Abstract: A low resistance package-to-die interconnect scheme for reduced die stresses includes a relatively low melting temperature and yield strength solder on the die and a relatively higher melting temperature and electrically conductive material such as copper on the substrate. A soldered joint connects the solder to the electrically conductive material to couple/connect the die and substrate to one another. The soldered joint is formed by heating the die and solder thereon to at least the melting temperature of the solder and thereafter contacting the molten solder with the conductive material on the substrate, which is at a substantially lower temperature for minimizing residual stress from soldering due to coefficient of thermal expansion mismatch between the substrate and die.

Abstract: A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a fastening means for applying a deforming force to the plates, such as screws and nuts. The plates are paraboloid or dish-shaped and made of an elastically deformable material, such as steel. The fastening means simultaneously applies deforming forces to the peripheries of the plates to create a continuous spring force to effect electrical continuity between the integrated circuit package and the circuit board. In addition, a method of testing the retention mechanism and a method of assembling the retention mechanism are disclosed.

Abstract: In order to maintain the integrity of data stored in a flash memory that are susceptible to being disturbed by operations in adjacent regions of the memory, disturb events cause the data to be read, corrected and re-written before becoming so corrupted that valid data cannot be recovered. The sometimes conflicting needs to maintain data integrity and system performance are balanced by deferring execution of some of the corrective action when the memory system has other high priority operations to perform. In a memory system utilizing very large units of erase, the corrective process is executed in a manner that is consistent with efficiently rewriting an amount of data much less than the capacity of a unit of erase.

Abstract: The present invention is generally related to a device for facilitating the setting of the ear attachment method on earrings. The device is comprised of a universal female clipping connector and a variety of male clipping connectors. The universal female connector is attached to the back of the earrings, then the user selects what kind of ear attachment method is desired and chooses a male clipping connector that will provide this method and such male connector is attached to the universal female connector creating earrings which can be then used by the method provided by the male connector.

Abstract: A non-volatile memory system, such as a flash EEPROM system, is disclosed to be divided into a plurality of blocks and each of the blocks into one or more pages, with sectors of data being stored therein that are of a different size than either the pages or blocks. One specific technique packs more sectors into a block than pages provided for that block. Error correction codes and other attribute data for a number of user data sectors are preferably stored together in different pages and blocks than the user data.

Abstract: An array of contacts for electrically connecting a semiconductor package to a circuit board. The contacts are carried by a tape having an adhesive border. The tape, along with the contacts, are applied easily to either the substrate or the circuit board using the adhesive border. Each contact is made of two S-shaped pieces in perpendicular directions. The contacts are inserted into holes in the tape and held there by friction.

Abstract: A surface mount-type microelectronic component assembly which does not physically attach the microelectronic component to its carrier substrate. Electrical contact is achieved between the microelectronic component and the carrier with solder balls attached to either the microelectronic component or the carrier substrate. A force is exerted on the assembly to achieve sufficient electrical contact between the microelectronic component and the carrier substrate.

Abstract: A ball grid array device includes a substrate and a die attached to the substrate. The substrate further includes a first major surface and a second major surface. A first ball, having an attached end and a distal tip end, is attached to a major surface of the substrate. The first ball has a first height. A second ball, having an attached end and a distal tip end, is also attached to the major surface. The second ball has a second height different from the first height. The first height and the second height are selected to produce a substantially co-planar surface at the distal tip ends of the first ball and the second ball. The major surface is not substantially co-planar. A method for forming the balls of a ball grid array device on a major of a substrate includes determining height differences across the major surface of the substrate, placing lands on the substrate, and forming a plurality of balls on the lands. Each of the balls has an attached portion and a tip portion.

Abstract: A non-volatile memory system, such as a flash EEPROM system, is disclosed to be divided into a plurality of blocks and each of the blocks into one or more pages, with sectors of data being stored therein that are of a different size than either the pages or blocks. One specific technique packs more sectors into a block than pages provided for that block. Error correction codes and other attribute data for a number of user data sectors are preferably stored together in different pages and blocks than the user data.

Abstract: The invention relates to compositions for cables filling wherein a styrene-butadiene block copolymer with radial structure is used as a gelling agent. This polymer is obtained through styrene and butadiene sequential polymerization and subsequent reaction with a coupling agent preferably of type Cl4-nMRn, wherein M=Sn or Si, R is an alkyl or aryl group and n is an integer from 0 to 2, and hydrogenation of the resulting polymer. This type of copolymer brings a higher stability to the final properties of the gel as compared with the linear hydrogenated synthetic rubbers usually used in the prior art.

Abstract: A method for testing a multiplicity of chemical entities for the ability of these chemical entities to enhance or inhibit a biological process.

Abstract: The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.

Abstract: A non-volatile memory system, such as a flash EEPROM system, is disclosed to be divided into a plurality of blocks and each of the blocks into one or more pages, with sectors of data being stored therein that are of a different size than either the pages or blocks. One specific technique packs more sectors into a block than pages provided for that block. Error correction codes and other attribute data for a number of user data sectors are preferably stored together in different pages and blocks than the user data.

Abstract: A retention module includes a socket to connect to a package. At least one retention arm is coupled to the socket. The at least one retention arm extends perpendicular to the socket. At least one retention clamp is coupled to the at least one retention arm to secure placement of a heat sink against a surface of a package assembly.

Abstract: A thin, lightweight retention mechanism with a spring force holds an integrated circuit package to a circuit board. The retention mechanism consists of a pressure plate, a backing plate, and a fastening means for applying a deforming force to the plates, such as screws and nuts. The plates are paraboloid or dish-shaped and made of an elastically deformable material, such as steel. The fastening means simultaneously applies deforming forces to the peripheries of the plates to create a continuous spring force to effect electrical continuity between the integrated circuit package and the circuit board. In addition, a method of testing the retention mechanism and a method of assembling the retention mechanism are disclosed.

Abstract: Low-alloy carbon steel for the manufacture of seamless pipes having improved resistance to corrosion, particularly the “sweet corrosion” that occurs in the media rich in CO2, for using in exploration and production of oil and/or natural gas. The steel contains: 1.5-4.0% by weight of Cr, 0.06-0.10% by weight of C, 0.3-0.8% by weight of Mn, not more than 0.005% by weight of S, not more than 0.015% by weight of P, 0.20-0.35% by weight of Si, 0.25-0.35% by weight of Mo, 0.06-0.9% by weight of V, approximately 0.22% by weight of Cu, approximately 0.001% by weight of Nb, approximately 0.028% by weight of Ti, not more than a total value of O of 25 ppm, with the balance being Fe and unavoidable impurities.

Abstract: The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.

Abstract: For interactive television subscribers, a system (10) and method for persistent storage of common information relating to a user (25) required by multiple disparate iTV applications to be shared among said applications to ease the burden of data entry off the user. Subscribers do not have to repeatedly enter the same common user information required by multiple applications. The registration information inputted by a user (25) is logged, temporarily stored in the STB (35), and its contents transmitted to a remote central repository (100) at predetermined intervals.

Abstract: The invention belongs to the field of animal health and in particular the causative agent of a new bacterial poultry disease, Pasteurella trehalosi and/or Mannheimia haemolytica. The invention provides said Pasteurella trehalosi and/or Mannheimia haemolytica bacteria, vaccine comprising inactivated Pasteurella trehalosi and/or Mannheimia haemolytica, and a method of immunizing to prevent disease in poultry.