Abstract: A pressure sensor device with a MEMS piezoresistive pressure sensing element attached to an in-circuit ceramic board comprises a monolithic ceramic circuit board formed by firing multiple layers of ceramic together. The bottom side of the circuit board has a cavity, which extends through layers of material from the ceramic circuit board is formed. A ceramic diaphragm, which is one of the layers, has a peripheral edge. The diaphragm's thickness enables the diaphragm bounded by the edge to deflect responsive to applied pressure. A MEMS piezoresistive pressure sensing element attached to the top side of the ceramic circuit board generates an output signal responsive to deflection of the ceramic diaphragm. A conduit carrying a pressurized fluid (liquid or gas) can be attached directly to the ceramic circuit board using a seal on the bottom of the ceramic circuit board, which surrounds the opening of the cavity through the bottom.

Abstract: An actuator that includes a bottom plate, a top-plate, and a first and second hub assembly extending between the bottom and top plates. The actuator can further include a first and second bellows disposed on opposing sides of the hub assemblies, the first and second bellows each extending between and coupled to the top plate and bottom plate. The actuator can also include a plurality of washers disposed between the top and bottom plates, with each of the washers coupled to the first and second hub assembly, a first set of the plurality of washers surrounding the first bellows and a second set of the plurality of washers surrounding the second bellows.

Abstract: A face-to-face semiconductor assembly is characterized by a semiconductor device positioned in a dielectric recess of a core base and surrounded by an array of metal posts. The recess in the core provides lateral displacement control between the device and the metal posts, and the minimal height of the metal posts needed for the vertical connection between both opposite sides of the core base can be reduced by the amount equal to the depth of the recess. Further, the semiconductor device is face-to-face electrically coupled to another semiconductor device through a buildup circuitry therebetween.

Abstract: Disclosed are fluidic actuator systems for active flow control applications, methods for making/using such fluidic actuator systems, and vehicles equipped with fluidic actuators to modify airfoil aerodynamics. A Spanwise Traveling Electro-Pneumatic (STEP) actuator architecture for active flow control (AFC) generates variable actuation using high-speed electronic valves to move an array of discrete jets in a spanwise direction. The STEP actuator uses pneumatic power to provide flow control authority and electric power to minimize system power requirements. Disclosed STEP actuator systems help to reduce mass flow requirements for equivalent flow control performance, e.g., when compared to steady blowing systems. This flow control approach may provide necessary flow control authority, for example, for high-lift systems, while keeping pneumatic power requirements (e.g., mass flow and pressure) for the AFC system within an aircraft's capability for system integration.

Abstract: A method of making a wiring board having a low CTE isolator incorporated in a resin core is characterized by the provision of an adhesive substantially coplanar with the metallized isolator and the metal layers on two opposite sides of the resin core at smoothed lapped top and bottom surfaces so that a metal bridge can be deposited on the adhesive at the smoothed lapped bottom surface and connect the metallized isolator with a surrounding heat spreader on the bottom surface of the resin core. In the method, routing circuitries are also deposited on the adhesive at the smoothed lapped top surface so as to provide electrical connections between contact pads on the isolator and terminal pads on the resin core.

Abstract: The wiring board includes a first routing circuitry and a second routing circuitry integrated with a leadframe. The first routing circuitry is laterally surrounded by the leadframe and can provide a first level routing for a semiconductor device disposed thereon. The second routing circuitry is disposed beyond the space laterally surrounded by the leadframe and extends over the leadframe and is electrically connected to the first routing circuitry and metal leads of the leadframe to provide a second level routing.

Abstract: A system quantifying clinical skill of a user, comprising: collecting data relating to a surgical task done by a user using a surgical device; comparing the data for the surgical task to other data for another similar surgical task; quantifying the clinical skill of the user based on the comparing of the data for the surgical task to the other data for the other similar surgical task; outputting the clinical skill of the user.

Abstract: Disclosed are methods of diagnosing constipation and constipation-predominant irritable bowel syndrome by screening for the presence of abnormally high levels of methane and/or methanogenic organisms in a subject.

Abstract: Apparatuses for improving resistive memory energy efficiency are provided. An apparatus performs data-driven write to make use of asymmetric write switch energy between write0 and write1 operations. The apparatus comprises: a resistive memory cell coupled to a bit line and a select line; a first pass-gate coupled to the bit line; a second pass-gate coupled to the select line; and a multiplexer operable by input data, the multiplexer to provide a control signal to the first and second pass-gates or to write drivers according to logic level of the input data. An apparatus comprises circuit for performing read before write operation which avoids unnecessary writes with an initial low power read operation. An apparatus comprises circuit to perform self-controlled write operation which stops the write operation as soon as bit-cell flips. An apparatus comprises circuit for performing self-controlled read operation which stops read operation as soon as data is detected.

Abstract: A semiconductor assembly with built-in stiffener and integrated dual routing circuitries is characterized in that a semiconductor device and a first routing circuitry are positioned within a through opening of a stiffener whereas a second routing circuitry extends to an area outside of the through opening of the stiffener. The mechanical robustness of the stiffener can prevent the assembly from warping. The first routing circuitry can enlarge the pad size and pitch of the semiconductor device, whereas the second routing circuitry not only provides further fan-out wiring structure, but also mechanically binds the first routing circuitry with the stiffener.

Abstract: A wiring board includes an electronic component laterally surrounded by a leadframe, and first and second buildup circuitries disposed beyond the space laterally surrounded by the leadframe and extending over the leadframe. The electronic component includes a first routing circuitry, an encapsulant, optionally an array of vertical connecting elements and optionally a second routing circuitry integrated together. The first routing circuitry provides primary routing for the semiconductor device, whereas the first and second buildup circuitries not only provides further routing, but also mechanically binds the electronic component with the leadframe. The leadframe provides electrical connection between the first buildup circuitry and the second buildup circuitry.

Abstract: A wiring board includes an electronic component laterally surrounded by a stiffener, and a third routing circuitry disposed beyond the space laterally surrounded by the stiffener and extends over the stiffener. The electronic component includes a first routing circuitry, an encapsulant, an array of vertical connecting elements and a second routing circuitry integrated together. The mechanical robustness of the stiffener can prevent the wiring board from warping. The embedded semiconductor device is electrically coupled to the first routing circuitry and surrounded by the vertical connecting elements in electrical connection with the first and second routing circuitries. The first routing circuitry provides primary fan-out routing for another semiconductor device to be assembled on the wiring board, whereas the third routing circuitry not only provides further fan-out wiring structure, but also mechanically binds the electronic component with the stiffener.

Abstract: A semiconductor assembly having heat dissipation characteristics includes stacked semiconductor chips thermally conductible to a thermal pad of an interconnect substrate and electrically connected to the interconnect substrate through bonding wire. The bonding wires extending from a primary routing circuitry in between the stacked chips can accommodate the height difference between the stacked chips and the interconnect substrate. These wires can also effectively compensate for the thermal expansion mismatch between the stacked chips and the interconnect substrate, thereby allowing a higher manufacturing yield and better reliability.

Abstract: A system quantifying clinical skill of a user, comprising: collecting data relating to a surgical task done by a user using a surgical device; comparing the data for the surgical task to other data for another similar surgical task; quantifying the clinical skill of the user based on the comparing of the data for the surgical task to the other data for the other similar surgical task; outputting the clinical skill of the user.

Abstract: New 3xx aluminum casting alloys are disclosed. The aluminum casting alloys generally include from 6.5 to 11.0 wt. % Si, from 0.20 to 0.80 wt. % Mg, from 0.05 to 0.50 wt. % Cu, from 0.10 to 0.80 wt. % Mn, from 0.005 to 0.05 wt. % Sr, up to 0.25 wt. % Ti, up to 0.30 wt. % Fe, and up to 0.20 wt. % Zn, the balance being aluminum and impurities.

Abstract: A wiring board includes an interposer and an electronic component laterally surrounded by a base board and a dielectric layer and connected to a routing circuitry. The interposer and the electronic component are inserted into a first through opening and a second through opening of the base board, respectively. The dielectric layer covers the top side of the base board and the top surface of the electronic component, and fills in gaps between the interposer and the base board and between the electronic component and the base board. The routing circuitry is deposited on the dielectric layer and electrically connected to the electronic component and a top wiring layer of the base board.

Abstract: The wiring substrate includes a cavity and a plurality of metal leads disposed around the cavity. The metal leads are bonded with a resin compound and provide horizontal and vertical routing for a semiconductor device to be disposed in the cavity. The resin compound fills in spaces between the metal leads and surrounds the cavity and provides a dielectric platform for a re-distribution layer or a build-up circuitry optionally deposited thereon.

Abstract: A surgical method is provided for use with a teleoperated surgical system (surgical system), the method comprising: recording surgical instrument kinematic information indicative of surgical instrument motion produced within the surgical system during the occurrence of the surgical procedure; determining respective kinematic signatures associated with respective surgical instrument motions; producing an information structure in a computer readable storage device that associates respective kinematic signatures with respective control signals; comparing, during a performance of the surgical procedure surgical instrument kinematic information during the performance with at least one respective kinematic signature; launching, during a performance of the surgical procedure an associated respective control signal in response to a match between surgical instrument kinematics during the performance and a respective kinematic signature.

Abstract: A method of making a stackable wiring board is characterized by positioning an electronic component in a dielectric recess to realize the thickness reduction of the wiring board and sidewalls of the recess can confine the dislocation of the electronic component to avoid misalignment between buildup circuitry and the electronic component. A plurality of plated through holes are formed to provide vertical electrical connections between dual buildup circuitries, thereby providing the wiring board with stacking capability.

Abstract: The leadframe substrate includes a routing circuitry disposed on a compound layer and electrically connects an electronic component encapsulated in the compound layer to metal leads. The compound layer fills in spaces between the metal leads and provides a dielectric platform for the routing circuitry deposited thereon. The routing circuitry laterally extends on the compound layer and is electrically coupled to the electronic component and the metal leads.