Patents by Inventor Chan KWON

Chan KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8137135
    Abstract: The coaxial cable connector according to the invention includes a male connector having a male terminal assembly that connects to a female connector having a female terminal assembly during coupling between the male connector and the female connector. Each of the male and female terminal assemblies includes a catching protrusion, while each connector includes an elastic plate formed at a top of an receiving passageway. The elastic plate includes a catching hole in which the corresponding catching protrusion is caught. Each male and female terminal assemblies includes a groove formed at a side thereof, while the male and female connectors include a fixing piece formed at a side of the receiving passageway thereof. The fixing piece fits in the corresponding groove through a side of a corresponding one of the male and female connectors, whereby the male and female terminal assemblies are dually fixed to the male and female connectors.
    Type: Grant
    Filed: April 8, 2011
    Date of Patent: March 20, 2012
    Assignee: Tyco Electronics AMP Korea Ltd.
    Inventors: Chul-Sub Lee, Gi-Chan Kwon
  • Publication number: 20120065242
    Abstract: Disclosed is a polymer-siRNA delivery carrier in which a siRNA is combined with a polymer and the use thereof. More specifically, there is disclosed a stable in vivo polymer-siRNA delivery carrier in which a polymer and a siRNA are combined by using charge interaction and biodegradable covalent bonding at the same time and the use thereof. The polymer-siRNA delivery carrier in which a polymer and a siRNA are combined by using charge interaction and biodegradable covalent bonding at the same time has a high siRNA deliver efficiency to a target portion in vivo. Hence, according to the polymer-siRNA binder, the siRNA for treatment can be effectively delivered to a target portion such as in vivo cancer tissue, and the like even with administration of a relatively low concentration, and thus widely used for the treatment of various kinds of diseases.
    Type: Application
    Filed: October 15, 2010
    Publication date: March 15, 2012
    Inventors: Kwang Meyung KIM, Ick Chan KWON, Kuiwon CHOI, Myung Sook HUH, Seung Young LEE, So Jin LEE
  • Patent number: 8119595
    Abstract: The present invention provides an aqueous formulation of human erythropoietin having the storage stability over a long period without serum albumin, in which the formulation comprises a pharmaceutically effective amount of human erythropoietin; non-ionic surfactant, polyhydric alcohol, neutral amino acid and sugar alcohol as stabilizers; isotonic reagent; and buffering reagent.
    Type: Grant
    Filed: June 7, 2004
    Date of Patent: February 21, 2012
    Assignee: LG Life Sciences, Ltd.
    Inventors: Kyu Chan Kwon, Suk Young Choi, Young Cheol Kang, Hoon Sung Jeh, Seung Joo Lee, Myung Jin Kim, Ji Eon Kim, Jin-Seok Oh
  • Publication number: 20120034907
    Abstract: The present invention relates to a method and system for transmitting digital data while waiting for call connection and a mobile communication terminal for the same. If an originating mobile communication terminal attempts call connection, the mobile communication system searches for service subscription information of a terminating mobile communication terminal and confirms whether or not the terminating mobile communication terminal is a subscriber of a data transmission service. If the terminating mobile communication terminal is a subscriber of the data transmission service, the mobile communication system requests and receives call connection waiting information containing a plurality of digital data and matching to the terminating mobile communication terminal from a connection information providing server, and encodes and transmits the call connection waiting information to the originating mobile communication terminal.
    Type: Application
    Filed: September 2, 2010
    Publication date: February 9, 2012
    Applicant: SK TELECOM CO., LTD.
    Inventors: Seok Keon Lee, Hyun Wook Kim, Oh Chan Kwon, Joong Gunn Park
  • Patent number: 8102043
    Abstract: A method for manufacturing a stacked integrated circuit and package system includes: attaching a high temperature resistant layer on a top substrate; mounting a first top integrated circuit on the high temperature resistant layer; mounting a second top integrated circuit on the first top integrated circuit; molding an encapsulant over the first top integrated circuit, the second top integrated circuit and the top substrate; mounting a third top integrated circuit over the first top integrated circuit on a surface opposite the second top integrated circuit; mounting a fourth top integrated circuit on the third top integrated circuit; molding an encapsulant over the third top integrated circuit, the fourth top integrated circuit and the top substrate; forming top electrical connectors on a lower surface of the top substrate; and mounting a bottom package to the top electrical connectors.
    Type: Grant
    Filed: January 13, 2011
    Date of Patent: January 24, 2012
    Assignee: Stats Chippac Ltd.
    Inventors: Tae Sung Jeong, Hyeog Chan Kwon, Youngcheol Kim
  • Publication number: 20120016612
    Abstract: A system for acquiring data of a multi-channel superconducting quantum interference device (SQUID) signal includes a digital converter connected to a SQUID sensor having a plurality of channels and configured to receive a voltage signal output from the plurality of channels and generate a channel-voltage serial digital signal having information about a channel from which the voltage signal is output and information about the voltage signal, and an optical fiber cable through which the channel-voltage serial digital signal is transmitted from the digital converter.
    Type: Application
    Filed: August 5, 2011
    Publication date: January 19, 2012
    Applicant: Korea Research Institute of Standards and Science
    Inventors: Jin Mok Kim, Yong Ho Lee, Hyuk Chan Kwon, Ki Woong Kim, Kwon Kyu Yu
  • Patent number: 8075917
    Abstract: The present invention relates to a paclitaxel composition and the preparation methods thereof to solubilize paclitaxel wherein said composition comprises 4 to 90% by weight of at least one selected from the monoglycerides, 0.01 to 90% by weight of at least one oil and 0.01 to 20% by weight of paclitaxel. Also the present invention relates to a paclitaxel composition including emulsifiers and the preparation methods thereof to solubilize paclitaxel wherein said composition comprises 4 to 90% by weight of at least one selected from the monoglycerides, 0.01 to 90% by weight of at least one emulsifier and 0.01 to 20% by weight of paclitaxel. The composition of the present invention is an effective paclitaxel delivery system since the composition solubilizes paclitaxel, does not form aggregates after being dispersed in water, adsorbs well on the intestinal wall, and therefore has high bioavailability.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: December 13, 2011
    Assignee: Daehwa Pharm. Co., Ltd.
    Inventors: Hesson Chung, Seo-Young Jeong, Ick-Chan Kwon, Yeong-Taek Park, In-Hyun Lee, Soon-Hong Yuk, Young-Wook Choi, Jae-Hyung Park, Jin-Wook Chung
  • Publication number: 20110293291
    Abstract: A system for acquiring data of a multi-channel signal includes a channel-voltage transmission module disposed in a shield room blocking electromagnetic waves, connected with a plurality of channels from which analog signals are output, and configured to generate a serial digital signal having information about an analog signal and information about a channel from which the analog signal is output, and an optical fiber cable through which the serial digital signal is transmitted from the channel-voltage transmission module to the outside of the shield room.
    Type: Application
    Filed: August 5, 2011
    Publication date: December 1, 2011
    Applicant: Korea Research Institute of Standards and Science
    Inventors: Jin Mok Kim, Yong Ho Lee, Hyuk Chan Kwon, Ki Woong Kim
  • Patent number: 8067831
    Abstract: An integrated circuit package system is provided including forming a first substrate, mounting a first integrated circuit to the first substrate, and forming first planar interconnects in contact with the first integrated circuit and electrically connecting the first integrated circuit to the first substrate.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: November 29, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Hyeog Chan Kwon, Tae Sung Jeong, Jae Han Chung, Taeg Ki Lim, Jong Wook Ju
  • Publication number: 20110274930
    Abstract: The present invention relates to a high-molecular weight oligonucleotides polymerization method which increases in vivo stability, and to the use of a high-molecular weight oligonucleotides prepared by the polymerization method. The oligonucleotide polymerization method of the present invention is advantageous in that an oligonucleotide with a small molecular weight can be easily polymerized into high-molecular weight oligonucleotides. Further, the high-molecular oligonucleotide prepared by the method of the present invention can bind to hydrophilic high-molecular materials or inorganic materials, and then can be stably delivered to a living body. Therefore, the high-molecular oligonucleotide prepared by the method of the present invention can be widely used for treating various diseases.
    Type: Application
    Filed: March 2, 2010
    Publication date: November 10, 2011
    Inventors: KwangMeyung Kim, Iek Chan Kwon, Kui Won Choi, Seung Young Lee, In Chan Youn, Myung Sook Huh, So Jin Lee
  • Publication number: 20110274010
    Abstract: A method for electing a ring manager of ring topology network and a node are disclosed, where, to this end, a node responsible for electing the ring manager periodically requests each node of diagnostic information on packet traffic and receives the diagnostic information on packet traffic from each node, newly elects a node capable of performing a ring manager role, and informs each node of information on the newly elected ring manager, whereby, the ring network can be more effectively operated because the ring manager is elected based on network load status that changes in real time even in the course of a ring network being initially set up and operated responsive to structural conditions including hop count of each nod and MAC node.
    Type: Application
    Filed: April 20, 2011
    Publication date: November 10, 2011
    Inventors: Young Chan KWON, Soo Gang LEE
  • Patent number: 8049322
    Abstract: A method for making an integrated circuit package-in-package system includes: forming a first integrated circuit package including a first device and a first substrate and having a first interface; stacking a second integrated circuit package including a second device and a second substrate and having a second interface above the first integrated circuit package; and fitting the first interface directly on the second interface.
    Type: Grant
    Filed: April 30, 2010
    Date of Patent: November 1, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Choong Bin Yim, Hyeog Chan Kwon, Jong-Woo Ha
  • Patent number: 8045092
    Abstract: A multifunctional optical sheet for a liquid crystal display device includes a substrate diffusing incident light; a light-concentrating layer on the substrate and including a plurality of patterns that arranged to form alternating peaks and valleys; and reflection patterns between the substrate and the light-concentrating layer corresponding to the valleys of the light concentrating layer.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: October 25, 2011
    Assignee: LG Display Co., Ltd.
    Inventors: Young-Hun Jeong, Hyeuk-Chan Kwon, Man-Hoan Lee
  • Patent number: 8045093
    Abstract: A backlight unit for slimmed structure and exhibiting uniform brightness through the improvement of its luminance efficiency and the quality in appearance of which is improved by the removal of bright lines, and a liquid crystal display device having the same are disclosed. The backlight unit includes a plurality of light emitting lamps disposed above a cover bottom such that the light emitting lamps are arranged at regular intervals, a diffusion plate disposed above the light emitting lamps, the diffusion plate including a substrate, a light control part formed on the bottom surface of the substrate corresponding to the light emitting lamps, and lens parts mounted on the top surface of the substrate, and an optical film disposed above the diffusion plate.
    Type: Grant
    Filed: February 29, 2008
    Date of Patent: October 25, 2011
    Assignee: LG Display Co., Ltd.
    Inventors: Se Chang Won, Duck Su Kim, Min Joo Kim, Eun Ju Kim, Hyeuk Chan Kwon, Jae Jung Han, Dong Seok Lee
  • Patent number: 8044663
    Abstract: The ultra-sensitive susceptibility detection apparatus of anharmonic resonance measurement type using an atomic magnetometer detects a change in susceptibility by a specimen containing an object to be measured. The apparatus includes an atomic magnetometer. The atomic magnetometer includes a cell containing an alkaline metallic atom, a light source for magnetically polarizing the alkaline metallic atom of the cell, and a bias magnetic field applicator for applying a bias magnetic field to adjust a measuring resonance frequency of the alkaline metallic atom.
    Type: Grant
    Filed: November 7, 2008
    Date of Patent: October 25, 2011
    Assignee: Korea Research Institute of Standards and Science
    Inventors: Ki Woong Kim, Yong Ho Lee, Hyuk Chan Kwon, Jin Mok Kim, Yong Ki Park
  • Publication number: 20110239459
    Abstract: A method for manufacturing a wafer scale heat slug system includes: dicing an integrated circuit from a semiconductor wafer; forming a heat slug blank equivalent in size to the semiconductor wafer; dicing the heat slug blank to produce a heat slug equivalent in size to the integrated circuit; attaching the integrated circuit to a substrate; attaching the heat slug to the integrated circuit; and encapsulating the integrated circuit.
    Type: Application
    Filed: June 15, 2011
    Publication date: October 6, 2011
    Inventor: Hyeog Chan Kwon
  • Patent number: 8030134
    Abstract: Stacked semiconductor assemblies in which a first die is mounted active side upward on a first substrate and is electrically interconnected to the substrate by wire bonding; an adhesive/spacer structure is formed upon the active side of the first die; and a device such as a die or a package or a heat spreader, having an electrically nonconductive side, is mounted upon the adhesive/spacer structure with the electrically nonconductive side facing the first wire bonded die. The side of the device facing the first wire bonded die may be made electrically nonconductive by having an electrically insulating layer, such as a dielectric film adhesive. Also, methods for making the assemblies are disclosed.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: October 4, 2011
    Assignee: Chippac, Inc.
    Inventors: Hyeog Chan Kwon, Marcos Karnezos
  • Patent number: D650381
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: December 13, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Il Park, Jun-Won Bae, Jong-Chan Kwon, Hae-Jin Kim
  • Patent number: D654069
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: February 14, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Chan Kwon, Jun-Won Bae, Sang-Il Park, Hae-Jin Kim, Dae-Kyung Ahn
  • Patent number: D656528
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: March 27, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Chan Kwon, Jun-Won Bae, Jae-Hwa Moon, Su-Jung Ham