of the search results based on the number of users that selected each search result, determining categories associated with the search results, grouping the search results by the determined categories; and sending the grouped search results and the one or more categories associated with the search results to the user device for display according to the determined relative positioning.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: August 11, 2020
    Assignee: GOOGLE LLC
    Inventors: Amanda M. Moore, Alireza Ali, Michal Grabowski, Jocelyn C. Lin, Evan Parker
  • Patent number: 10693530
    Abstract: Aspects of the present disclosure generally pertains a system and method for wireless inter-networking between a wireless wide area network (WWAN) and a local area network (WLAN) employing one or more extended range wireless inter-networking devices. Aspects of the present disclosure more specifically are directed toward a high powered wireless interconnect device that includes high efficiency circuitry to make it possible to implement in a portable or in-vehicle form factor, which may provide reasonable battery life, size, weight, and thermal dissipation.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: June 23, 2020
    Inventors: Thomas R. Bilotta, Edward C. Lin, Steven A. Morley, Robert E. LaRose
  • Patent number: 10685193
    Abstract: Systems and methods of identifying wearable tags or other items within a facility. The location of the identifiable item can be calculated by the system and used to improve the efficiency of the facility or to dispatch emergency help or maintenance to the location of the badge.
    Type: Grant
    Filed: April 18, 2019
    Date of Patent: June 16, 2020
    Assignee: United States Postal Service
    Inventors: Shahpour Ashaari, David C. Lin, Seth S. Vasa, Scott R. Bombaugh, Mario Andre Salisbury, Thomas Jay Graham, Erich Joseph Petre
  • Publication number: 20200146192
    Abstract: The semiconductor assembly includes a semiconductor chip, a first wiring structure and a second wiring structure. The second wiring structure includes a warp balancer, a core layer, a top build-up layer and a bottom build-up layer. The warp balancer is laterally surrounded by the core layer and preferably has an elastic modulus higher than 100 GPa. The top and the bottom build-up layers are electrically connected to each other through the warp balancer or the core layer therebetween. The first wiring structure is disposed over the top build-up layer through connecting joints superimposed over the warp balancer. By the high modulus of the warp balancer, local thermo-mechanical stress can be counterbalanced to suppress warping and bending of the first and second wiring structures. Furthermore, mounting the first wiring structure over the second wiring structure can provide staged fan-out routing for the chip to improve routing efficiency and production yield.
    Type: Application
    Filed: December 26, 2019
    Publication date: May 7, 2020
    Inventors: Charles W. C. LIN, Chia-Chung WANG
  • Publication number: 20200135630
    Abstract: The interconnect substrate includes etching stoppers within a cavity and a plurality of metal leads disposed around the cavity. The cavity is formed by etching a sacrificial metal slug of a leadframe and laterally surrounded by a resin compound. The etching stoppers are deposited in pits of the metal slug and contact a routing circuitry. By removal of the metal slug, the etching stoppers are exposed from the cavity to provide electrical contacts for device connection within cavity. Due to high etch resistance of the etching stoppers, the integrity of the electrical contacts can be ensured during the cavity formation. As a result, a semiconductor device can be face-down disposed in the cavity and electrically connected to the reliable electrical contacts at the floor of the cavity.
    Type: Application
    Filed: December 30, 2019
    Publication date: April 30, 2020
    Inventors: Charles W. C. LIN, Chia-Chung WANG
  • Publication number: 20200115780
    Abstract: Disclosed are improved thick wrought 7xxx aluminum alloy products, and methods for producing the same. The new 7xxx aluminum alloy products may realize an improved combination of environmentally assisted crack resistance and at least one of strength, elongation, and fracture toughness, among other properties. The new 7xxx aluminum alloy products generally include high amounts of manganese. The new 7xxx aluminum alloy products thus generally include from 0.15 to 0.50 wt. % Mn in combination with 5.5-7.5 wt. % Zn, 0.95-2.20 wt. % Mg, and 1.50-2.40 wt. % Cu.
    Type: Application
    Filed: December 9, 2019
    Publication date: April 16, 2020
    Inventors: Julien Boselli, Gary H. Bray, Cagatay Yanar, Lynette M. Karabin, Severine Cambier, Francine S. Bovard, Jen C. Lin
  • Publication number: 20200093122
    Abstract: Provided herein are devices and related methods for rapidly freezing a sample using, for example, liquid nitrogen. The device includes an input portion with an input port, a sample chamber, a waste reservoir in fluid communication with the sample chamber, and a filtering mechanism that selectively allows a fluid introduced through the input port to pass through the sample chamber and into the waste reservoir, while retaining a sample within the sample chamber. The sample chamber, waste reservoir, and filtering mechanism are configured to draw fluid from the sample chamber through the filtering mechanism and into the waste reservoir via capillary action.
    Type: Application
    Filed: April 20, 2018
    Publication date: March 26, 2020
    Applicant: FUJIFILM Irvine Scientific, Inc.
    Inventors: Sabrina C. LIN, Hsiao-Tzu Ni
  • Publication number: 20200091116
    Abstract: A semiconductor assembly having heat dissipation characteristics includes stacked semiconductor chips thermally conductible to a thermal pad of an interconnect substrate and electrically connected to the interconnect substrate through bonding wire. The bonding wires extending from a primary routing circuitry in between the stacked chips can accommodate the height difference between the stacked chips and the interconnect substrate. These wires can also effectively compensate for the thermal expansion mismatch between the stacked chips and the interconnect substrate, thereby allowing a higher manufacturing yield and better reliability.
    Type: Application
    Filed: November 21, 2019
    Publication date: March 19, 2020
    Inventors: Charles W. C. LIN, Chia-Chung WANG
  • Patent number: 10590515
    Abstract: New 6xxx aluminum alloys are disclosed. The new 6xxx aluminum alloys may include 1.05-1.50 wt. Mg, 0.60-0.95 wt. % Si, where the (wt. % Mg)/(wt. % Si) is from 1.30 to 1.90, 0.275-0.50 wt. % Cu, and from 0.05 to 1.0 wt. % of at least one secondary element, wherein the secondary element is selected from the group consisting of V, Fe, Cr, Mn, Zr, Ti, and combinations thereof.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: March 17, 2020
    Assignee: ARCONIC INC.
    Inventors: Jen C. Lin, Anton J. Rovito, Timothy P. Doyle, Shawn P. Sullivan, Gabriele F. Ciccola, Christopher J. Tan
  • Publication number: 20200082237
    Abstract: A radio frequency identification (RFID) automatic vehicle identification (AVI) system configured to mitigate signal interference, the system comprising a plurality of RFID readers, comprising a first RFID reader and a second RFID reader; and a plurality of antennas, wherein a first antenna is connected to the first RFID reader and a second antenna is connected to the second RFID reader. Prior to the first RFID reader transmitting a signal through the first antenna, the first RFID reader samples a received radio frequency (RF) signal from the first antenna, and if the received RF signal meets predetermined strength and frequency criteria, the first RFID reader inhibits transmission of the signal through the first antenna.
    Type: Application
    Filed: November 14, 2019
    Publication date: March 12, 2020
    Inventors: George D. CRUICKSHANKS, David R. MISSIMER, Christopher J. HOPKINS, Steven C. LIN, Thomas J. FREDERICK
  • Patent number: 10570485
    Abstract: New 2xxx aluminum alloys containing vanadium are disclosed. In one embodiment, the aluminum alloy includes 3.3-4.1 wt. % Cu, 0.7-1.3 wt. % Mg, 0.01-0.16 wt. % V, 0.05-0.6 wt. % Mn, 0.01 to 0.4 wt. % of at least one grain structure control element, the balance being aluminum, incidental elements and impurities. The new alloys may realize an improved combination of properties, such as in the T39 or T89 tempers.
    Type: Grant
    Filed: May 20, 2014
    Date of Patent: February 25, 2020
    Assignee: ARCONIC INC.
    Inventors: Jen C. Lin, Ralph R. Sawtell, Gary H. Bray, Cindie Giummarra, Andre Wilson, Gregory B. Venema
  • Publication number: 20200056268
    Abstract: New aluminum alloys having iron and one or more rare earth elements are disclosed. The new alloys may include from 1 to 15 wt. % Fe and from 1 to 20 wt. % of the rare earth element(s), the balance aluminum and any optional incidental elements and impurities. The new aluminum alloys may be produced via additive manufacturing techniques.
    Type: Application
    Filed: August 22, 2019
    Publication date: February 20, 2020
    Inventors: David W. Heard, Jen C. Lin, Lynette M. Karabin, Cagatay Yanar, Yijia Gu, Albert L. Askin, Zhi Tang, Andreas Kulovits
  • Publication number: 20200057750
    Abstract: A computing system has a central processing unit (CPU), a plurality of n digital data repositories R1-Rn, having a common sector size, a file system, and a digital bus connecting the CPU and the plurality of n digital data repositories R1-Rn. The file system receives an original file to be stored of FS bits in size, creates a new file of NFS bits, comprising all the data structure of the original file, NFS evenly divisible by n and by the common sector size, divides the NFS by n, creating n portions P1-Pn, and stores one portion to each disk in the plural array simultaneously.
    Type: Application
    Filed: August 17, 2018
    Publication date: February 20, 2020
    Inventor: Jimmy C. Lin