Abstract: According to one embodiment of a system for measuring a load impedance, comprising: a switch module, a first reference impedance, a second reference impedance, and a control module, wherein the switch module connects the first reference impedance, the second reference impedance, and the load impedance, respectively; the control module connects the switch module; the control module connects the first reference impedance via controlling the switch module to obtain a first voltage value; the control module connects the second reference impedance via controlling the switch module to obtain a second voltage value; the control module connects the load impedance via controlling the switch module to obtain a load voltage value; and the control module calculates the measured value of the load impedance according to the first voltage value, the second voltage value, and the load voltage value.

Abstract: A magnetic passive component and a method for manufacturing the same are provided. The magnetic passive component comprises a magnetic core, a metal-wire-layer winding around the surface of the magnetic core, and an insulating layer provided between the magnetic core and the metal-wire-layer. The material of the insulating layer is a kind of insulating material containing additive of metal ions. To form the metal-wire layer, a trace of metal-wire layer should be made first in the surface of the insulating layer by laser activation and then adopt electroplating process to form the metal-wire layer so as to finally form a metal winding wire on a surface of the magnetic core. The magnetic passive component and the method for manufacturing the same disclose here can realize a simple process, a low manufacturing cost, an automatic manufacturing and a stable and reliable quality.

Abstract: A power-supply expansion system includes a primary power-supply unit for providing a main power supply, a secondary power-supply unit for providing an auxiliary power supply, a power unit having a first and a second input terminal and an output terminal, and a control unit connected to the primary and the secondary power-supply unit. The control unit, based on a load value of the primary power-supply unit, selectively performs a power-supply expansion process for the secondary power-supply unit to feed the auxiliary power supply to the second input terminal. In the power-supply expansion process, the first input terminal receives the main power supply and the second input terminal receives the auxiliary power supply, and the power unit integrates the main and the auxiliary power supply into an output power supply, which is output via the output terminal. A power-supply expansion method applicable to the power-supply expansion system is also disclosed.

Abstract: An antireflection structure is provided. The antireflection structure includes a substrate layer having a substrate refractive index; a first inorganic layer disposed on the substrate layer and having a first refractive index different from the substrate refractive index, where a thickness of the first inorganic layer is in a range of 1 to 40 nm; and a second inorganic layer disposed on the first inorganic layer and having a second refractive index different from the first refractive index.

Abstract: A multimedia processing system is provided for communicating among a baseband module, an image sensor module, and at least one display module in a mobile phone. The system comprises: a serial baseband interface that transmits and receives processing data from the baseband module; an image sensor interface that transmits and receives image data from the image sensor module; a display interface that transmits and receives display data from the display module, wherein the display interface comprises a display write enable output, a display read enable output, and a display transceiver means to transmit and receive the display data; and at least one register that includes a clock phase control bit, a clock polarity control bit for assisting the serial baseband interface to accommodate different interface standards, and a burst read mode control bit for bursting the serial baseband interface to read sequential processing data from a multimedia module or from the baseband module.

Abstract: A multimedia processing system is provided for communicating among a baseband module, an image sensor module, and at least one display module in a mobile phone. The system comprises: a serial baseband interface that transmits and receives processing data from the baseband module; an image sensor interface that transmits and receives image data from the image sensor module; a display interface that transmits and receives display data from the display module, wherein the display interface comprises a display write enable output, a display read enable output, and a display transceiver means to transmit and receive the display data; and at least one register that includes a clock phase control bit, a clock polarity control bit for assisting the serial baseband interface to accommodate different interface standards, and a burst read mode control bit for bursting the serial baseband interface to read sequential processing data from a multimedia module or from the baseband module.

Abstract: The present invention discloses a multimedia processing system for communicating data among a baseband module, an image sensor module, and at least one display module in a wireless mobile phone. The multimedia processing system further comprises a serial baseband interface, an image sensor interface, and a display interface which transmits and receives different kinds of data, including processing data, image data and display data, among each others. Several hardware implementations for the serial interface, including a serial peripheral interface and a universal asynchronous receiver and transmitter interface, are disclosed according to certain embodiments of the invention. Moreover, another embodiment comprises a bypass mechanism which bypasses signals to other components because under certain circumstances it is reasonable to bypass incoming data signals directly from one device to another.

Abstract: A power-supply expansion system includes a primary power-supply unit for providing a main power supply, a secondary power-supply unit for providing an auxiliary power supply, a power unit having a first and a second input terminal and an output terminal, and a control unit connected to the primary and the secondary power-supply unit. The control unit, based on a load value of the primary power-supply unit, selectively performs a power-supply expansion process for the secondary power-supply unit to feed the auxiliary power supply to the second input terminal. In the power-supply expansion process, the first input terminal receives the main power supply and the second input terminal receives the auxiliary power supply, and the power unit integrates the main and the auxiliary power supply into an output power supply, which is output via the output terminal. A power-supply expansion method applicable to the power-supply expansion system is also disclosed.

Abstract: A reflective film is provided. The reflective film includes a substrate; a middle layer disposed on the substrate and mainly having a crystallized transition metal; and a metal layer disposed on the middle layer.

Abstract: An antireflection structure is provided. The antireflection structure includes a substrate layer having a substrate refractive index; a first inorganic layer disposed on the substrate layer and having a first refractive index different from the substrate refractive index, where a thickness of the first inorganic layer is in a range of 1 to 40 nm; and a second inorganic layer disposed on the first inorganic layer and having a second refractive index different from the first refractive index.

Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having a vertical sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.

Abstract: A manufacturing method for a far-infrared irradiating substrate is provided. The manufacturing method comprises steps of providing a substrate, providing a far-infrared irradiating material and evaporating the far-infrared irradiating material to form a thin film onto the substrate. The far-infrared irradiating substrate provided by the present invention not only has a high emission coefficient of far-infrared ray, but also do not cause a potential exposure of an ionizing radiation.

Abstract: A manufacturing method for a far-infrared (FIR) substrate is provided. The manufacturing method includes steps of providing a substrate and sputtering a FIR emission material onto at least one surface of the substrate to form a thin film.

Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having an inclined sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.

Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having a vertical sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.

Abstract: The present invention discloses a multimedia processing system for communicating data among a baseband module, an image sensor module, and at least one display module in a wireless mobile phone. The multimedia processing system further comprises a serial baseband interface, an image sensor interface, and a display interface which transmits and receives different kinds of data, including processing data, image data and display data, among each others. Several hardware implementations for the serial interface, including a serial peripheral interface and a universal asynchronous receiver and transmitter interface, are disclosed according to certain embodiments of the invention. Moreover, another embodiment comprises a bypass mechanism which bypasses signals to other components because under certain circumstances it is reasonable to bypass incoming data signals directly from one device to another.

Abstract: A micro sample heating apparatus has a substrate, a micro heating device disposed on a first surface of the substrate, a cavity having an inclined sidewall and corresponding to the micro heating device positioned in a second surface of the substrate, and an isolation structure positioned on the second surface of the substrate. The isolation structure has an opening corresponding to the cavity, and the cavity and the opening form a sample room.

Abstract: A substrate is provided. The substrate includes a plurality of devices disposed in the substrate, a plurality of contact pads disposed on a surface of the substrate and electrically connected to the devices, and a surface dielectric layer positioned on the surface of the substrate. Thereafter, a surface treatment process including at least a plasma etching process is performed. Subsequently, at least a plasma enhanced chemical vapor deposition (PECVD) process is performed to form a dielectric layer on a surface dielectric layer. The PECVD process is performed in a high frequency/low frequency alternating manner. Following that, a masking pattern on the dielectric layer is formed, and an anisotropic etching process is carried out to form a plurality of openings corresponding to the contact pads in the dielectric layer. The openings expose the contact pads, and each opening has an outwardly-inclined sidewall.

Abstract: The chip-type micro-connector includes a package substrate, a micro-connector disposed on the package structure, a plurality of chips, and a cap layer disposed on the micro-connector and the chips. The micro-connector includes a connection substrate, a plurality of connecting wires disposed in the connection substrate, and a plurality of contact pads exposed on a surface of the connection substrate and respectively connected to each connecting wire. The chips are coupled to one another via the contact pads and the connecting wires. The cap layer packages the micro-connector and the chips on the package substrate.

Abstract: The chip-type micro-connector includes a package substrate, a micro-connector disposed on the package structure, a plurality of chips, and a cap layer disposed on the micro-connector and the chips. The micro-connector includes a connection substrate, a plurality of connecting wires disposed in the connection substrate, and a plurality of contact pads exposed on a surface of the connection substrate and respectively connected to each connecting wire. The chips are coupled to one another via the contact pads and the connecting wires. The cap layer packages the micro-connector and the chips on the package substrate.