Patents by Inventor Chad A. Cobbley

Chad A. Cobbley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9559087
    Abstract: Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dice coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: January 31, 2017
    Assignee: Micron Technology, Inc.
    Inventors: Todd O. Bolken, Chad A. Cobbley
  • Patent number: 8872310
    Abstract: A conductive via of a semiconductor device includes a relatively small diameter portion extending into an active surface of a fabrication substrate and a corresponding, relatively large diameter portion that extends into a back side of the fabrication substrate. This type of conductive via may be fabricated by forming the relatively small diameter portion before or during BEOL processing, while the large diameter portion of each conductive via may be fabricated after BEOL processing is complete. Electronic devices that include one or more semiconductor devices with such conductive vias are also disclosed.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: October 28, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Chad A. Cobbley, Jonathon G. Greenwood
  • Patent number: 8716849
    Abstract: A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. A stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
    Type: Grant
    Filed: April 3, 2012
    Date of Patent: May 6, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Chad A. Cobbley, Cary J. Baerlocher
  • Publication number: 20140099753
    Abstract: Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dice coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package.
    Type: Application
    Filed: December 10, 2013
    Publication date: April 10, 2014
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Todd O. Bolken, Chad A. Cobbley
  • Patent number: 8629558
    Abstract: Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dice coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package.
    Type: Grant
    Filed: June 6, 2012
    Date of Patent: January 14, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Todd O. Bolken, Chad A. Cobbley
  • Patent number: 8624371
    Abstract: Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.
    Type: Grant
    Filed: April 19, 2013
    Date of Patent: January 7, 2014
    Assignee: Round Rock Research, LLC
    Inventors: Todd O. Bolken, Chad A. Cobbley
  • Patent number: 8599637
    Abstract: Memory devices, connectors and methods for terminating an operation are provided, including a memory device configured to terminate an internal operation such as a programming or erase operation responsive to receiving a signal during removal of the memory device from a connector, such as a socket. The memory device may be configured to generate the removal signal, such as by including a dedicated removal terminal. The memory card may respond to the signal by terminating a programming or erase operation before power is lost. The removal terminal may have a dimension that is different from a dimension of a power terminal. Alternatively, the connector may be configured to generate a signal that causes a host to terminate programming or erase operations prior to memory card removal, such as by including a switch that is actuated when the memory device moves to a pre-power loss position.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: December 3, 2013
    Assignee: Micron Technology, Inc.
    Inventors: James Cooke, Peter Feeley, Victor Tsai, William H. Radke, Neal Galbo, Chad Cobbley
  • Publication number: 20130234275
    Abstract: Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.
    Type: Application
    Filed: April 19, 2013
    Publication date: September 12, 2013
    Applicant: ROUND ROCK RESEARCH, LLC
    Inventors: Todd O. Bolken, Chad A. Cobbley
  • Patent number: 8508034
    Abstract: Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: August 13, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Todd O. Bolken, Cary J. Baerlocher, Steven W. Heppler, Chad A. Cobbley
  • Patent number: 8426954
    Abstract: Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: April 23, 2013
    Assignee: Round Rock Research, LLC
    Inventors: Todd O. Bolken, Chad A. Cobbley
  • Patent number: 8344514
    Abstract: A conductive via of a semiconductor device includes a relatively small diameter portion extending into an active surface of a fabrication substrate and a corresponding, relatively large diameter portion that extends into a back side of the fabrication substrate. This type of conductive via may be fabricated by forming the relatively small diameter portion before or during BEOL processing, while the large diameter portion of each conductive via may be fabricated after BEOL processing is complete. Electronic devices that include one or more semiconductor devices with such conductive vias are also disclosed.
    Type: Grant
    Filed: April 12, 2011
    Date of Patent: January 1, 2013
    Assignee: Micron Technology, Inc.
    Inventors: Chad A. Cobbley, Jonathon G. Greenwood
  • Publication number: 20120241956
    Abstract: Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dice coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package.
    Type: Application
    Filed: June 6, 2012
    Publication date: September 27, 2012
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Todd O. Bolken, Chad A. Cobbley
  • Publication number: 20120243362
    Abstract: Memory devices, connectors and methods for terminating an operation are provided, including a memory device configured to terminate an internal operation such as a programming or erase operation responsive to receiving a signal during removal of the memory device from a connector, such as a socket. The memory device may be configured to generate the removal signal, such as by including a dedicated removal terminal. The memory card may respond to the signal by terminating a programming or erase operation before power is lost. The removal terminal may have a dimension that is different from a dimension of a power terminal. Alternatively, the connector may be configured to generate a signal that causes a host to terminate programming or erase operations prior to memory card removal, such as by including a switch that is actuated when the memory device moves to a pre-power loss position.
    Type: Application
    Filed: May 29, 2012
    Publication date: September 27, 2012
    Inventors: James Cooke, Peter Feeley, Victor Tsai, William H. Radke, Neal Galbo, Chad Cobbley
  • Publication number: 20120187552
    Abstract: A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
    Type: Application
    Filed: April 3, 2012
    Publication date: July 26, 2012
    Inventors: Chad A. Cobbley, Cary J. Baerlocher
  • Patent number: 8212348
    Abstract: Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dices coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package.
    Type: Grant
    Filed: July 20, 2010
    Date of Patent: July 3, 2012
    Assignee: Micron Technology, Inc.
    Inventors: Todd O. Bolken, Chad A. Cobbley
  • Patent number: 8189420
    Abstract: Memory devices, connectors and methods for terminating an operation are provided, including a memory device configured to terminate an internal operation such as a programming or erase operation responsive to receiving a signal during removal of the memory device from a connector, such as a socket. The memory device may be specially configured to generate the removal signal, such as by including a dedicated removal terminal. The memory card may respond to the signal by terminating a programming or erase operation before power is lost. The removal terminal may have a dimension that is different from a dimension of a power terminal through which the memory device receives power. Alternatively, the connector may be specially configured to generate a signal that causes a host to terminate programming or erase operations in the memory device prior to memory card removal, such as by including a switch that is actuated when the memory device moves to a pre-power loss position.
    Type: Grant
    Filed: June 4, 2009
    Date of Patent: May 29, 2012
    Assignee: Micron Technology, Inc.
    Inventors: James Cooke, Peter Feeley, Victor Tsai, William H. Radke, Neal Galbo, Chad Cobbley
  • Publication number: 20120126386
    Abstract: Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
    Type: Application
    Filed: January 31, 2012
    Publication date: May 24, 2012
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Todd O. Bolken, Cary J. Baerlocher, Steven W. Heppler, Chad A. Cobbley
  • Patent number: 8148803
    Abstract: A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.
    Type: Grant
    Filed: February 15, 2002
    Date of Patent: April 3, 2012
    Assignee: Micron Technology, Inc.
    Inventors: Chad A. Cobbley, Cary J. Baerlocher
  • Patent number: 8115296
    Abstract: Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: February 14, 2012
    Assignee: Micron Technology, Inc.
    Inventors: Todd O. Bolken, Cary J. Baerlocher, Steven W. Heppler, Chad A. Cobbley
  • Publication number: 20110298077
    Abstract: Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.
    Type: Application
    Filed: August 18, 2011
    Publication date: December 8, 2011
    Applicant: Round Rock Research, LLC
    Inventors: Todd O. Bolken, Chad A. Cobbley