Abstract: An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.

Abstract: A connector having a first connector portion with a first connection interface and a guide projection is disclosed. The connector also has a second connector portion with a second connection interface configured for insertion into the first connection interface. The connector also has a lever having a guide channel configured to receive the guide projection. The lever is linearly movably connected to the second connector portion and is positionally biased away from the second connector portion. While the guide projection is within the guide channel, movement of the lever from a fully positionally biased location with respect to the second connector portion initiates a change in a state of connection between the first connector portion and the second connector portion.

Abstract: Semiconductor chip packages have die asymmetrically arranged on the respective substrates. Two such packages having complementary arrangements can be stacked, one inverted with respect to the other, such that the two die are situated side-by-side in the space between the two substrates. Also, multipackage modules include stacked packages, each having the die asymmetrically arranged on the substrate. Adjacent stacked packages have complementary asymmetrical arrangements of the die, and one package is inverted with respect to the other in the stack, such that the two die are situated side-by-side in the space between the two substrates. Also, methods are disclosed for making the packages and for making the stacked package modules.

Abstract: Semiconductor chip packages have die asymmetrically arranged on the respective substrates. Two such packages having complementary arrangements can be stacked, one inverted with respect to the other, such that the two die are situated side-by-side in the space between the two substrates. Also, multipackage modules include stacked packages, each having the die asymmetrically arranged on the substrate. Adjacent stacked packages have complementary asymmetrical arrangements of the die, and one package is inverted with respect to the other in the stack, such that the two die are situated side-by-side in the space between the two substrates. Also, methods are disclosed for making the packages and for making the stacked package modules.

Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a carrier having a top side and a bottom side; forming an edge terminal pad on the top side and an inner terminal pad on the bottom side; connecting an integrated circuit die to an inner portion of the edge terminal pad; and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed.

Abstract: A joint tong apparatus for a radiation shielding facility. A spherical ball has a through-hole. An inner spherical socket and an outer spherical socket are installed in a hole formed in a partition between a radiation-shielded room and a control room so as to enclose the spherical ball on inner and outer sides. A bar is inserted and coupled into and to the through-hole of the spherical ball. An inner joint assembly has a first housing coupled to a shielded room-side end of the bar and a first pivot member pivotably mounted on a free end of the first housing. An outer joint assembly having a second housing coupled to a control room-side end of the bar and a second pivot member pivotably mounted on a free end of the second housing. The apparatus further includes a tong assembly, a handle assembly, a tong manipulation cable, and a pair of pivot manipulation cables.

Abstract: A cable connector for a vehicle door has a first connector including a first contact terminal and a fitting member. The fitting member has at least one cam recess, at least one locking recess, and at least one elastic member. The elastic member has at least one latching recess that engages an edge of a connecter mounting opening of a panel of a vehicle body. The contact terminal and the fitting member have a flange with a waterproof seal provided there between. A second connector is engaged with the fitting member of the first connector. The second connector includes a second contact terminal and a slide lever. The slide lever has at least one guide protrusion and at least one locking protrusion. The slide lever is slideable to move the guide protrusion along the cam recess and lock the locking protrusion in the locking recess.

Abstract: The present invention relates to an anticancer drug-chitosan complex forming self-aggregates and the preparation method thereof. More precisely, the present invention relates to the anticancer drug-chitosan complex forming self-aggregates in aqueous media composed of a hydrophobic anticancer agent and a hydrophilic chitosan, and the preparation method thereof. The anticancer drug-chitosan complex of the present invention not only works selectively against target tumor tissue but also continues to release the medicine over a long period of time. Besides, the anticancer drug-chitosan complex could have greater amount of drug by adding the anticancer drug into self-aggregates, which is generally limited by chemical bond. Therefore, the anticancer drug-chitosan complex of the present invention can be effectively used for the cancer chemotherapy.

Abstract: An integrated circuit package system is provided forming a carrier having a top side and a bottom side, forming an edge terminal pad on the top side and an inner terminal pad on the bottom side, connecting an integrated circuit die to an inner portion of the edge terminal pad, and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed.

Abstract: An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.

Abstract: An integrated circuit package system is provided including providing a wafer with bond pads formed on the wafer. A solder bump is deposited on one or more bond pads. The bond pads and the solder bump are embedded within a mold compound formed on the wafer. A groove is formed in the mold compound to expose a portion of the solder bump. The wafer is singulated into individual die structures at the groove.

Abstract: A multifunctional optical sheet for a liquid crystal display device includes a substrate diffusing incident light; a light-concentrating layer on the substrate and including a plurality of patterns that arranged to form alternating peaks and valleys; and reflection patterns between the substrate and the light-concentrating layer corresponding to the valleys of the light concentrating layer.

Abstract: A backlight unit for slimmed structure and exhibiting uniform brightness through the improvement of its luminance efficiency and the quality in appearance of which is improved by the removal of bright lines, and a liquid crystal display device having the same are disclosed. The backlight unit includes a plurality of light emitting lamps disposed above a cover bottom such that the light emitting lamps are arranged at regular intervals, a diffusion plate disposed above the light emitting lamps, the diffusion plate including a substrate, a light control part formed on the bottom surface of the substrate corresponding to the light emitting lamps, and lens parts mounted on the top surface of the substrate, and an optical film disposed above the diffusion plate.

Abstract: A home audio video network system for providing a remote user interface (UI) to image display apparatuses coupled to a set-top box, a set-top box, an image display apparatus and a method for offering a UI are provided. The system includes a set-top box which analyzes an event and outputs user interface (UI) data corresponding to the event; and an image display apparatus which renders and displays a UI according to the UI data. The set-top box includes a storage unit; an application unit; a UI process unit; and a UI offer unit. The image display apparatus includes a UI transmission and reception unit; a UI rendering unit; and a display unit. The method includes analyzing an event and transmitting UI data corresponding to the event to the image display apparatus; and rendering and displaying a UI according to the UI data by the image display apparatus.

Abstract: A connector having a first connector portion with a first connection interface and a guide projection is disclosed. The connector also has a second connector portion with a second connection interface configured for insertion into the first connection interface. The connector also has a lever having a guide channel configured to receive the guide projection. The lever is linearly movably connected to the second connector portion and is positionally biased away from the second connector portion. While the guide projection is within the guide channel, movement of the lever from a fully positionally biased location with respect to the second connector portion initiates a change in a state of connection between the first connector portion and the second connector portion.

Abstract: A rear door system for transferring hot cell equipment into or out of a hot cell is disclosed. The rear door system of the present invention includes a rear door, which is provided to a rear wall of the hot cell so as to be movable to open or close the rear wall of the hot cell, and a vertical moving table, which is provided at a predetermined position on the lower portion of the front surface of the rear door so as to be movable upwards or downwards. The rear door system further includes a drive unit, which is provided at a predetermined position in the lower end of the rear door to move the rear door, and a stationary working table, which is disposed above the vertical moving table and is fixed in the hot cell in a horizontal orientation. The rear door system further includes a removable table, which is removably coupled at a predetermined position to the stationary working table, and a hot cell crane hook and a service area crane hook, which are respectively provided inside and outside the hot cell.

Abstract: An identifier verification method for determining whether an identifier of a second peer node is reliable, at first peer node, in a distributed peer to peer network without a server, the network having a plurality of peer nodes connected to an Internet, the identifier verification method including: obtaining the identifier of the second peer node; requesting identifier verification for checking whether the identifier of the second peer node is forged, by using a cryptographic method via a third peer node randomly selected, when receiving a request for the identifier verification from a user; and verifying reliability of the identifier of the second peer node depending on a result of the identifier verification request.

Abstract: A cable connector for a vehicle door has a first connector including a first contact terminal and a fitting member. The fitting member has at least one cam recess, at least one locking recess, and at least one elastic member. The elastic member has at least one latching recess that engages an edge of a connecter mounting opening of a panel of a vehicle body. The contact terminal and the fitting member have a flange with a waterproof seal provided there between. A second connector is engaged with the fitting member of the first connector. The second connector includes a second contact terminal and a slide lever. The slide lever has at least one guide protrusion and at least one locking protrusion. The slide lever is slideable to move the guide protrusion along the cam recess and lock the locking protrusion in the locking recess.

Abstract: Disclosed are a pharmaceutical formulation characterized in that hydrophobic anticancer drugs are incorporated into a cholanic acid-chitosan complex and a preparation method thereof, and more particularly, the cholanic acid-chitosan complex composing of hydrophobic cholanic acid and hydrophilic chitosan forms self-aggregates in an aquatic environment. The pharmaceutical formulation characterized in that hydrophobic anticancer drugs are incorporated into a cholanic acid-chitosan complex, wherein the cholanic acid-chitosan complex forms self-aggregates, prolongs the drug release period, enhances the selectivity of the complex for tumor tissue, and greatly increases drug loading content when a drug is incorporated into the self-aggregates, compared to chemical bonding, which limits drug incorporation. Thus, the pharmaceutical formulation of the present invention is useful for anticancer chemotherapy.