Patents by Inventor Calvin Yi-Ping Chao
Calvin Yi-Ping Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9426393Abstract: A method for noise simulation of a CMOS image sensor comprises performing a frequency domain noise simulation for a readout circuit of the CMOS image sensor using a computer, wherein the readout circuit includes a correlated double sampling (CDS) circuit, wherein the frequency domain noise simulation includes a CDS transfer function to refer a noise introduced by the CDS circuit back to an input node of the readout circuit. The method further comprises calculating noise at the input node of the readout circuit based on the referred back noises caused by one or more components in the readout circuit and estimating noise of the CMOS imaging sensor by comparing the calculated noise at the input node of the readout circuit to an original input signal to the readout circuit of the CMOS imaging sensor.Type: GrantFiled: February 11, 2014Date of Patent: August 23, 2016Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shang-Fu Yeh, Kuo-Yu Chou, Yi-Che Chen, Wei Lun Tao, Honyih Tu, Calvin Yi-Ping Chao, Fu-Lung Hsueh
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Patent number: 9412725Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC.Type: GrantFiled: April 27, 2012Date of Patent: August 9, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung, Lan-Lin Chao
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Patent number: 9379093Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC.Type: GrantFiled: April 27, 2012Date of Patent: June 28, 2016Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung, Lan-Lin Chao
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Patent number: 9369652Abstract: A readout device comprises a readout circuit having a first switch configured to receive a pixel reset signal, a second switch configured to receive a pixel output signal, and a third switch configured to connect the first switch to the second switch. A first capacitor is connected to the first switch, a second capacitor is connected the second switch, a fourth switch is connected to the first capacitor, and a fifth switch is connected to the second capacitor. The fifth switch is connected to the fourth switch. The readout circuit also comprises a sixth switch connected to the first capacitor and a seventh switch connected to the second capacitor. The sixth switch is configured to provide a first output of the readout circuit, and the seventh is configured to provide a second output of the readout circuit.Type: GrantFiled: April 7, 2015Date of Patent: June 14, 2016Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Po-Sheng Chou, Calvin Yi-Ping Chao, Kuo-Yu Chou, Honyih Tu, Yi-Che Chen
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Publication number: 20160150167Abstract: Among other things, techniques and systems are provided for identifying when a pixel of an image sensor is in an idle period. A flag is utilized to differentiate when the pixel is in an idle period and when the pixel is in an integration period. When the flag indicates that the pixel is in an idle period, a blooming operation is performed on the pixel to reduce an amount of electrical charge that has accumulated at the pixel or to mitigate electrical charge from accumulating at the pixel. In this way, the blooming operation reduces a probability that the photosensitive sensor becomes saturated during an idle period of the pixel, and thus reduces the likelihood of electrical charge from a pixel that is not intended contribute to an image from spilling over and potentially contaminating a pixel that is intended to contribute to the image.Type: ApplicationFiled: February 1, 2016Publication date: May 26, 2016Inventors: Kuo-Yu Chou, Calvin Yi-Ping Chao, Fu-Lung Hsueh, Honyih Tu, Jhy-Jyi Sze
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Publication number: 20160133659Abstract: A depth sensing pixel includes a photodiode; a first photo storage device; and a first transistor configured to selectively couple the photodiode to the first photo storage device. The depth sensing pixel further includes a second photo storage diode different from the first photo storage device; and a second transistor configured to selectively couple the photodiode to the second photo storage device. The depth sensing pixel further includes a first transfer gate configured to selectively couple the first photo storage diode to a first output node. The depth sensing pixel further includes a second transfer gate configured to selectively couple the second photo storage diode to a second output node.Type: ApplicationFiled: November 6, 2014Publication date: May 12, 2016Inventors: Calvin Yi-Ping CHAO, Kuo-Yu CHOU, Chih-Min LIU
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Patent number: 9325923Abstract: A sensor system includes a pixel array, column units and a compensation circuit. The pixel array is configured to provide pixel column data. The column units are configured to generate an offset data out signal from the pixel column data. The offset data out signal includes digital offsets. The compensation circuit is configured to remove the digital offsets from the offset data out signal. The compensation circuit is also configured to generate a data out signal.Type: GrantFiled: May 14, 2013Date of Patent: April 26, 2016Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kuo-Yu Chou, Erik Tao, Shang-Fu Yeh, Calvin Yi-Ping Chao
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Publication number: 20160086996Abstract: A Dual-Side Illumination (DSI) image sensor chip includes a first image sensor chip configured to sense light from a first direction, and a second image sensor chip aligned to, and bonded to, the first image sensor chip. The second image sensor chip is configured to sense light from a second direction opposite the first direction.Type: ApplicationFiled: November 30, 2015Publication date: March 24, 2016Inventors: Chih-Min Liu, Honyih Tu, Calvin Yi-Ping Chao, Fu-Lung Hsueh
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Patent number: 9270908Abstract: Among other things, techniques and systems are provided for identifying when a pixel of an image sensor is in an idle period. A flag is utilized to differentiate when the pixel is in an idle period and when the pixel is in an integration period. When the flag indicates that the pixel is in an idle period, a blooming operation is performed on the pixel to reduce an amount of electrical charge that has accumulated at the pixel or to mitigate electrical charge from accumulating at the pixel. In this way, the blooming operation reduces a probability that the photosensitive sensor becomes saturated during an idle period of the pixel, and thus reduces the likelihood of electrical charge from a pixel that is not intended contribute to an image from spilling over and potentially contaminating a pixel that is intended to contribute to the image.Type: GrantFiled: February 5, 2013Date of Patent: February 23, 2016Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Kuo-Yu Chou, Calvin Yi-Ping Chao, Jhy-Jyi Sze, Honyih Tu, Fu-Lung Hsueh
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Patent number: 9202963Abstract: A Dual-Side Illumination (DSI) image sensor chip includes a first image sensor chip configured to sense light from a first direction, and a second image sensor chip aligned to, and bonded to, the first image sensor chip. The second image sensor chip is configured to sense light from a second direction opposite the first direction.Type: GrantFiled: November 21, 2012Date of Patent: December 1, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Min Liu, Honyih Tu, Calvin Yi-Ping Chao, Fu-Lung Hsueh
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Patent number: 9165968Abstract: A stacked image sensor and method for making the same are provided. The stacked image sensor includes an upper chip with a pixel array thereon. The second chip includes a plurality of column circuits and row circuits associated with the columns and rows of the pixel array and disposed in respective column circuit and row circuit regions that are arranged in multiple groups. Inter-chip bonding pads are formed on each of the chips. The inter-chip bonding pads on the second chip are arranged linearly and are contained within the column circuit regions and row circuit regions in one embodiment. In other embodiments, the inter-chip bonding pads are staggered with respect to each other. In some embodiments, the rows and columns of the pixel array include multiple signal lines and the corresponding column circuit regions and row circuit regions also include multiple inter-chip bonding pads.Type: GrantFiled: September 14, 2012Date of Patent: October 20, 2015Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Calvin Yi-Ping Chao, Kuo-Yu Chou, Fu-Lung Hsueh
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Publication number: 20150215556Abstract: A readout device comprises a readout circuit having a first switch configured to receive a pixel reset signal, a second switch configured to receive a pixel output signal, and a third switch configured to connect the first switch to the second switch. A first capacitor is connected to the first switch, a second capacitor is connected the second switch, a fourth switch is connected to the first capacitor, and a fifth switch is connected to the second capacitor. The fifth switch is connected to the fourth switch. The readout circuit also comprises a sixth switch connected to the first capacitor and a seventh switch connected to the second capacitor. The sixth switch is configured to provide a first output of the readout circuit, and the seventh is configured to provide a second output of the readout circuit.Type: ApplicationFiled: April 7, 2015Publication date: July 30, 2015Inventors: Po-Sheng CHOU, Calvin Yi-Ping CHAO, Kuo-Yu CHOU, Honyih TU, Yi-Che CHEN
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Patent number: 9059063Abstract: A CMOS image sensor includes a pixel array including a plurality of unit pixels with individual rows of unit pixels being coupled to respective row control signal lines, and a buffer including plural row control signal drivers. Each driver is coupled to a respective one of the row control signal lines and is configured to provide a row control signal pulse to a respective row control signal line in response to an input pulse when the row control signal line is in an active state and to bias the row control signal line at a ground voltage when the respective row control signal line is in an inactive state. Each driver has a first drive capability when the row control signal line is in the active state and a second drive capability greater than the first drive capability when the row control signal line is in an inactive state.Type: GrantFiled: October 21, 2013Date of Patent: June 16, 2015Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kuo-Yu Chou, Calvin Yi-Ping Chao
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Publication number: 20150116506Abstract: A method for noise simulation of a CMOS image sensor comprises performing a frequency domain noise simulation for a readout circuit of the CMOS image sensor using a computer, wherein the readout circuit includes a correlated double sampling (CDS) circuit, wherein the frequency domain noise simulation includes a CDS transfer function to refer a noise introduced by the CDS circuit back to an input node of the readout circuit. The method further comprises calculating noise at the input node of the readout circuit based on the referred back noises caused by one or more components in the readout circuit and estimating noise of the CMOS imaging sensor by comparing the calculated noise at the input node of the readout circuit to an original input signal to the readout circuit of the CMOS imaging sensor.Type: ApplicationFiled: February 11, 2014Publication date: April 30, 2015Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shang-Fu YEH, Kuo-Yu CHOU, Yi-Che CHEN, Wei Lun TAO, Honyih TU, Calvin Yi-Ping CHAO, Fu-Lung HSUEH
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Patent number: 9013610Abstract: An apparatus comprises a readout circuit configured to be disconnected from a pixel output, and to connect a pixel reset signal received by the readout circuit to a pixel output signal received by the readout circuit. The apparatus also comprises at least one programmable gain amplifier coupled with the readout circuit. The apparatus further comprises an analog-to-digital converter coupled with the programmable gain amplifier. The readout circuit is configured to be calibrated based on a comparison of a measured output of the readout circuit to a predetermined value, the predetermined value being equal to (2n/2)?1, where n is the number of bits of the analog-to-digital converter.Type: GrantFiled: August 12, 2014Date of Patent: April 21, 2015Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Po-Sheng Chou, Calvin Yi-Ping Chao, Kuo-Yu Chou, Honyih Tu, Yi-Che Chen
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Publication number: 20140347535Abstract: An apparatus comprises a readout circuit configured to be disconnected from a pixel output, and to connect a pixel reset signal received by the readout circuit to a pixel output signal received by the readout circuit. The apparatus also comprises at least one programmable gain amplifier coupled with the readout circuit. The apparatus further comprises an analog-to-digital converter coupled with the programmable gain amplifier. The readout circuit is configured to be calibrated based on a comparison of a measured output of the readout circuit to a predetermined value, the predetermined value being equal to (2n/2)?1, where n is the number of bits of the analog-to-digital converter.Type: ApplicationFiled: August 12, 2014Publication date: November 27, 2014Inventors: Po-Sheng CHOU, Calvin Yi-Ping CHAO, Kuo-Yu CHOU, Honyih TU, Yi-Che CHEN
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Patent number: 8890742Abstract: A system and method is disclosed for an imaging device and/or an analog to digital converter which converts an analog input signal to a digital data signal using a comparator which compares the analog input signal to a first ramped reference signal to determine an operating point and then uses the same comparator to compare the analog input signal to a second ramped reference signal multiple times about the determined operating point.Type: GrantFiled: March 11, 2013Date of Patent: November 18, 2014Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kuo-Yu Chou, Shang-Fu Yeh, Erik Tao, Calvin Yi-Ping Chao
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Patent number: 8872686Abstract: The present disclosure relates to a method and architecture to minimize a transient glitch within a current digital-to-analog converter (DAC) comprising an array of identical current unit cells. The current DAC is configured with individual column decoders for even and odd rows of current unit cells, thus allowing for independent control of adjacent rows. The even row and odd row column decoders further comprise thermal decoders with coupled timing encoding which establishes synergy between an adjacent pair of rows. As current units cells within an active row are activated across the row by a counting up of a first column decoder, the current units cells within a next row adjacent the active row are returned to an initial state of the active row by counting down in a second column decoder. Other devices and methods are also disclosed.Type: GrantFiled: April 8, 2013Date of Patent: October 28, 2014Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kuo-Yu Chou, Wei Lun Tao, Shang-Fu Yeh, Yi-Che Chen, Calvin Yi-Ping Chao
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Publication number: 20140266991Abstract: A sensor system includes a pixel array, column units and a compensation circuit. The pixel array is configured to provide pixel column data. The column units are configured to generate an offset data out signal from the pixel column data. The offset data out signal includes digital offsets. The compensation circuit is configured to remove the digital offsets from the offset data out signal. The compensation circuit is also configured to generate a data out signal.Type: ApplicationFiled: May 14, 2013Publication date: September 18, 2014Inventors: Kuo-Yu Chou, Erik Tao, Shang-Fu Yeh, Calvin Yi-Ping Chao
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Publication number: 20140266831Abstract: The present disclosure relates to a method and architecture to minimize a transient glitch within a current digital-to-analog converter (DAC) comprising an array of identical current unit cells. The current DAC is configured with individual column decoders for even and odd rows of current unit cells, thus allowing for independent control of adjacent rows. The even row and odd row column decoders further comprise thermal decoders with coupled timing encoding which establishes synergy between an adjacent pair of rows. As current units cells within an active row are activated across the row by a counting up of a first column decoder, the current units cells within a next row adjacent the active row are returned to an initial state of the active row by counting down in a second column decoder. Other devices and methods are also disclosed.Type: ApplicationFiled: April 8, 2013Publication date: September 18, 2014Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.Inventors: Kuo-Yu Chou, Wei Lun Tao, Shang-Fu Yeh, Yi-Che Chen, Calvin Yi-Ping Chao