Patents by Inventor Chan KWON

Chan KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110218892
    Abstract: An apparatus to manage an account is provided. The account managing apparatus includes an account management unit which manages a user account of at least one user who uses an image forming apparatus, a storage unit which stores guest information related to the user account, a guest account generating unit which generates a guest account dependent on the user account based on stored guest information and the user account when a request to generate an account to use the image forming apparatus is received from a guest, and a control unit which controls the image forming apparatus according to a generated account policy.
    Type: Application
    Filed: November 12, 2010
    Publication date: September 8, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong-sik Jeong, Yong-chan Kwon, Jung-ha Kim
  • Publication number: 20110213121
    Abstract: Disclosed are a nanoparticle sensor for measuring protease activity, for protease imaging, and a method for preparing the same. More specifically, the present invention relates to a nanoparticle sensor for measuring protease activity in which a fluorophore- and a quencher-conjugated peptide substrate is conjugated to a biocompatible polymer nanoparticle. The peptide substrate is specifically lysed by a protease. The sensor according to the present invention is capable of inhibiting emission of fluorescence with high extinctive activity of the quencher on a fluorescent material. But strong fluorescence is specifically emitted only if the peptide substrate is lysed by a specific protease. Therefore, the sensor is especially useful as a method for screening a novel drug such as a protease overexpression inhibitor, and early diagnosis of incurable diseases and various diseases such as autoimmune diseases including cancer, osteoarthritis, rheumatoid arthritis and dementia.
    Type: Application
    Filed: August 27, 2009
    Publication date: September 1, 2011
    Inventors: Ick-Chan Kwon, Kui-Won Choi, Kwang-Meyung Kim, In-Chan Youn, Seul-Ki Lee, Kyeong-Soon Park, Dae-Hyuk Moon, Dae-Yoon Chi, Seung-Jin Lee, Seung-Jae Myung
  • Patent number: 7995700
    Abstract: A rear door system for transferring hot cell equipment into or out of a hot cell is disclosed. The rear door system of the present invention includes a rear door, which is provided to a rear wall of the hot cell so as to be movable to open or close the rear wall of the hot cell, and a vertical moving table, which is provided at a predetermined position on the lower portion of the front surface of the rear door so as to be movable upwards or downwards. The rear door system further includes a drive unit, which is provided at a predetermined position in the lower end of the rear door to move the rear door, and a stationary working table, which is disposed above the vertical moving table and is fixed in the hot cell in a horizontal orientation. The rear door system further includes a removable table, which is removably coupled at a predetermined position to the stationary working table, and a hot cell crane hook and a service area crane hook, which are respectively provided inside and outside the hot cell.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: August 9, 2011
    Assignees: Korea Atomic Energy Research Institute, Korea Hydro & Nuclear Power Co., Ltd.
    Inventors: Eun Pyo Lee, Gil Sung You, Ji Sup Yoon, Won Myung Choung, Jeong Hoe Ku, Il Je Cho, Dong Hak Kook, Kie Chan Kwon, Won Kyung Lee
  • Publication number: 20110189890
    Abstract: The coaxial cable connector according to the invention includes a male connector having a male terminal assembly that connects to a female connector having a female terminal assembly during coupling between the male connector and the female connector. Each of the male and female terminal assemblies includes a catching protrusion, while each connector includes an elastic plate formed at a top of an receiving passageway. The elastic plate includes a catching hole in which the corresponding catching protrusion is caught. Each male and female terminal assemblies includes a groove formed at a side thereof, while the male and female connectors include a fixing piece formed at a side of the receiving passageway thereof. The fixing piece fits in the corresponding groove through a side of a corresponding one of the male and female connectors, whereby the male and female terminal assemblies are dually fixed to the male and female connectors.
    Type: Application
    Filed: April 8, 2011
    Publication date: August 4, 2011
    Inventors: Chul-Sub Lee, Gi-Chan Kwon
  • Patent number: 7975377
    Abstract: A wafer scale heat slug system is presented providing dicing an integrated circuit from a semiconductor wafer, forming a heat slug blank equivalent in size to the semiconductor wafer, dicing the heat slug blank to produce a heat slug equivalent in size to the integrated circuit, attaching the integrated circuit to a substrate, attaching the heat slug to the integrated circuit and encapsulating the integrated circuit.
    Type: Grant
    Filed: April 17, 2006
    Date of Patent: July 12, 2011
    Assignee: Stats Chippac Ltd.
    Inventor: Hyeog Chan Kwon
  • Publication number: 20110145560
    Abstract: An adaptive security policy based scalable video service apparatus includes a video streaming server, an adaptive security policy server and a terminal. The video streaming server receives a service demand via a network and generates an encrypted streaming data. The adaptive security policy server analyzes a media structure and the service demand, by using a service profile received from the video streaming server, so as to generate a security policy description. The terminal generates and transmits the service demand to the video streaming server or the adaptive security server, obtains the encrypted streaming data from the video streaming server and decrypts the encrypted streaming data for playback, storing and retransmission.
    Type: Application
    Filed: May 6, 2010
    Publication date: June 16, 2011
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Yong Hyuk MOON, Hyeok Chan KWON, Seungmin LEE, Jae Hoon NAH, Taek Yong NAM, Dong Il SEO
  • Publication number: 20110122760
    Abstract: An apparatus and a method for interference cancellation using a multi-user multiple input multiple output (MU-MIMO) scheme in a single carrier frequency division multiple access (SC-FDMA) system are disclosed. Received data of every terminal are classified into first received data and second received data. The first received data has lower reliability and the second received data has higher reliability than the first received data. The second received data is transmitted to an upper layer. Interference signals are formed with the second received data based on a channel estimation value. The interference signals are removed from the first received data, and the interference signal free first received data is transmitted to the upper layer.
    Type: Application
    Filed: November 23, 2009
    Publication date: May 26, 2011
    Inventors: Hyuck Chan KWON, Hee Gul Park, Jung Seung Lee, Byoung Seong Park
  • Publication number: 20110108976
    Abstract: A method for manufacturing a stacked integrated circuit and package system includes: attaching a high temperature resistant layer on a top substrate; mounting a first top integrated circuit on the high temperature resistant layer; mounting a second top integrated circuit on the first top integrated circuit; molding an encapsulant over the first top integrated circuit, the second top integrated circuit and the top substrate; mounting a third top integrated circuit over the first top integrated circuit on a surface opposite the second top integrated circuit; mounting a fourth top integrated circuit on the third top integrated circuit; molding an encapsulant over the third top integrated circuit, the fourth top integrated circuit and the top substrate; forming top electrical connectors on a lower surface of the top substrate; and mounting a bottom package to the top electrical connectors.
    Type: Application
    Filed: January 13, 2011
    Publication date: May 12, 2011
    Inventors: Tae Sung Jeong, Hyeog Chan Kwon, Youngcheol Kim
  • Patent number: 7932593
    Abstract: Semiconductor chip packages have die asymmetrically arranged on the respective substrates. Two such packages having complementary arrangements can be stacked, one inverted with respect to the other, such that the two die are situated side-by-side in the space between the two substrates. Also, multipackage modules include stacked packages, each having the die asymmetrically arranged on the substrate. Adjacent stacked packages have complementary asymmetrical arrangements of the die, and one package is inverted with respect to the other in the stack, such that the two die are situated side-by-side in the space between the two substrates. Also, methods are disclosed for making the packages and for making the stacked package modules.
    Type: Grant
    Filed: April 30, 2009
    Date of Patent: April 26, 2011
    Assignee: STATS Chippac Ltd.
    Inventor: Hyeog Chan Kwon
  • Patent number: 7884460
    Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a carrier having a top side and a bottom side; forming an edge terminal pad on the top side and an inner terminal pad on the bottom side; connecting an integrated circuit die to an inner portion of the edge terminal pad; and encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge terminal pad exposed.
    Type: Grant
    Filed: January 27, 2009
    Date of Patent: February 8, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Choong Bin Yim, Hyeog Chan Kwon, Jong-Woo Ha
  • Patent number: 7875966
    Abstract: A stacked integrated circuit and package system including attaching a first top integrated circuit over an upper surface of a top substrate, attaching a second top integrated circuit over a lower surface of the top substrate, forming top electrical connectors on the lower surface of the top substrate, and connecting a bottom package to the top electrical connectors.
    Type: Grant
    Filed: October 21, 2005
    Date of Patent: January 25, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Tae Sung Jeong, Hyeog Chan Kwon, Youngcheol Kim
  • Publication number: 20110009636
    Abstract: The present invention relates to a process for preparing 2-methyl-2?-phenylpropionic acid derivatives showing antihistamine activity in more simplified way, intermediate compounds and their preparation processes used therefor. According to the present invention, pharmaceutically useful 2-methyl-2?-phenylpropionic acid derivatives can be prepared with high yield and purity on industrial scale.
    Type: Application
    Filed: February 12, 2009
    Publication date: January 13, 2011
    Inventors: Chun-Ho Lee, Ja-Heouk Khoo, Kyoung-Chan Kwon, Hyun Ju
  • Publication number: 20100327869
    Abstract: The ultra-sensitive susceptibility detection apparatus of anharmonic resonance measurement type using an atomic magnetometer detects a change in susceptibility by a specimen containing an object to be measured. The apparatus includes an atomic magnetometer. The atomic magnetometer includes a cell containing an alkaline metallic atom, a light source for magnetically polarizing the alkaline metallic atom of the cell, and a bias magnetic field applicator for applying a bias magnetic field to adjust a measuring resonance frequency of the alkaline metallic atom.
    Type: Application
    Filed: November 7, 2008
    Publication date: December 30, 2010
    Applicant: Korea Research Institute of Standards and Science
    Inventors: Ki Woong Kim, Yong Ho Lee, Hyuk Chan Kwon, Jin Mok Kim, Yong Ki Park
  • Publication number: 20100321802
    Abstract: Provided are a lens unit, a lens assembly, a camera module, a method of fabricating the camera module and the lens assembly, a method of fabricating an optic member, and an apparatus of fabricating the optic member. The lens unit comprises a lens portion and a supporting portion. The lens portion has a curved surface. The supporting portion extends from the lens portion. The supporting portion comprises a protrusion or a recess. The method of fabricating the optic member comprises injecting a resin composition inside a mold die, pressing the resin composition; and irradiating light onto the resin composition. Due to the pressure, shrinkage of a photo-curable resin composition can be reduced, and thus, the lens unit comprising the protrusion or recess can be easily fabricated.
    Type: Application
    Filed: January 8, 2009
    Publication date: December 23, 2010
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Bum Keun Kim, Jin Han Song, Myoung Jin An, Kee Tae Um, Chan Kwon Lee
  • Publication number: 20100310468
    Abstract: The present invention relates to recombinant albumins fused with poly-cysteine peptide and methods for preparing the same, more precisely recombinant albumins in which cysteines that can be used for drug binding are amplified at N-terminal and C-terminal of the albumin and methods for preparing the same. The recombinant albumin of the present invention demonstrates improved albumin-drug conjugation efficiency when it is used for drug delivery system, indicating that it can effectively deliver a large amount of drug to a target tissue. At the same time, the recombinant albumin of the present invention can be used as an excellent drug deliverer with reduced side effects, compared with the conventional albumin carriers, by regulating the amount of drug conjugated to each unit of albumin by regulating the number of cysteine fused thereto.
    Type: Application
    Filed: June 2, 2010
    Publication date: December 9, 2010
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyung Jun AHN, Ick Chan KWON, Kuiwon CHOI, Kwangmyeng KIM, Inchan YOUN, Sehoon KIM
  • Patent number: 7840811
    Abstract: Provided is a network system using diameter authentication, authorization and accounting (AAA) infrastructure to support the bootstrapping of a Mobile Internet Protocol version 6 (IPv6) mobile node. The network system includes a mobile node equipped with Mobile IPv6, an attendant which is accessed by the mobile node when the mobile node moves toward a new network, an AAA local server which supports AAA processes for the mobile node in a local network, an AAA home server which supports AAA processes for the mobile node in a home network, and supports initial settings during the bootstrapping of the mobile node, and a home agent which handles binding update (BU) and binding acknowledgement (BA) regarding the mobile node. The AAA home server can configure initial settings for the mobile node that is authenticated by the AAA local server so that the mobile node can be effectively bootstrapped.
    Type: Grant
    Filed: December 7, 2006
    Date of Patent: November 23, 2010
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jae Hoon Nah, Hyeok Chan Kwon, Jong Soo Jang
  • Publication number: 20100290999
    Abstract: Disclosed are nanoparticles of a light emissive polymer, comprising nanoparticles of a cyano-substituted poly(arylene vinylene) polymer; and a biocompatible surfactant adsorbed to the surface of the nanoparticles of the polymer, and preparation method thereof, wherein the method comprises: (1) uniformly mixing a dialdehyde monomer represented by a general formula OHC—Ar1—CHO, a dicyanide monomer represented by a general formula NC—Ar2—CN, and a liquid surfactant; (2) adding water to the resulting mixture to prepare an aqueous micelle dispersion; and (3) adding a polymerization catalyst to the aqueous micelle dispersion, followed by carrying out colloidal polymerization of the resulting mixture at room temperature under an atmosphere.
    Type: Application
    Filed: October 8, 2009
    Publication date: November 18, 2010
    Applicant: Korea Institute of Science and Technology
    Inventors: Sehoon KIM, Ick Chan KWON, Kwangmeyung KIM, Kuiwon CHOI, Chang-Keun LIM
  • Patent number: D628989
    Type: Grant
    Filed: December 30, 2009
    Date of Patent: December 14, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Ho Lee, Chang-Hwan Hwang, Jong-Chan Kwon
  • Patent number: D630622
    Type: Grant
    Filed: February 4, 2010
    Date of Patent: January 11, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Ho Lee, Jong-Chan Kwon, Chang-Hwan Hwang
  • Patent number: D640688
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: June 28, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sang-Il Park, Jun-Won Bae, Jong-Chan Kwon, Hae-Jin Kim