Patents by Inventor Chan Yong Jeong
Chan Yong Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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THIN FILM TRANSISTOR SUBSTRATE, DISPLAY DEVICE INCLUDING THE SAME, AND MANUFACTURING METHODS THEREOF
Publication number: 20240172493Abstract: An organic light emitting display device, in which a silicon semiconductor pattern is formed on a buffer layer, and light shielding patterns of a pixel driving thin film transistor and a switching thin film transistor are then formed in the same process by processing portions of the silicon semiconductor pattern such that the portions of the silicon semiconductor pattern have conductivity, is disclosed. In a procedure of forming the silicon semiconductor pattern for formation of the light shielding patterns, a silicon semiconductor pattern, which is disposed under a gate driving thin film transistor, may be formed simultaneously with the former silicon semiconductor pattern, without using an additional silicon semiconductor pattern formation procedure. Accordingly, stack structures, planar design, and processes are simplified and, as such, there are effects of preventing failure occurring due to processes while reducing tact time and costs.Type: ApplicationFiled: September 22, 2023Publication date: May 23, 2024Inventors: Young Hyun KO, Ju Heyuck BAECK, Do Hyung LEE, Hong Rak CHOI, Chan Yong JEONG -
Publication number: 20240120343Abstract: A thin film transistor array substrate including a substrate including an active area and a non-active area, and a first thin film transistor disposed on the substrate while including a first oxide semiconductor pattern, a first gate electrode overlapping with the first oxide semiconductor pattern, a first gate insulating layer interposed between the first oxide semiconductor pattern and the first gate electrode, a first source electrode and a first drain electrode disposed on and connected to the first oxide semiconductor pattern, and a first light shielding pattern disposed under the first oxide semiconductor pattern and electrically connected to one of the first source electrode and the first drain electrodes. The first gate electrode includes a first portion maintaining a first parasitic capacitance and a second portion maintaining a second parasitic capacitance smaller than the first parasitic capacitance, together with the first oxide semiconductor pattern.Type: ApplicationFiled: August 8, 2023Publication date: April 11, 2024Applicant: LG Display Co., Ltd.Inventors: Hong Rak CHOI, Do Hyung LEE, Young Hyun KO, Chan Yong JEONG, Sung Ju CHOI
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Publication number: 20240038902Abstract: The disclosure provides a driving thin film transistor and a switching thin film transistor each using an oxide semiconductor pattern as an active layer thereof. The driving thin film transistor and the switching thin film transistor include light shielding patterns, respectively. Each light shielding pattern includes a semiconductor material layer doped with P-type impurity ions. By virtue of the light shielding patterns including the semiconductor material layer, the driving thin film transistor and the switching thin film transistor achieve an increase in threshold voltage, thereby securing freedom of design.Type: ApplicationFiled: July 31, 2023Publication date: February 1, 2024Inventors: Sung Ju CHOI, Young Hyun KO, Chan Yong JEONG, Jung Seok SEO, Jae Yoon PARK, Seo Yeon IM, Jin Won JUNG
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Patent number: 11342902Abstract: A communications module includes a module substrate composed of a plurality of insulating layers, a plurality of wiring layers, and a plurality of wiring vias; and a filter module disposed on the module substrate. At least one of the wiring layers overlaps the filter module in a thickness direction of the module substrate and is connected to a ground potential to function as a ground layer, and an entirety of at least one of the wiring layers and at least one of the wiring vias disposed in a first region in the thickness direction of the module substrate between the filter module and the ground layer are electrically connected to the filter module.Type: GrantFiled: February 10, 2020Date of Patent: May 24, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Chan Yong Jeong
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Publication number: 20210126623Abstract: A communications module includes a module substrate composed of a plurality of insulating layers, a plurality of wiring layers, and a plurality of wiring vias; and a filter module disposed on the module substrate. At least one of the wiring layers overlaps the filter module in a thickness direction of the module substrate and is connected to a ground potential to function as a ground layer, and an entirety of at least one of the wiring layers and at least one of the wiring vias disposed in a first region in the thickness direction of the module substrate between the filter module and the ground layer are electrically connected to the filter module.Type: ApplicationFiled: February 10, 2020Publication date: April 29, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventor: Chan Yong JEONG
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Patent number: 10431550Abstract: A fan-out electronic component package includes a core, a first electronic component, a first encapsulant, a connection member, a second electronic component, and a second encapsulant. The core member includes a through-hole, wiring layers and vias configured to electrically connect the wiring layers to each other. The first electronic component is disposed in the through-hole, and comprising filters configured to filter different frequency bands. The first encapsulant covers portions of the core member and the first electronic component, and fills portions of the through-hole. The connection member is disposed on the core member and the first electronic component, and includes a redistribution layer electrically connected to the wiring layers and the first electronic component. The second electronic component is disposed on the connection member and electrically connects to the redistribution layer. The second encapsulant is disposed to cover the second electronic component.Type: GrantFiled: May 16, 2018Date of Patent: October 1, 2019Assignee: Samsung EIectro-Mechanics Co., Ltd.Inventors: Myeong Woo Han, Chan Yong Jeong
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Publication number: 20180337136Abstract: A fan-out electronic component package includes a core, a first electronic component, a first encapsulant, a connection member, a second electronic component, and a second encapsulant. The core member includes a through-hole, wiring layers and vias configured to electrically connect the wiring layers to each other. The first electronic component is disposed in the through-hole, and comprising filters configured to filter different frequency bands. The first encapsulant covers portions of the core member and the first electronic component, and fills portions of the through-hole. The connection member is disposed on the core member and the first electronic component, and includes a redistribution layer electrically connected to the wiring layers and the first electronic component. The second electronic component is disposed on the connection member and electrically connects to the redistribution layer. The second encapsulant is disposed to cover the second electronic component.Type: ApplicationFiled: May 16, 2018Publication date: November 22, 2018Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Myeong Woo HAN, Chan Yong JEONG
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Publication number: 20180337454Abstract: A filter module includes: a first substrate and a second substrate coupled to each other to form an internal space; a first filter formed on the first substrate, in the internal space, and including a bulk acoustic resonator; and a second filter disposed on the second substrate, wherein the first and second filters are configured to filter frequencies within different bands.Type: ApplicationFiled: October 23, 2017Publication date: November 22, 2018Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Myeong Woo HAN, Chan Yong JEONG
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Patent number: 9673843Abstract: A front end module including a first band amplifying processor configured to amplify signals in a first frequency band; a second band amplifying processor configured to amplify signals in a second frequency band; and a controller configured to output separate control voltages to the first and second band amplifying processors to control modes of the first and second band amplifying processors.Type: GrantFiled: December 21, 2015Date of Patent: June 6, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Chan Yong Jeong
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Patent number: 9467102Abstract: A multi-band amplifier may include: a first amplifying unit connected to a first antenna stage; a second amplifying unit connected to a second antenna stage; and a switching control unit generating a control signal to activate at least one of the first and second amplifying units depending on a plurality of control voltages, wherein the first amplifying unit amplifies the signal within the first frequency band or provides the signal within the first frequency band to the first antenna stage by performing a switching operation depending on the control signal, and the second amplifying unit amplifies the signal within the second frequency band or provides the signal within the second frequency band to the second antenna stage by performing a switching operation depending on the control signal.Type: GrantFiled: February 6, 2015Date of Patent: October 11, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Chan Yong Jeong
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Patent number: 9425782Abstract: A radio-frequency switch may include: a common port; a first signal transfer unit; and a second signal transfer unit, wherein the first signal transfer unit includes a first switch unit that has a plurality of switch circuit units, each of the plurality of switch circuit units having switches connected to each other with one forward-biased and another reverse-biased and being connected to a control terminal of respective switches in the first signal transfer part, and the second signal transfer unit includes a second switch unit that has a plurality of switch circuit units, each of the plurality of switch circuit units having switches connected to each other with one forward-biased and another reverse-biased and being connected to a control terminal of respective switches in the second signal transfer part.Type: GrantFiled: May 15, 2014Date of Patent: August 23, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Chan Yong Jeong
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Publication number: 20160197629Abstract: A front end module including a first band amplifying processor configured to amplify signals in a first frequency band; a second band amplifying processor configured to amplify signals in a second frequency band; and a controller configured to output separate control voltages to the first and second band amplifying processors to control modes of the first and second band amplifying processors.Type: ApplicationFiled: December 21, 2015Publication date: July 7, 2016Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Chan Yong Jeong
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Publication number: 20160142077Abstract: A dual-band filter and method thereof include a diplexer configured to process one of a first band signal and a second band signal, which includes a frequency band different from a frequency band of the first band signal, and block the other of the first band signal and the second band signal. A balun is configured to convert the first band signal from a differential signal to a single signal in response to the first band signal being transmitted, and convert the first band signal from a single signal to a differential signal in response to the first band signal being received. A direct current (DC) voltage supply port configured to supply a DC voltage to the balun when the first band signal is received.Type: ApplicationFiled: October 19, 2015Publication date: May 19, 2016Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chan Yong JEONG, Hyun Jun LEE, Myeong Woo HAN
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Patent number: 9337778Abstract: A bias circuit may include an envelope detecting unit detecting an envelope of an input signal, a source voltage generating unit generating a source voltage using a power supply voltage, and an envelope amplifying unit receiving the power supply voltage and the source voltage as a driving voltage and amplifying an envelope signal detected by the envelope detecting unit to generate a first bias voltage.Type: GrantFiled: September 26, 2014Date of Patent: May 10, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chan Yong Jeong, Gyu Suck Kim, Song Cheol Hong, Tae Hwan Joo
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Publication number: 20150365054Abstract: A multi-band amplifier may include: a first amplifying unit connected to a first antenna stage; a second amplifying unit connected to a second antenna stage; and a switching control unit generating a control signal to activate at least one of the first and second amplifying units depending on a plurality of control voltages, wherein the first amplifying unit amplifies the signal within the first frequency band or provides the signal within the first frequency band to the first antenna stage by performing a switching operation depending on the control signal, and the second amplifying unit amplifies the signal within the second frequency band or provides the signal within the second frequency band to the second antenna stage by performing a switching operation depending on the control signal.Type: ApplicationFiled: February 6, 2015Publication date: December 17, 2015Inventor: Chan Yong JEONG
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Publication number: 20150244326Abstract: A bias circuit may include an envelope detecting unit detecting an envelope of an input signal, a source voltage generating unit generating a source voltage using a power supply voltage, and an envelope amplifying unit receiving the power supply voltage and the source voltage as a driving voltage and amplifying an envelope signal detected by the envelope detecting unit to generate a first bias voltage.Type: ApplicationFiled: September 26, 2014Publication date: August 27, 2015Inventors: Chan Yong JEONG, Gyu Suck KIM, Song Cheol HONG, Tae Hwan JOO
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Patent number: 9093856Abstract: Disclosed herein is a display system incorporating wired and wireless charging apparatuses, including: a switching processing unit supplying and processing a power of a power supply unit according to a mode selected through a switch; a wireless charging unit connected to the switching processing unit and including a pad for wireless charging; a wired charging unit connected to the switching processing unit and a terminal for wired charging; a display unit connected to the switching processing unit; and a control unit connected to the switching processing unit to control operations according to the mode.Type: GrantFiled: October 2, 2012Date of Patent: July 28, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myeong Woo Han, Joun Sup Park, Dong Woon Chang, Kwang Du Lee, Jung Aun Lee, Chan Yong Jeong
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Publication number: 20150188500Abstract: A power amplifier may include: an amplification unit amplifying a power level of an input signal, a negative feedback circuit unit connected between an input terminal and an output terminal of the amplification unit and a linearization circuit unit connected between the negative feedback circuit unit and the input terminal of the amplification unit to predistort and linearize a signal from the negative feedback circuit unit, and to provide the signal to the input terminal of the amplification unit.Type: ApplicationFiled: July 25, 2014Publication date: July 2, 2015Inventors: Seung Hoon KANG, Chan Yong JEONG, Gyu Suck KIM, Song Cheol HONG
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Publication number: 20150094116Abstract: A radio-frequency switch may include: a common port; a first signal transfer unit; and a second signal transfer unit, wherein the first signal transfer unit includes a first switch unit that has a plurality of switch circuit units, each of the plurality of switch circuit units having switches connected to each other with one forward-biased and another reverse-biased and being connected to a control terminal of respective switches in the first signal transfer part, and the second signal transfer unit includes a second switch unit that has a plurality of switch circuit units, each of the plurality of switch circuit units having switches connected to each other with one forward-biased and another reverse-biased and being connected to a control terminal of respective switches in the second signal transfer part.Type: ApplicationFiled: May 15, 2014Publication date: April 2, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Chan Yong JEONG
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Patent number: 8970282Abstract: There is provided a high frequency switch including: a first signal transferring unit including a plurality of first switching devices; a second signal transferring unit including a plurality of second switching devices; a first shunting unit including a plurality of third switching devices; and a second shunting unit including a plurality of fourth switching devices.Type: GrantFiled: February 13, 2013Date of Patent: March 3, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventor: Chan Yong Jeong