Abstract: According to the present disclosure, provided is a method for determining phase transition temperature using electrical conductivity. More specifically, according to the present disclosure, there is provided a method for determining phase transition temperature using electrical conductivity, including preparing a graph of the change in electrical conductivity of molten salts according to temperature, and performing at least one mathematical analysis of (i) performing a first-order differential on the graph, (ii) performing a second-order differential on the graph; and (iii) determining the number (n) of data and resolution (AT) based on the graph to derive Tn by Equation (1) below and performing linear regression analysis on a linear section to detect an outlier based on a distance from the linear regression equation, T n = T max - ? ? T × n Equation ? ( 1 ) where n denotes the number of data, and ?T denotes an interval of measurement temperature and means resolution.

Abstract: An organic light emitting display device, in which a silicon semiconductor pattern is formed on a buffer layer, and light shielding patterns of a pixel driving thin film transistor and a switching thin film transistor are then formed in the same process by processing portions of the silicon semiconductor pattern such that the portions of the silicon semiconductor pattern have conductivity, is disclosed. In a procedure of forming the silicon semiconductor pattern for formation of the light shielding patterns, a silicon semiconductor pattern, which is disposed under a gate driving thin film transistor, may be formed simultaneously with the former silicon semiconductor pattern, without using an additional silicon semiconductor pattern formation procedure. Accordingly, stack structures, planar design, and processes are simplified and, as such, there are effects of preventing failure occurring due to processes while reducing tact time and costs.

Abstract: A thin film transistor array substrate including a substrate including an active area and a non-active area, and a first thin film transistor disposed on the substrate while including a first oxide semiconductor pattern, a first gate electrode overlapping with the first oxide semiconductor pattern, a first gate insulating layer interposed between the first oxide semiconductor pattern and the first gate electrode, a first source electrode and a first drain electrode disposed on and connected to the first oxide semiconductor pattern, and a first light shielding pattern disposed under the first oxide semiconductor pattern and electrically connected to one of the first source electrode and the first drain electrodes. The first gate electrode includes a first portion maintaining a first parasitic capacitance and a second portion maintaining a second parasitic capacitance smaller than the first parasitic capacitance, together with the first oxide semiconductor pattern.

Abstract: The disclosure provides a driving thin film transistor and a switching thin film transistor each using an oxide semiconductor pattern as an active layer thereof. The driving thin film transistor and the switching thin film transistor include light shielding patterns, respectively. Each light shielding pattern includes a semiconductor material layer doped with P-type impurity ions. By virtue of the light shielding patterns including the semiconductor material layer, the driving thin film transistor and the switching thin film transistor achieve an increase in threshold voltage, thereby securing freedom of design.

Abstract: A communications module includes a module substrate composed of a plurality of insulating layers, a plurality of wiring layers, and a plurality of wiring vias; and a filter module disposed on the module substrate. At least one of the wiring layers overlaps the filter module in a thickness direction of the module substrate and is connected to a ground potential to function as a ground layer, and an entirety of at least one of the wiring layers and at least one of the wiring vias disposed in a first region in the thickness direction of the module substrate between the filter module and the ground layer are electrically connected to the filter module.

Abstract: A communications module includes a module substrate composed of a plurality of insulating layers, a plurality of wiring layers, and a plurality of wiring vias; and a filter module disposed on the module substrate. At least one of the wiring layers overlaps the filter module in a thickness direction of the module substrate and is connected to a ground potential to function as a ground layer, and an entirety of at least one of the wiring layers and at least one of the wiring vias disposed in a first region in the thickness direction of the module substrate between the filter module and the ground layer are electrically connected to the filter module.

Abstract: A fan-out electronic component package includes a core, a first electronic component, a first encapsulant, a connection member, a second electronic component, and a second encapsulant. The core member includes a through-hole, wiring layers and vias configured to electrically connect the wiring layers to each other. The first electronic component is disposed in the through-hole, and comprising filters configured to filter different frequency bands. The first encapsulant covers portions of the core member and the first electronic component, and fills portions of the through-hole. The connection member is disposed on the core member and the first electronic component, and includes a redistribution layer electrically connected to the wiring layers and the first electronic component. The second electronic component is disposed on the connection member and electrically connects to the redistribution layer. The second encapsulant is disposed to cover the second electronic component.

Abstract: A fan-out electronic component package includes a core, a first electronic component, a first encapsulant, a connection member, a second electronic component, and a second encapsulant. The core member includes a through-hole, wiring layers and vias configured to electrically connect the wiring layers to each other. The first electronic component is disposed in the through-hole, and comprising filters configured to filter different frequency bands. The first encapsulant covers portions of the core member and the first electronic component, and fills portions of the through-hole. The connection member is disposed on the core member and the first electronic component, and includes a redistribution layer electrically connected to the wiring layers and the first electronic component. The second electronic component is disposed on the connection member and electrically connects to the redistribution layer. The second encapsulant is disposed to cover the second electronic component.

Abstract: A filter module includes: a first substrate and a second substrate coupled to each other to form an internal space; a first filter formed on the first substrate, in the internal space, and including a bulk acoustic resonator; and a second filter disposed on the second substrate, wherein the first and second filters are configured to filter frequencies within different bands.

Abstract: A front end module including a first band amplifying processor configured to amplify signals in a first frequency band; a second band amplifying processor configured to amplify signals in a second frequency band; and a controller configured to output separate control voltages to the first and second band amplifying processors to control modes of the first and second band amplifying processors.

Abstract: A multi-band amplifier may include: a first amplifying unit connected to a first antenna stage; a second amplifying unit connected to a second antenna stage; and a switching control unit generating a control signal to activate at least one of the first and second amplifying units depending on a plurality of control voltages, wherein the first amplifying unit amplifies the signal within the first frequency band or provides the signal within the first frequency band to the first antenna stage by performing a switching operation depending on the control signal, and the second amplifying unit amplifies the signal within the second frequency band or provides the signal within the second frequency band to the second antenna stage by performing a switching operation depending on the control signal.

Abstract: A radio-frequency switch may include: a common port; a first signal transfer unit; and a second signal transfer unit, wherein the first signal transfer unit includes a first switch unit that has a plurality of switch circuit units, each of the plurality of switch circuit units having switches connected to each other with one forward-biased and another reverse-biased and being connected to a control terminal of respective switches in the first signal transfer part, and the second signal transfer unit includes a second switch unit that has a plurality of switch circuit units, each of the plurality of switch circuit units having switches connected to each other with one forward-biased and another reverse-biased and being connected to a control terminal of respective switches in the second signal transfer part.

Abstract: A front end module including a first band amplifying processor configured to amplify signals in a first frequency band; a second band amplifying processor configured to amplify signals in a second frequency band; and a controller configured to output separate control voltages to the first and second band amplifying processors to control modes of the first and second band amplifying processors.

Abstract: A dual-band filter and method thereof include a diplexer configured to process one of a first band signal and a second band signal, which includes a frequency band different from a frequency band of the first band signal, and block the other of the first band signal and the second band signal. A balun is configured to convert the first band signal from a differential signal to a single signal in response to the first band signal being transmitted, and convert the first band signal from a single signal to a differential signal in response to the first band signal being received. A direct current (DC) voltage supply port configured to supply a DC voltage to the balun when the first band signal is received.

Abstract: A bias circuit may include an envelope detecting unit detecting an envelope of an input signal, a source voltage generating unit generating a source voltage using a power supply voltage, and an envelope amplifying unit receiving the power supply voltage and the source voltage as a driving voltage and amplifying an envelope signal detected by the envelope detecting unit to generate a first bias voltage.

Abstract: A multi-band amplifier may include: a first amplifying unit connected to a first antenna stage; a second amplifying unit connected to a second antenna stage; and a switching control unit generating a control signal to activate at least one of the first and second amplifying units depending on a plurality of control voltages, wherein the first amplifying unit amplifies the signal within the first frequency band or provides the signal within the first frequency band to the first antenna stage by performing a switching operation depending on the control signal, and the second amplifying unit amplifies the signal within the second frequency band or provides the signal within the second frequency band to the second antenna stage by performing a switching operation depending on the control signal.

Abstract: A bias circuit may include an envelope detecting unit detecting an envelope of an input signal, a source voltage generating unit generating a source voltage using a power supply voltage, and an envelope amplifying unit receiving the power supply voltage and the source voltage as a driving voltage and amplifying an envelope signal detected by the envelope detecting unit to generate a first bias voltage.

Abstract: Disclosed herein is a display system incorporating wired and wireless charging apparatuses, including: a switching processing unit supplying and processing a power of a power supply unit according to a mode selected through a switch; a wireless charging unit connected to the switching processing unit and including a pad for wireless charging; a wired charging unit connected to the switching processing unit and a terminal for wired charging; a display unit connected to the switching processing unit; and a control unit connected to the switching processing unit to control operations according to the mode.

Abstract: A power amplifier may include: an amplification unit amplifying a power level of an input signal, a negative feedback circuit unit connected between an input terminal and an output terminal of the amplification unit and a linearization circuit unit connected between the negative feedback circuit unit and the input terminal of the amplification unit to predistort and linearize a signal from the negative feedback circuit unit, and to provide the signal to the input terminal of the amplification unit.

Abstract: A radio-frequency switch may include: a common port; a first signal transfer unit; and a second signal transfer unit, wherein the first signal transfer unit includes a first switch unit that has a plurality of switch circuit units, each of the plurality of switch circuit units having switches connected to each other with one forward-biased and another reverse-biased and being connected to a control terminal of respective switches in the first signal transfer part, and the second signal transfer unit includes a second switch unit that has a plurality of switch circuit units, each of the plurality of switch circuit units having switches connected to each other with one forward-biased and another reverse-biased and being connected to a control terminal of respective switches in the second signal transfer part.