Abstract: The present disclosure describes a semiconductor structure with a dielectric liner. The semiconductor structure includes a substrate and a fin structure on the substrate. The fin structure includes a stacked fin structure, a fin bottom portion below the stacked fin structure, and an isolation layer between the stacked fin structure and the bottom fin portion. The semiconductor structure further includes a dielectric liner in contact with an end of the stacked fin structure and a spacer structure in contact with the dielectric liner.

Abstract: A composition for inhibiting intestinal permeability, treating leaky gut related diseases and/or preventing leaky gut related diseases including a Chinese herbal compound material or a Chinese herbal compound extract is provided. The Chinese herbal compound material includes Ganoderma, red jujube, longan and lotus seed. Moreover, the Chinese herbal compound extract includes a Ganoderma extract, a red jujube extract, a longan extract and a lotus seed extract.

Abstract: An electronic device is disclosed. The electronic device includes a substrate, a plurality of color filters disposed on the substrate, an optical film disposed on the plurality of color filter, and a defect disposed between the substrate and the optical film. The optical film has a first base, a protective layer on the first base, and a second base between the first base and the protective layer and having a first processed area. In a top view of the electronic device, the first processed area corresponds to the defect and at least partially overlaps at least two color filters.

Abstract: A method of fabricating a device includes forming a dummy gate over a plurality of fins. Thereafter, a first portion of the dummy gate is removed to form a first trench that exposes a first hybrid fin and a first part of a second hybrid fin. The method further includes filling the first trench with a dielectric material disposed over the first hybrid fin and over the first part of the second hybrid fin. Thereafter, a second portion of the dummy gate is removed to form a second trench and the second trench is filled with a metal layer. The method further includes etching-back the metal layer, where a first plane defined by a first top surface of the metal layer is disposed beneath a second plane defined by a second top surface of a second part of the second hybrid fin after the etching-back the metal layer.

Abstract: The present disclosure describes a semiconductor structure with a dielectric liner. The semiconductor structure includes a substrate and a fin structure on the substrate. The fin structure includes a stacked fin structure, a fin bottom portion below the stacked fin structure, and an isolation layer between the stacked fin structure and the bottom fin portion. The semiconductor structure further includes a dielectric liner in contact with an end of the stacked fin structure and a spacer structure in contact with the dielectric liner.

Abstract: The present disclosure provides a method for manufacturing an auto-crosslinked hyaluronic acid gel, comprising conducting auto-crosslinking reaction of a colloid containing hyaluronic acid continuously at low temperature in an acidic environment, and treating the reaction product with steam at high temperature to obtain the auto-crosslinked hyaluronic acid gel with high viscosity.

Abstract: A method for manufacturing a semiconductor device includes forming a first dielectric layer over a semiconductor fin. The method includes forming a second dielectric layer over the first dielectric layer. The method includes exposing a portion of the first dielectric layer. The method includes oxidizing a surface of the second dielectric layer while limiting oxidation on the exposed portion of the first dielectric layer.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: The present disclosure provides an image automatic correction method of a document camera, and the image automatic correction method includes steps as follows. An image is captured; at least one image feature value is extracted from the image, and whether an imaged picture has changed is determined according to the at least one image feature value of the image and at least one previous image feature value of a previous image; when the imaged picture has changed as determined, a focal length value is calculated, and whether the image needs to be rotated is determined according to the focal length value.

Abstract: A method for forming a gate all around transistor includes forming a plurality of semiconductor nanosheets. The method includes forming a cladding inner spacer between a source region of the transistor and a gate region of the transistor. The method includes forming sheet inner spacers between the semiconductor nanosheets in a separate deposition process from the cladding inner spacer.

Abstract: An antenna device is provided. The antenna device includes an antenna layer, a first transparent layer, and a second transparent layer. The antenna layer is a metal mesh structure having a plurality of thru-holes, and the antenna layer includes at least one soldering region and an embedded region. The first transparent layer and the second transparent layer are respectively connected to two opposite sides of the antenna layer. The first transparent layer and the second transparent layer are connected to each other, so that the embedded region of the antenna layer is embedded in-between the first transparent layer and the second transparent layer. The second transparent layer has a hollow region corresponding in position to the at least one soldering region, so that the at least one soldering region is exposed from the hollow region.

Abstract: An antenna device is provided. The antenna device includes an antenna layer, a first transparent layer, and a second transparent layer. The antenna layer is a metal mesh structure having a plurality of thru-holes, and the antenna layer includes at least one soldering region and an embedded region. The first transparent layer and the second transparent layer are respectively connected to two opposite sides of the antenna layer. The first transparent layer and the second transparent layer are connected to each other, so that the embedded region of the antenna layer is embedded in-between the first transparent layer and the second transparent layer. The second transparent layer has a hollow region corresponding in position to the at least one soldering region, so that the at least one soldering region is exposed from the hollow region.

Abstract: A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.

Abstract: The invention relates to a conductive paste comprising from 30 to 97% by weight of electrically conductive particles, from 0 to 20% by weight of a glass frit, from 3 to 70% by weight of an organic medium and from 0.1 to 67% by weight of a silicone oil, each based on the total mass of the paste, wherein the silicone oil has a boiling point or a boiling range in the range between 180° C. and 350° C. The invention further relates to a use of the conductive paste and a process for producing electrodes on a semiconductor substrate using the paste.

Abstract: A semiconductor package structure is disclosed. The package structure includes a first substrate, a second substrate on which the first substrate is disposed, and a semiconductor chip which is disposed on the first substrate. The two substrates can include two notches or two solder receiving portions. Therefore, when the package structure is disposed on the printed circuit board (PCB), the package structure will protrude less on the surface of the printed circuit board (PCB); or, the solders on the printed circuit board (PCB) will not be shifted by the package structure.

Abstract: The invention relates to a conductive paste comprising from 30 to 97% by weight of electrically conductive particles, from 0 to 20% by weight of a glass fit, from 3 to 70% by weight of an organic medium and from 0.1 to 67% by weight of a silicone oil, each based on the total mass of the paste, wherein the silicone oil hasa boiling pointor a boiling rangein the range between 180° C. and 350° C. The invention further relates to a use of the conductive paste and a process for producing electrodes on a semiconductor substrate using the paste.

Abstract: An adjustable washing rack for an air conditioner contains: a body and a water collection bag. The body includes two opposite supports, a first adjusting rod, and a fixing rod. Each support has a first connecting portion, a rotatable coupling portion, and a second connecting portion. The first adjusting rod is defined between two first connecting portions of the two supports and has a first outer fitting extension and a first inner fitting extension. The fixing rod has a second outer fitting extension and two second inner fitting extensions. The each second inner fitting extension has a first end coupled with a connector for rotatably connecting with the rotatable coupling portion of the each support, and a positioning device is mounted between the connector and the rotatable coupling portion of the each support. The water collection bag includes an opening and a U-shaped surrounding part.

Abstract: An adjustable washing rack for an air conditioner contains: a body and a water collection bag. The body includes two opposite supports, a first adjusting rod, and a fixing rod. Each support has a first connecting portion, a rotatable coupling portion, and a second connecting portion. The first adjusting rod is defined between two first connecting portions of the two supports and has a first outer fitting extension and a first inner fitting extension. The fixing rod has a second outer fitting extension and two second inner fitting extensions. The each second inner fitting extension has a first end coupled with a connector for rotatably connecting with the rotatable coupling portion of the each support, and a positioning device is mounted between the connector and the rotatable coupling portion of the each support. The water collection bag includes an opening and a U-shaped surrounding part.

Abstract: According to one embodiment of a system for measuring a load impedance, comprising: a switch module, a first reference impedance, a second reference impedance, and a control module, wherein the switch module connects the first reference impedance, the second reference impedance, and the load impedance, respectively; the control module connects the switch module; the control module connects the first reference impedance via controlling the switch module to obtain a first voltage value; the control module connects the second reference impedance via controlling the switch module to obtain a second voltage value; the control module connects the load impedance via controlling the switch module to obtain a load voltage value; and the control module calculates the measured value of the load impedance according to the first voltage value, the second voltage value, and the load voltage value.