Patents by Inventor Chae Kyu Jang

Chae Kyu Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040239409
    Abstract: Provided is a high voltage generator including a level detector for selecting one of a plurality of voltage sources in accordance with an option control signal and comparing the selected voltage source with a Vpp voltage; a first oscillator for generating a plurality of pulse signals having different periods, the first oscillator being operated in accordance with the option control signal; a second oscillator for generating pulse signals, the second oscillator operated in accordance with the option control signal; a first charge pump for generating the Vpp voltage by performing a pumping operation in accordance with an output of the first oscillator, the first charge pump being enabled in accordance with the option control signal; and a second charge pump for generating the Vpp voltage by performing a pumping operation in accordance with an output of the second oscillator, the second charge pump being enabled in accordance with the option control signal.
    Type: Application
    Filed: December 17, 2003
    Publication date: December 2, 2004
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventors: Chae Kyu Jang, Sang Kwon Lee
  • Publication number: 20040173887
    Abstract: A TV-BGA package comprises: a PCB having bonding fingers; an adhesive material being coated on an edge of the PCB; a sealing post being adhered on the adhesive material; a semiconductor testing chip having a plurality of bonding pads adhered on the PCB; a plurality of metal wires separately connecting bonding pads of the PCB to the bonding fingers of the PCB; a sealing cap adhered on a sealing post for sealing the semiconductor chip; and a plurality of solder balls adhered to a lower side of the PCB. An extrusion is formed at a upper end of the sealing post, and the sealing cap is adhered on the extrusion of the sealing post. Further, the sealing cap is adhered on the extrusion of the sealing post by a low temperature thermoplastic tape or a material similar to low temperature thermoplastic tape. In the TV-BGA package, a sealing post is adhered on the adhesive material coated on an edge of the PCB, and then a sealing cap is capped on the sealing post, so that a test vehicle is manufactured.
    Type: Application
    Filed: July 14, 2003
    Publication date: September 9, 2004
    Inventors: Chae Kyu Jang, Sang Kwon Lee