Patents by Inventor Calvin Yi-Ping Chao
Calvin Yi-Ping Chao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140252202Abstract: A system and method is disclosed for an imaging device and/or an analog to digital converter which converts an analog input signal to a digital data signal using a comparator which compares the analog input signal to a first ramped reference signal to determine an operating point and then uses the same comparator to compare the analog input signal to a second ramped reference signal multiple times about the determined operating point.Type: ApplicationFiled: March 11, 2013Publication date: September 11, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Kuo-Yu Chou, Shang-Fu Yeh, Erik Tao, Calvin Yi-Ping Chao
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Patent number: 8830361Abstract: A method of reducing column fixed pattern noise including calibrating a readout circuit, wherein the readout circuit is electrically connected to at least one programmable gain amplifier and an analog-to-digital converter. Calibrating the readout circuit includes electrically disconnecting the readout circuit from a pixel output and electrically connecting a pixel reset input of the readout circuit to a pixel output signal input of the readout circuit. Calibrating the readout circuit further includes comparing a measured output of the readout circuit to a predetermined value and storing the comparison result in a non-transitory computer readable medium. The method further includes operating the readout circuit, the operating the readout circuit includes receiving a pixel sample signal and outputting a calibrated output based on an operating output and the stored comparison result.Type: GrantFiled: April 12, 2012Date of Patent: September 9, 2014Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Po-Sheng Chou, Calvin Yi-Ping Chao, Kuo-Yu Chou, Honyih Tu, Yi-Che Chen
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Publication number: 20140217263Abstract: Among other things, techniques and systems are provided for identifying when a pixel of an image sensor is in an idle period. A flag is utilized to differentiate when the pixel is in an idle period and when the pixel is in an integration period. When the flag indicates that the pixel is in an idle period, a blooming operation is performed on the pixel to reduce an amount of electrical charge that has accumulated at the pixel or to mitigate electrical charge from accumulating at the pixel. In this way, the blooming operation reduces a probability that the photosensitive sensor becomes saturated during an idle period of the pixel, and thus reduces the likelihood of electrical charge from a pixel that is not intended contribute to an image from spilling over and potentially contaminating a pixel that is intended to contribute to the image.Type: ApplicationFiled: February 5, 2013Publication date: August 7, 2014Applicant: Taiwan Semiconductor Manufacturing Company LimitedInventors: Kuo-Yu Chou, Calvin Yi-Ping Chao, Jhy-Jyi Sze, Honyih Tu, Fu-Lung Hsueh
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Publication number: 20140138520Abstract: A Dual-Side Illumination (DSI) image sensor chip includes a first image sensor chip configured to sense light from a first direction, and a second image sensor chip aligned to, and bonded to, the first image sensor chip. The second image sensor chip is configured to sense light from a second direction opposite the first direction.Type: ApplicationFiled: November 21, 2012Publication date: May 22, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chih-Min Liu, Honyih Tu, Calvin Yi-Ping Chao, Fu-Lung Hsueh
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Publication number: 20140138521Abstract: A Dual-Side Illumination (DSI) image sensor chip includes a first image sensor chip configured to sense light from a first direction, and a second image sensor chip aligned to, and bonded to, the first image sensor chip. The second image sensor chip is configured to sense light from a second direction opposite the first direction.Type: ApplicationFiled: November 21, 2012Publication date: May 22, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chih-Min Liu, Honyih Tu, Calvin Yi-Ping Chao, Fu-Lung Hsueh
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Publication number: 20140077057Abstract: A stacked image sensor and method for making the same are provided. The stacked image sensor includes an upper chip with a pixel array thereon. The second chip includes a plurality of column circuits and row circuits associated with the columns and rows of the pixel array and disposed in respective column circuit and row circuit regions that are arranged in multiple groups. Inter-chip bonding pads are formed on each of the chips. The inter-chip bonding pads on the second chip are arranged linearly and are contained within the column circuit regions and row circuit regions in one embodiment. In other embodiments, the inter-chip bonding pads are staggered with respect to each other. In some embodiments, the rows and columns of the pixel array include multiple signal lines and the corresponding column circuit regions and row circuit regions also include multiple inter-chip bonding pads.Type: ApplicationFiled: September 14, 2012Publication date: March 20, 2014Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Calvin Yi-Ping CHAO, Kuo-Yu CHOU, Fu-Lung HSUEH
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Publication number: 20140042303Abstract: A CMOS image sensor includes a pixel array including a plurality of unit pixels with individual rows of unit pixels being coupled to respective row control signal lines, and a buffer including plural row control signal drivers. Each driver is coupled to a respective one of the row control signal lines and is configured to provide a row control signal pulse to a respective row control signal line in response to an input pulse when the row control signal line is in an active state and to bias the row control signal line at a ground voltage when the respective row control signal line is in an inactive state. Each driver has a first drive capability when the row control signal line is in the active state and a second drive capability greater than the first drive capability when the row control signal line is in an inactive state.Type: ApplicationFiled: October 21, 2013Publication date: February 13, 2014Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kuo-Yu CHOU, Calvin Yi-Ping CHAO
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Patent number: 8599292Abstract: A CMOS image sensor includes a pixel array including a plurality of unit pixels with individual rows of unit pixels being coupled to respective row control signal lines, and a buffer including plural row control signal drivers. Each driver is coupled to a respective one of the row control signal lines and is configured to provide a row control signal pulse to a respective row control signal line in response to an input pulse when the row control signal line is in an active state and to bias the row control signal line at a ground voltage when the respective row control signal line is in an inactive state. Each driver has a first drive capability when the row control signal line is in the active state and a second drive capability greater than the first drive capability when the row control signal line is in an inactive state.Type: GrantFiled: August 18, 2010Date of Patent: December 3, 2013Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Kuo-Yu Chou, Calvin Yi-Ping Chao
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Patent number: 8587081Abstract: Provided is an image sensor device. The image sensor device includes a substrate having a front side and a back side. The image sensor also includes an isolation feature disposed in the substrate. The image sensor further includes a radiation-sensing region disposed in the substrate and adjacent to the isolation feature. The radiation-sensing region is operable to sense radiation projected toward the radiation-sensing region from the back side. The image sensor also includes a transparent conductive layer disposed over the back side of the substrate.Type: GrantFiled: April 28, 2010Date of Patent: November 19, 2013Inventor: Calvin Yi-Ping Chao
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Publication number: 20130284885Abstract: Methods and apparatus for packaging a backside illuminated (BSI) image sensor or a sensor device with an application specific integrated circuit (ASIC) are disclosed. According to an embodiment, a sensor device may be bonded together face-to-face with an ASIC without using a carrier wafer, where corresponding bond pads of the sensor are aligned with bond pads of the ASIC and bonded together, in a one-to-one fashion. A column of pixels of the sensor may share a bond bad connected by a shared inter-metal line. The bond pads may be of different sizes and configured in different rows to be disjoint from each other. Additional dummy pads may be added to increase the bonding between the sensor and the ASIC.Type: ApplicationFiled: April 27, 2012Publication date: October 31, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Szu-Ying Chen, Ping-Yin Liu, Calvin Yi-Ping Chao, Tzu-Jui Wang, Jen-Cheng Liu, Dun-Nian Yaung, Lan-Lin Chao
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Publication number: 20130271626Abstract: A method of reducing column fixed pattern noise including calibrating a readout circuit, wherein the readout circuit is electrically connected to at least one programmable gain amplifier and an analog-to-digital converter. Calibrating the readout circuit includes electrically disconnecting the readout circuit from a pixel output and electrically connecting a pixel reset input of the readout circuit to a pixel output signal input of the readout circuit. Calibrating the readout circuit further includes comparing a measured output of the readout circuit to a predetermined value and storing the comparison result in a non-transitory computer readable medium. The method further includes operating the readout circuit, the operating the readout circuit includes receiving a pixel sample signal and outputting a calibrated output based on an operating output and the stored comparison result.Type: ApplicationFiled: April 12, 2012Publication date: October 17, 2013Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Po-Sheng CHOU, Calvin Yi-Ping CHAO, Kuo-Yu CHOU, Honyih TU, Yi-Che CHEN
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Patent number: 8350934Abstract: An integrated circuit comprises a semiconductor substrate and a color image sensor array on the substrate. The color image sensor array has a first configuration of color pixels for collecting color image data, and at least one crosstalk test pattern on the substrate proximate the color image sensor array. The crosstalk test pattern includes a plurality of color sensing pixels arranged for making color crosstalk measurements. The test pattern configuration is different from the first configuration.Type: GrantFiled: October 21, 2010Date of Patent: January 8, 2013Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Calvin Yi-Ping Chao, Honyih Tu, Kuo-Yu Chou, Po-Sheng Chou
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Publication number: 20120098975Abstract: An integrated circuit comprises a semiconductor substrate and a color image sensor array on the substrate. The color image sensor array has a first configuration of color pixels for collecting color image data, and at least one crosstalk test pattern on the substrate proximate the color image sensor array. The crosstalk test pattern includes a plurality of color sensing pixels arranged for making color crosstalk measurements. The test pattern configuration is different from the first configuration.Type: ApplicationFiled: October 21, 2010Publication date: April 26, 2012Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Calvin Yi-Ping Chao, Honyih Tu, Kuo-Yu Chou, Po-Sheng Chou
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Publication number: 20120044398Abstract: A CMOS image sensor includes a pixel array including a plurality of unit pixels with individual rows of unit pixels being coupled to respective row control signal lines, and a buffer including plural row control signal drivers. Each driver is coupled to a respective one of the row control signal lines and is configured to provide a row control signal pulse to a respective row control signal line in response to an input pulse when the row control signal line is in an active state and to bias the row control signal line at a ground voltage when the respective row control signal line is in an inactive state. Each driver has a first drive capability when the row control signal line is in the active state and a second drive capability greater than the first drive capability when the row control signal line is in an inactive state.Type: ApplicationFiled: August 18, 2010Publication date: February 23, 2012Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Kuo-Yu CHOU, Calvin Yi-Ping CHAO
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Publication number: 20110266645Abstract: Provided is an image sensor device. The image sensor device includes a substrate having a front side and a back side. The image sensor also includes an isolation feature disposed in the substrate. The image sensor further includes a radiation-sensing region disposed in the substrate and adjacent to the isolation feature. The radiation-sensing region is operable to sense radiation projected toward the radiation-sensing region from the back side. The image sensor also includes a transparent conductive layer disposed over the back side of the substrate.Type: ApplicationFiled: April 28, 2010Publication date: November 3, 2011Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventor: Calvin Yi-Ping Chao
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Publication number: 20090039397Abstract: An avalanche photodiode is deposited and integrated directly on top of CMOS readout circuitry. The anode of the avalanche photodiode may be independently biased at high voltage so that the avalanche photodiode may be operated in an avalanche multiplication mode. The avalanche photodiode has a multi-layered structure which is not pixilated; and photo-carrier generation and carrier multiplication may take place in the same layer or in different layers. A constant-gate-bias transistor isolates the high-voltage avalanche photodiode from the low-voltage the CMOS readout circuitry.Type: ApplicationFiled: August 9, 2007Publication date: February 12, 2009Applicant: MICROMEDIA TECHNOLOGY CORP.Inventor: Calvin Yi-Ping Chao