Abstract: Disclosed herein is a method of making a light emitting device comprising an LED and a molded silicon-containing encapsulant. The method includes contacting the LED with a photopolymerizable composition containing a silicon-containing resin having silicon-bonded hydrogen and aliphatic unsaturation and a metal-containing catalyst that may be activated by actinic radiation. Photopolymerization of the photopolymerizable composition is then carried out to form the encapsulant. At some point before polymerization is complete, a mold is used to impart a predetermined shape to the encapsulant.

Abstract: A method of increasing the efficiency of a multiphoton absorption process and apparatus. The method includes: providing a photoreactive composition; providing a source of sufficient light for simultaneous absorption of at least two photons; exposing the photoreactive composition to at least one transit of light from the light source; and directing at least a portion of the first transit of the light back into the photoreactive composition using at least one optical element, wherein a plurality of photons not absorbed in at least one transit are used to expose the photoreactive composition in a subsequent transit.

Abstract: A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition consisting of a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin consists of silicon-bonded hydrogen and aliphatic unsaturation, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

Abstract: A method of increasing the efficiency of a multiphoton absorption process and apparatus. The method includes: providing a photoreactive composition; providing a source of sufficient light for simultaneous absorption of at least two photons; exposing the photoreactive composition to at least one transit of light from the light source; and directing at least a portion of the first transit of the light back into the photoreactive composition using at least one optical element, wherein a plurality of photons not absorbed in at least one transit are used to expose the photoreactive composition in a subsequent transit.

Abstract: A phosphor tape article includes a phosphor layer having a phosphor and a polymeric binder material, a pressure sensitive adhesive layer disposed adjacent the phosphor layer such that light transmitted through the pressure sensitive adhesive layer is received by the phosphor layer, and a release liner disposed on the pressure sensitive adhesive layer. The pressure sensitive adhesive layer is disposed between the release liner and the phosphor layer. The phosphor is suitable for excitation by UV or blue LED light, and the phosphor emission has a characteristic decay rate of less than 1 second. Light emitting devices including pieces of phosphor tape, and methods of making such devices, are also disclosed.

Abstract: A process for fabricating of an article by exposing a photoreactive composition to light under multiphoton absorption conditions. The light passes through an optical system having a final optical element having a numeric aperture in a range of from 0.65 to 1.25, inclusive.

Abstract: A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition comprising a silicon-containing resin, a metal-containing catalyst, and surface treated particles, the silicon-containing resin comprises silicon-bonded hydrogen and aliphatic unsaturation, the surface treated particles comprising nonabsorbing metal oxide particles, semiconductor particles, or combinations thereof, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

Abstract: An optical element is formed by co-extruding to have an arrangement of polymer scattering fibers within a polymer matrix. The scattering fibers lie substantially parallel to a first axis. The scattering fibers are arranged at positions across the cross-section of the polymer matrix to scatter light transversely incident on the optical element in a direction substantially orthogonal to the first axis. The positions of the scattering fibers across the cross-section of the optical element may be selected so as to form a two-dimensional photonic crystal structure for light transversely incident on the optical element.

Abstract: A composite polymer fiber comprises a polymer filler material and a plurality of polymer scattering fibers disposed within the filler material. At least one of the filler material and the scattering fibers is formed of a birefringent material. The refractive indices of the filler material and the scattering fibers can be substantially matched for light incident in a first polarization state on the composite polymer fiber and unmatched for light incident in an orthogonal polarization state. The scattering fibers may be arranged to form a photonic crystal within the composite fiber. The composite fibers may be extruded and may be formed into a yarn, a weave or the like. If the filler material is soluble, it may be washed out of the yarn or weave, and the scattering fibers may then be infiltrated with a resin that is subsequently cured.

Abstract: Methods for making encapsulated light emitting diodes, and light emitting articles prepared thereby are disclosed. The methods include activating a light emitting diode to emit light to at least partially polymerize a photopolymerizable encapsulant.

Abstract: A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition consisting of a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin consists of silicon-bonded hydrogen and aliphatic unsaturation, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

Abstract: A method of making a light emitting device is disclosed. The method includes the steps of providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition consisting of a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin consists of silicon-bonded hydrogen and aliphatic unsaturation, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

Abstract: Light sources are disclosed utilizing LED dies that have a light emitting surface. A patterned low refractive index layer that can support total internal reflection within the LED die is provided in optical contact with a first portion of the emitting surface. In optical contact with a second portion of the emitting surface is an input surface of an optical element. The refractive index of the low index layer is below both that of the optical element and the LED die. The optical element can have a variety of shapes and sizes.

Abstract: A light source includes an LED die with an emitting surface and a plurality of optical elements having input surfaces in optical contact with distinct portions of the emitting surface. The optical elements can comprise tapers or concentrators that have reflective side surface(s) and output surfaces larger than the respective input surfaces. The optical elements can couple both light and heat out of the emitting surface of the LED die.

Abstract: A method for fabricating an array of precisely shaped and located shaped elements utilizes a precisely shaped patterned abrasive to form channels in a workpiece. One or more patterned abrasives contact and abrade along one or more intersecting axes to define the shaped elements. The shaped elements may include optical elements, semiconductor elements, or both.

Abstract: Light sources are disclosed utilizing LED dies having at least one emitting surface. An optical element is provided for efficiently extracting light out of an LED die by controlling the angular distribution of the emitted light. The optical element is optically coupled to but is mechanically decoupled from the emitting surface of the LED die. The optical element has an input surface that is optically coupled to the emitting surface, an output surface that is larger in surface area than the input surface, and at least one intermediate surface.

Abstract: A solid state light source includes an LED die that generates light of two polarization states. A medium is provided at or near an emitting surface of the LED die that preferentially reflects one polarization state back into the LED die and preferentially transmits the other polarization state out of the LED die, thus providing a solid state light source whose light output is at least partially polarized. Recycling of light within the LED die together with polarization conversion mechanisms can enhance efficiency and brightness of the polarized output.

Abstract: Light sources are disclosed utilizing LED dies having at least one emitting surface. An optical element is disclosed for efficiently extracting light out of an LED die by controlling the angular distribution of the emitted light. The optical element has an input surface that is optically coupled to the emitting surface, an output surface that is larger in surface area than the input surface, and at least one intermediate surface. A heat sink thermally coupled to the intermediate surface of the optical element extracts heat from the emitting surface of the LED die via the optical element.

Abstract: A light source includes an LED die with an emitting surface and a collimating optical element. The optical element includes an input surface in optical contact with the LED emitting surface, and an output surface. The optical element has a first portion that comprises the input surface, made of a first optical material, and a second portion that comprises the output surface, made of a second optical material. The first optical material, which may include sapphire, diamond, or silicon carbide, has a higher refractive index, thermal conductivity, or both relative to the second optical material.

Abstract: A method for fabricating a light emitting array utilizes a precisely shaped patterned abrasive to abrade optical material. One or more patterned abrasives contact and abrade along one or more intersecting axes of the optical material. The resulting precisely shaped and located optical elements are aligned with and bonded to an array of light sources.