Patents by Inventor Carlos Gonzalez

Carlos Gonzalez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6648991
    Abstract: Low-alloy carbon steel for the manufacture of seamless pipes having improved resistance to corrosion, particularly the “sweet corrosion” that occurs in the media rich in CO2, for using in exploration and production of oil and/or natural gas. The steel contains: 1.5-4.0% by weight of Cr, 0.06-0.10% by weight of C, 0.3-0.8% by weight of Mn, not more than 0.005% by weight of S, not more than 0.015% by weight of P, 0.20-0.35% by weight of Si, 0.25-0.35% by weight of Mo, 0.06-0.9% by weight of V, approximately 0.22% by weight of Cu, approximately 0.001% by weight of Nb, approximately 0.028% by weight of Ti, not more than a total value of O of 25 ppm, with the balance being Fe and unavoidable impurities.
    Type: Grant
    Filed: March 13, 2002
    Date of Patent: November 18, 2003
    Assignee: Siderca S.A.I.C.
    Inventors: Gustavo Javier López Turconi, Teresa Estela Pérez, Juan Carlos González
  • Patent number: 6644536
    Abstract: The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: November 11, 2003
    Assignee: Intel Corporation
    Inventors: Glenn Ratificar, Carlos Gonzalez, Lejun Wang
  • Publication number: 20030192059
    Abstract: For interactive television subscribers, a system (10) and method for persistent storage of common information relating to a user (25) required by multiple disparate iTV applications to be shared among said applications to ease the burden of data entry off the user. Subscribers do not have to repeatedly enter the same common user information required by multiple applications. The registration information inputted by a user (25) is logged, temporarily stored in the STB (35), and its contents transmitted to a remote central repository (100) at predetermined intervals.
    Type: Application
    Filed: December 5, 2002
    Publication date: October 9, 2003
    Applicant: Hughes Electronics Corporation
    Inventors: Steven M. Soloff, Carlos Gonzalez, Edward P. Jurado
  • Publication number: 20030175835
    Abstract: The invention belongs to the field of animal health and in particular the causative agent of a new bacterial poultry disease, Pasteurella trehalosi and/or Mannheimia haemolytica. The invention provides said Pasteurella trehalosi and/or Mannheimia haemolytica bacteria, vaccine comprising inactivated Pasteurella trehalosi and/or Mannheimia haemolytica, and a method of immunizing to prevent disease in poultry.
    Type: Application
    Filed: October 24, 2002
    Publication date: September 18, 2003
    Applicant: Boehringer Ingelheim Vetmedica S.A. de C.V.
    Inventors: Raul Campogarrido, Carlos Gonzalez-Hernandez, Vaithianathan Sivanandan, Maria Elena Vazquez
  • Patent number: 6600652
    Abstract: A retention module includes a socket to connect to a package. At least one retention arm is coupled to the socket. At least one clamping bar is coupled to the at least one retention arm to secure placement of a heat sink against a surface of a package assembly.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: July 29, 2003
    Assignee: Intel Corporation
    Inventors: Biju Chandran, Carlos A. Gonzalez
  • Publication number: 20030121958
    Abstract: The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.
    Type: Application
    Filed: December 28, 2001
    Publication date: July 3, 2003
    Inventors: Glenn Ratificar, Carlos Gonzalez, Lejun Wang
  • Publication number: 20030116860
    Abstract: A low resistance package-to-die interconnect scheme for reduced die stresses includes a relatively low melting temperature and yield strength solder on the die and a relatively higher melting temperature and electrically conductive material such as copper on the substrate. A soldered joint connects the solder to the electrically conductive material to couple/connect the die and substrate to one another. The soldered joint is formed by heating the die and solder thereon to at least the melting temperature of the solder and thereafter contacting the molten solder with the conductive material on the substrate, which is at a substantially lower temperature for minimizing residual stress from soldering due to coefficient of thermal expansion mismatch between the substrate and die.
    Type: Application
    Filed: December 21, 2001
    Publication date: June 26, 2003
    Inventors: Biju Chandran, Carlos A. Gonzalez
  • Publication number: 20030112692
    Abstract: A memory system (e.g., memory card) offering hybrid density storage is disclosed. The memory system yields both high density storage and high performance operation. According to one aspect, certain data to be stored in the memory system can be stored in lower density storage so that it provides robust storage and/or high speed retrieval. Other data, which can be retrieved at moderate speeds or moderate robustness, can be stored to higher density storage in a space (area) efficient manner.
    Type: Application
    Filed: December 14, 2001
    Publication date: June 19, 2003
    Applicant: SanDisk Corporation
    Inventors: Carlos Gonzalez, Shahzad B. Khalid
  • Publication number: 20030080437
    Abstract: High yield, high reliability, flip-chip integrated circuit (IC) packages are achieved utilizing a combination of heat and pressure to bond flip-chip die and to cure no-flow underfill material. The underfill comprises a filler or low coefficient of thermal expansion (CTE) material to decrease CTE of the cured underfill. The filler material can be selected from the group comprising silica, silicon oxide, silicon dioxide, silicon nitride, aluminum oxide, aluminum nitride, or a mixture thereof. The filler material may also increase the viscosity of the uncured underfill and/or increase the modulus of elasticity of the cured underfill. In some method embodiments, a thermocompression bonder is used to simultaneously provide solder bump reflow and underfill curing. Application of various methods to a component package, an electronic assembly, and an electronic system are also described.
    Type: Application
    Filed: October 26, 2001
    Publication date: May 1, 2003
    Applicant: Intel Corporation
    Inventors: Carlos A. Gonzalez, Song-Hua Shi, Milan Djukic
  • Publication number: 20030063440
    Abstract: A retention module includes a socket to connect to a package. At least one retention arm is coupled to the socket. At least one clamping bar is coupled to the at least one retention arm to secure placement of a heat sink against a surface of a package assembly.
    Type: Application
    Filed: September 28, 2001
    Publication date: April 3, 2003
    Inventors: Biju Chandran, Carlos A. Gonzalez
  • Publication number: 20030064618
    Abstract: A retention module includes a socket to connect to a package. At least one retention arm is coupled to the socket. The at least one retention arm extends perpendicular to the socket. At least one retention clamp is coupled to the at least one retention arm to secure placement of a heat sink against a surface of a package assembly.
    Type: Application
    Filed: September 28, 2001
    Publication date: April 3, 2003
    Inventors: Biju Chandran, Carlos A. Gonzalez
  • Publication number: 20030060061
    Abstract: An array of contacts for electrically connecting a semiconductor package to a circuit board. The contacts are carried by a tape having an adhesive border. The tape, along with the contacts, are applied easily to either the substrate or the circuit board using the adhesive border. Each contact is made of two S-shaped pieces in perpendicular directions. The contacts are inserted into holes in the tape and held there by friction.
    Type: Application
    Filed: September 21, 2001
    Publication date: March 27, 2003
    Inventors: Carlos A. Gonzalez, Biju Chandran
  • Publication number: 20030019549
    Abstract: Low-alloy carbon steel for the manufacture of seamless pipes having improved resistance to corrosion, particularly the “sweet corrosion” that occurs in the media rich in CO2, for using in exploration and production of oil and/or natural gas. The steel contains: 1.5-4.0% by weight of Cr, 0.06-0.10% by weight of C, 0.3-0.8% by weight of Mn, not more than 0.005% by weight of S, not more than 0.015% by weight of P, 0.20-0.35% by weight of Si, 0.25-0.35% by weight of Mo, 0.06-0.9% by weight of V, approximately 0.22% by weight of Cu, approximately 0.001% by weight of Nb, approximately 0.028% by weight of Ti, not more than a total value of O of 25 ppm, with the balance being Fe and unavoidable impurities.
    Type: Application
    Filed: March 13, 2002
    Publication date: January 30, 2003
    Inventors: Gustavo Javier Lopez Turconi, Teresa Estela Perez, Juan Carlos Gonzalez
  • Patent number: 6446291
    Abstract: A process for automatically controlling water level in a washing machine having a motor drive coupled to energize a motor that drives the agitator is provided. The process allows for selecting a target water level based on one or more water-level selection signals. The method further allows for measuring a parameter indicative of the water level based on an actual inertial response of the agitator. A comparing step allows for comparing the actual agitator inertial response against a target agitator inertial response, and a selecting step allows for selectively actuating one or more water valves for allowing passage of water so as to adjust the water level of the washing machine based on deviations between the actual agitator inertial response and the target agitator inertial response.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: September 10, 2002
    Assignee: Mabe Mexico S. de R.L. de C.V
    Inventors: Alfredo Diaz Fernandez, Pedro Roberto Reyes Turrubiarte, Erick Flores Islas, Juan Carlos Gonzalez Garcia Ancira
  • Patent number: 6415469
    Abstract: A process and system for controlling respective agitator motion patterns in a washing machine having a motor drive coupled to energize a motor that drives the agitator is provided. The process allows for selecting a desired agitator motion pattern based on one or more pattern selection signals. The process further allows measuring one or more parameters indicative of the actual agitator motion pattern. A comparing step allows for comparing the actual agitator motion pattern against the desired agitator motion pattern, and an adjusting step allows for adjusting one or more control signals supplied to the motor drive for correcting deviations between the actual agitator motion pattern and the desired motion pattern.
    Type: Grant
    Filed: May 31, 2000
    Date of Patent: July 9, 2002
    Assignee: Mabe Mexico S. de R.L. de C.V.
    Inventors: Alfredo Diaz Fernandez, Pedro Roberto Reyes Turrubiarte, Erick Flores Islas, Juan Carlos Gonzalez Garcia Ancira
  • Publication number: 20020070448
    Abstract: A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a fastening means for applying a deforming force to the plates, such as screws and nuts. The plates are paraboloid or dish-shaped and made of an elastically deformable material, such as steel. The fastening means simultaneously applies deforming forces to the peripheries of the plates to create a continuous spring force to effect electrical continuity between the integrated circuit package and the circuit board. In addition, a method of testing the retention mechanism and a method of assembling the retention mechanism are disclosed.
    Type: Application
    Filed: December 8, 2000
    Publication date: June 13, 2002
    Applicant: Intel Corporation
    Inventors: Carlos A. Gonzalez, Leo Ofman
  • Publication number: 20020061825
    Abstract: The invention relates to compositions for cables filling wherein a styrene-butadiene block copolymer with radial structure is used as a gelling agent. This polymer is obtained through styrene and butadiene sequential polymerization and subsequent reaction with a coupling agent preferably of type Cl4-nMRn, wherein M=Sn or Si, R is an alkyl or aryl group and n is an integer from 0 to 2, and hydrogenation of the resulting polymer. This type of copolymer brings a higher stability to the final properties of the gel as compared with the linear hydrogenated synthetic rubbers usually used in the prior art.
    Type: Application
    Filed: October 9, 2001
    Publication date: May 23, 2002
    Applicant: DYNASOL ELASTOMEROS S.A.
    Inventors: Juan Antonio Barrio Calle, Carlos Gonzalez Gonzalez, Juan Antonio Prieto Noguera
  • Patent number: 6260912
    Abstract: A modular space frame of cab-over type cabin that can be used without distinction in a medium, heavy, and tractor truck, which may be assembled in the same assembly line of any of these three types of trucks and with the same kind of tools is described.
    Type: Grant
    Filed: September 9, 1999
    Date of Patent: July 17, 2001
    Assignee: Consorcio G. Grupa Dina, S.A. de C.V.
    Inventors: Francisco Mondragon Sarmiento, Roberto Miranda Guerrero, Alejandro Espinosa Ruiz, Carlos Gonzalez Guadarrama
  • Patent number: 6149593
    Abstract: A method and apparatus for detecting beta particles in the presence of high gamma background using secondary electron emission (SEE) as the primary beta particle detector. Diamond-like thin films having coefficients for SEE as high as 50 are preferably used in a small hand-held probe whereby radiolabeled malignancies as small as 3 mm in diameter can be detected. An electron multiplier amplifies the secondary electron signal for generation of an audible signal or a display indicative of the level of beta radiation passing through the air-vacuum interface of the hand-held probe.
    Type: Grant
    Filed: December 16, 1996
    Date of Patent: November 21, 2000
    Assignee: The Trustees of the University of Pennsylvania
    Inventor: Carlos Gonzalez-Lepera
  • Patent number: 6032412
    Abstract: Moulded bodies are described which comprise a humus-containing plant substrate consolidated with polyurethane/polyurea, which are obtainable by slurrying a humus-containing plant substrate in water, admixing a liquid NCO prepolymer having a maximum NCO content of 15% by weight which has been produced by the reaction of toluene diisocyanate with a polyether polyol component containing at least one aminopolyether polyol in an amount of 0.5 to 100 mole % with respect to the polyol component, and introducing the mixture thus obtained into a mould and allowing it to solidify. A process for producing these moulded bodies is also described, as is their use as growth media for seedlings in the propagation and raising of plants.
    Type: Grant
    Filed: May 22, 1998
    Date of Patent: March 7, 2000
    Assignees: Bayer Aktiengesellschaft, Ernst Sonderhoff GmbH & Co. KG
    Inventors: Franz-Josef Bohne, Martin Brahm, Alberto Carlos Gonzalez-Dorner, Marc Herrmann, Manfred Schmidt, Franz-Josef Giesen, Manfred Teichmann